KAIJO FB-x26 waea hono

Ko te KAIJO FB-x26 he mīhini here waea wera-ultrasonic tino tika, whānui te horahanga, mai i KAIJO Hapani. He mea hanga matua mō ngā waeine mana-teitei, ngā hikohiko motuka, ngā IC nui, me ngā tono here waea tawhiti. Ko ōna painga matua ko te horahanga here tuaka-Y tino nui 95mm, he ringa-Z pakari teitei, he mama, he iti te pēhanga pānga, me te pumau o te pewa roa. Ka taea hoki te tango tika ki roto i te mīhini patu wafer FB-x26 BUMP, ka waiho hei taputapu matua mō te hiko me te takai matatau.

I. Te Tūnga me ngā Taupānga Matua

Te Tūnga: Mīhini here/here poro poro-irahiko wera-orohiko aunoa katoa, he whānui te horahanga, he roa te pewa, he tauira tino tika.

Ngā tono noa:

Ngā Kaiārahi Mana: Ngā IGBT, ngā MOSFET, ngā kōwae mana SiC/GaN (ngā taura roa, anga nui).

Ngā Hikohiko Aunoa: Ngā MCU Aunoa, ngā IC whakahaere hiko, ngā takai rama/pūoko aunoa.

Ngā IC Nui: Mahara, Ngā SoC, Ngā ASIC maha-pine (te whānui o te anga tae atu ki te 105mm).

Mōkihi Matatau: Puku Whakapūmau, Whakatakoto Maramara Maha, Āwhata Tawhiti (tae atu ki te 12mm).

Ngā Waea Hototahi: Waea koura (Φ15–30μm), Waea parahi (Φ20–30μm), Waea koranu hiriwa (whiringa).

II. Ngā Whakatakotoranga Matua (Whirihoranga Matua 2026)

Rohe Hononga: 56mm (X) × 95mm (Y); Whānui anga mōrahi 105mm.

Rohe Mahi: 295mm × 105mm (mō ngā papa/tirei nui).

Tere Hononga: Noa 0.045–0.055 hēkona/raina (1090–1333 rārangi/min).

Te āheinga ki te tāruarua: ±2.5μm (3σ); Ko te mokowā papa iti rawa he 35μm.

Te Roa o te Raina/Teitei o te Āwhata: Te roa mōrahi o te raina 12mm; Teitei o te Āwhata 0.5–5mm (ka taea te whakahaere). Ngā tikanga whakarewa: Te here pōro thermo-sound/te here wedge; te ultrasonic auau-rua (paerewa).

Ngā Ahu o te Tinana (Wh×D×T): Tata ki te 1200×800×1600mm; Taumaha tata ki te 850kg.

III. Hanganga me ngā Hangarau Matua

1. Pane whakarewa mama, pakari, (te tino kaupapa hokohoko)

Ringa tākai rauemi hiato: He pakari teitei + he iti te ātete, he iti te wiri i te wā e neke ana i te tere teitei, he 40% te whakapainga o te pumau o te pewa roa.

Momo 1701 ultra-miniture resonator: Putanga pumau, iti te nekehanga wera, hototahi ki ngā waea koranu parahi/hiriwa, te whakarewanga pēhanga iti (≤1.5N), e tiaki ana i ngā maramara angiangi/ngā papa pakarukaru.

Te kimi whakapā tere-teitei: Te urupare pēhanga wā-tūturu, te tika o te whakahaere pēhanga hononga ±0.1N, te whakaiti i te mōrearea o te pakaru maramara.

2. Pūnaha tirohanga kanohi-α

Rautaki mō te whakatipuranga e whai ake nei: Ārai-whakaata, ārai-rerekētanga tae, tika mō te mōhio ±1μm, tere mōhio iti-rerekētanga/paru o te papa ≥99.9%.

Te ako maha-tauira: Ka tautoko i ngā pine uaua, ngā papa āhua koretake, me ngā rarangi matotoru, ka whakatika aunoa i te taupatupatu/hurihuri.

3. Raupapa Herenga Hipanga (Hononga Hipanga-i-te-Hipanga Ataata): Whakaaturanga tawhā tukanga-katoa: Mana ultrasonic whakarerekētanga wāhanga, pēhanga, wā, me te pāmahana hei whakahaere tika i te diameter pōro, te whānui poro, me te āhua pewa waea.

Whare pukapuka tukanga pewa roa/teitei motuhake: He hononga waea pumau i ngā tawhiti tino roa o te 10–12mm, me te kore e hinga/whati te waea.

4. Aunoatanga me te Hononga: Te uta me te tango aunoa: ngā pouaka rauemi 25-wahi × 2, te miro waea aunoa, te horoi pine aunoa, me te horoi capillary aunoa.

Ngā āhuatanga paerewa o te Ahumahi 4.0: SECS/GEM, KISS (Pūnaha Whakahaere Taputapu KAIJO), te aroturukitanga wā-tūturu, te whai i ngā mate, me te tātaritanga mamao.

Atanga pā Windows 10: mata nui 15-inihi, mahi e hangai ana ki ngā ata, maumahara tawhā pāwhiri-kotahi, tatauranga hua, me ngā whakaoho rerekētanga.

IV. Raupapa Whakaputa FB-x26 BUMP

FB-x26 BUMP1: Te patupatu wafer 6-inihi tino aunoa (Stud Bump), te uta me te tango aunoa, te teitei o te patupatu 5–50μm, te tika ±1μm.

FB-x26 BUMP2/BUMP3: Te patupatu wafer 8-inihi ā-haurua-aunoa, e hototahi ana ki ngā takai matatau (WLCSP, Fan-out).

V. Whakataurite Painga (vs. Mīhini Whānui Matua FB-e20N)

Rohe Whakapiripiri: x26 95mm (Y) vs e20N 80mm (Y) → He pai ake mō ngā anga nui/ngā pewa roa.

Upoko Tūhono: x26 he pakari teitei, he mama hoki + he iti te pānga ki te e20N paerewa pakari → He pumau ake mō ngā maramara angiangi/ngā wae mana.

Roa Waea: x26 12mm vs e20N 8mm → Ko te kōwhiringa anake mō te here waea tawhiti.

Tika: x26 ±2.5μm vs e20N ±3.0μm → Hua teitei ake.

Tere: he puhoi ake te x26 (he pai mō ngā pewa roa) ki te tere ake o te e20N (mō te whakaputa papatipu pewa poto).

VI. Whakarāpopototanga me ngā Taunakitanga Kōwhiringa

Ngā Uara Matua: He whānui te horahanga, he roa te pewa, he iti te pānga, he tino tika, e whakaoti ana i ngā uauatanga o te herea waea i roto i ngā waeine hiko/IC nui, he hua ≥99.5%.

Ngā Taunakitanga Kōwhiringa:

Ngā waeine hiko, ngā hikohiko motuka, te hononga waea tawhiti → FB-x26

Te pupuhi o te wafer 6–8 inihi → FB-x26 BUMP1/2/3

Te whakaputanga papatipu poto-pewa tere-teitei (ngā LED/ngā taputapu motuhake) → Kōwhiria te FB-e20N