Uburyo bwo gutunganya no gushushanya bwa ACM Research ULTRA ECP app-p

ULTRA ECP app-p ya ACM Research ni sisitemu yo gushyiramo ibyuma mu buryo butambitse ku rwego rwa panel, itandukaniye ku gaciro kayo k'ingenzi: kuzuza icyuho cy'ingenzi mu mikorere mu nganda za Fan-Out Panel-Level Packaging (FOPLP).

Nk’uburyo bwa mbere bwo gushyiramo umuringa mu bucuruzi, bukorerwa ku isoko rinini, bugamije koroshya impinduka nziza mu gupakira kuva ku rwego rwa 300mm wafer kugera ku rwego rwa panel ruhendutse. Ikoresheje ikoranabuhanga ryayo ryo gushyiramo ibyuma mu buryo butambitse, uburyo budasanzwe bwo guhuza, no gucunga neza panel zagonganye, iyi sisitemu igera ku musaruro uhwanye n’uwo gutunganya ibyuma bya wafer, bityo igahura n’ibikenewe cyane mu gukora ibikoresho bishya nka AI GPU na HBM zifite ubucucike bwinshi.

Ibi bikurikira ni incamake yuzuye ya ULTRA ECP app-p, yakusanyijwe hashingiwe ku makuru aboneka ku mugaragaro:

**Gushyira ibikoresho**

**Urutonde rw'ibicuruzwa:** Icyitegererezo cy'urwego rw'ibice (ap-p) muri platform ya ULTRA ECP (Electrochemical Plating).

**Ishimwe ry'Inganda:** Uwahawe Igihembo cya 2025 "3D InCites Technology Enabling Award."

**Ikoranabuhanga ry'ingenzi n'ibiranga**

Ibintu by'ingenzi mu bya tekiniki bya ULTRA ECP app-p ni ibi bikurikira:

**Igishushanyo mbonera cy’imashini zitunganya ibyuma:** Gikoresha ikoranabuhanga rya ACM ryo gushushanya ibyuma bitagira ingano—bitandukanye n’imashini zitunganya ibyuma zisanzwe—bituma ibyuma bitunganya ibyuma bingana neza mu buryo butangaje mu gice cyose cy’imashini binyuze mu kuzunguruka kw’imashini n’amashanyarazi azenguruka. Ubu buryo kandi bugabanya neza kwanduzwa n’ibinyabutabire hagati y’imashini zitunganya ibyuma; byongeye kandi, igishushanyo mbonera cy’imashini zitunganya ibyuma byoroshya kubungabunga ibyuma bya buri cyumba, bityo bikanongera imikorere myiza y’ibikoresho muri rusange.

**Ibikoresho Byujuje Ubuziranenge:** Bifite agace k'icyuma gafunganye gafite impande enye, kanongera ubwizerwe n'isuku mu mikoreshereze ya wafer/panel. Akazu ko gushyiramo umuringa gafite udupira two gushyiramo ibyuma twihuta cyane twagenewe gukoreshwa mu gukurura cyane, bigatuma habaho uduce duto turenga mikoroni 300 z'uburebure.

**Inkunga y'ibyuma byinshi no kugenzura ihumana ry'ibintu:** Itanga ubushobozi bwo gutunganya ibikoresho bitandukanye by'ibyuma—harimo umuringa, nikeli, tini-ifeza, na zahabu—mu gihe ikoresha imirimo yo gusukura mu cyumba kugira ngo igabanye ihumana ry'ibintu bitandukanye hagati y'ubwiherero butandukanye bw'ibyuma.

**Kuba hamwe no gukora imashini zikora:** Ishyigikira ibintu by’umwimerere ndetse n’ibirahuri. Sisitemu yayo yo gukora imashini ikora ikoresheje uburyo bwa “automation” yakozwe neza cyane ku bikoresho binini—harimo n’ibikorwa by’ingenzi nko guhindura ibikoresho—igera ku rwego rwo kugenzura neza ibikorwa nk’ibipimo byashyizweho mu gutunganya ibikoresho ku rwego rwa “wafer”. Ibisobanuro birambuye

Hashingiwe ku makuru aboneka ku mugaragaro, ibipimo by'ingenzi ni ibi bikurikira:

Ingano y'urupapuro: Ifite ingano isanzwe ya 510mm x 515mm, ifite ubushobozi bwo kwagura kugeza kuri 600mm x 600mm.

Guhuza imikorere: Ishyigikira intambwe zo gushyiramo amashanyarazi mu bikorwa bitandukanye, harimo imiterere ya Pillar, Bump, na Redistribution Layer (RDL).

Imiterere y'ubushobozi: Ishobora gushyirwaho hamwe n'ibyumba 16 byo gushyiramo irangi, byuzuzwa n'ibyumba 2 byabanje gutoserwa n'ibyumba 2 byo gusukura kugira ngo habeho umusaruro mwiza.

Gucunga Warpage: Ifite ubushobozi bwo gutunganya neza panels zifite urwego rwa warpage rugera kuri 7mm (hafi 10mm), ubushobozi bw'ingenzi mu mikorere ihanitse yo gupakira.

Ibipimo by'Imikorere:

Ubumwe bw'Itsinda Risanzwe (WIWU): < 5% ((ntarengwa-iminota) / 2Ave.)

Ubumwe bw'Ingano mu Bihe Bisanzwe (WIDU): < 5% ((ntarengwa-iminota) / 2Ave.)

Gusubiramo: < 3%

Ahantu h'ingenzi ho Gushyira mu Bikorwa

Mbere na mbere yibanda ku bikorwa byo gupakira bya semiconductor bigezweho, harimo ariko bitagarukira kuri:

Pakingi yo mu rwego rwa Fan-Out Panel (FOPLP)

Gukora Pillar na Bump, ndetse no gukora Redistribution Layer (RDL)

Uburyo bwo kuzuza hakoreshejwe Silicone Via (TSV) na Through-Glass Via (TGV)

Ibicuruzwa bya High-Density Fan-Out (HDFO)

Isoko rihagaze n'ihiganwa

ULTRA ECP app-p ifite umwanya ukomeye mu isoko riri kuzamuka ry’ibikoresho byo gushushanya ku rwego rwa panel. Abakinnyi bayo b’ibanze ni inganda mpuzamahanga zikomeye zikora ibikoresho bya semiconductor—nk’ibikoresho byakoreshejwe na Lam Research—nazo zirimo gutegura ibisubizo byo gushushanya ku rwego rwa panel (PLP). Akamaro ka ACM gakomeye kari mu kuba ari yo ya mbere, kuko ari yo ya mbere yatanze ibikoresho byagurishijwe neza muri uru rwego.

Incamake

Muri make, ULTRA ECP app-p ya ACM Research ihagarariye ikoranabuhanga rireba imbere. Ntabwo ikora gusa nk'ikintu cy'ingenzi mu nganda zikora ibikoresho byo gupakira zigezweho kuva ku "wafers round" kugera ku "panels rectangular", ahubwo inatanga ibisubizo bishya byo kongera umusaruro no kugabanya ikiguzi cy'ibikoresho bya semiconductor byo mu rwego rwo hejuru, nka chips za AI.