What specific BESI (Datacon & Esec) die bonder configurations do you actively supply?

We supply and configure mainstream BESI platforms: BESI Datacon 2200 evo for multi-chip packaging, BESI Datacon 8800/8800 fc for sub-micron flip chip interconnects, and BESI Esec 2100 platforms for high-volume leadframe mass production.

How do you guarantee the sub-micron placement accuracy of a refurbished BESI 8800 or 2200 system?

Every pre-owned BESI system undergoes linear motor calibration, vision system adjustment, and multi-axis alignment. We perform live recipe dry runs with real substrates to match original factory tolerances before transit.

Do you supply custom Change Kits, pickup tools, and original spare parts for legacy BESI models?

Yes. We maintain a large inventory of consumables and spare parts, including pick-up collets, ejector needles, customized heating blocks, and board modules to support both current and discontinued BESI lines.

What specific BESI (Datacon & Esec) die bonder configurations do you actively supply?

We supply and configure mainstream BESI platforms: BESI Datacon 2200 evo for multi-chip packaging, BESI Datacon 8800/8800 fc for sub-micron flip chip interconnects, and BESI Esec 2100 platforms for high-volume leadframe mass production.

How do you guarantee the sub-micron placement accuracy of a refurbished BESI 8800 or 2200 system?

Every pre-owned BESI system undergoes linear motor calibration, vision system adjustment, and multi-axis alignment. We perform live recipe dry runs with real substrates to match original factory tolerances before transit.

Do you supply custom Change Kits, pickup tools, and original spare parts for legacy BESI models?

Yes. We maintain a large inventory of consumables and spare parts, including pick-up collets, ejector needles, customized heating blocks, and board modules to support both current and discontinued BESI lines.

Can your configured BESI die bonders support automotive-grade or specialized MEMS applications?

Absolutely. Depending on your packaging layouts—whether complex COB, RF modules, automotive optoelectronics, or delicate MEMS sensors—we customize the handling and process modules to protect sensitive components.

What is your typical delivery lead time, and how can we request a detailed technical quote?

In-stock BESI bonders require 2-4 weeks for testing and integration. Systems are vacuum-packed in ESD bags and wooden cases. Contact our team via WhatsApp with package drawings for a formal quotation.

BESI The Bonder

Imashini nshya za BESI die bonder zakoreshejwe kandi zavuguruwe zikoreshwa mu gutunganya LED, IC, MEMS, optoelectronics, power semiconductor ndetse no mu gukora imashini zigezweho. Dufasha abakiriya kubona imashini zikwiye vuba, kugabanya ibyago byo kugura no kugarura ubushobozi bwo gukora.

Reba ububiko hanyuma ubone igiciro → Reba Ibibazo by'Abakiriya →

Moderi zigoye kubona Gushyigikira umurage n'uburyo bwihutirwa bwo gushakisha ingwate muri BESI.

Ingaruka nke z'ishoramari Igenzura, isuzuma n'igenzura ry'uko ibintu bimeze mbere yo koherezwa.

Gushigikira Gushaka ibikoresho by'imashini, gutanga inama no gutanga ubufasha mu gukora ibikoresho.

10+ Uburambe bw'imyaka myinshi mu bikoresho bya semiconductor

30+ Ibihugu Bikorerwa Ku Isi Yose

3-7 Gutanga Ibiciro ku Isi Yose mu Munsi Wihuta

Amasaha 24 Inkunga yihuse yo gukusanya no guhuza icyitegererezo

Inzu y'ububiko ya BESI ihari

Imashini za BESI Die Bonder n'amahitamo yo gushakisha

Suzuma uburyo bwacu bwo gukora tekiniki mu buryo bwihuse bw’imbuga za BESI zometseho, zakoreshejwe, kandi zavuguruwe, harimo na Datacon na Esec series. Buri sisitemu ishobora gushyirwaho uburyo bwihariye hifashishijwe ibikoresho byabugenewe byo guhindura, module zo gupima icyerekezo, n'ibikoresho byo gutwara kugira ngo byinjizwe mu buryo butagorana mu gupakira kwawe.

Ntushobora kubona BESI Datacon cyangwa Esec model ukeneye? Twoherereze footprints zawe (BGA, QFN, LGA) n'ibisobanuro byo guhuza. Injeniyeri zacu zizahuza sisitemu nziza kandi zicunge ibikoresho byo kohereza ibicuruzwa ku isi yose.

Datacon 8800 CHAMEO Advanced Die Bonder

Besi Datacon 8800 CHAMEO Advanced ni bond yo mu bwoko bwa die bond yo mu gisekuru gishya ikoreshwa mu buryo buhanitse yagenewe semiconductor igezweho...
Reba Imigabane n'Ibiciro
Imashini yo gufunga ibyuma ya Besi Datacon 8800 FC QUANTUM Advanced Die Bonding Machine

Besi Datacon 8800 FC QUANTUM Advanced ni imodoka yo mu bwoko bwa die bonder ifite ubushobozi bwo hejuru cyane, yagenewe by'umwihariko imodoka...
Reba Imigabane n'Ibiciro
BESI Datacon 2200 EVO ipfa imashini ihuza

BESI Datacon 2200EVO ni sisitemu yo gushyiramo chips mu buryo bwikora, ifite ubushobozi bwo gukora neza cyane, ikoreshwa mu buryo bwa semico...
Reba Imigabane n'Ibiciro
BESI ESEC 2100 hS BESI Gupfa Bonder

ESEC 2100 hS die bonder ni urubuga ruzwi cyane rwa die bonder rwihuta cyane ruturuka muri BESI.
Reba Imigabane n'Ibiciro
imashini ibumba besi ams-x

Imashini ya AMS-X ya BESI ni imashini igezweho ya servo hydraulic imashini ifite ibyiza byinshi nibiranga
Reba Imigabane n'Ibiciro
imashini ibumba MMS-X

Imashini ya BESI yitwa MMS-X mold ni verisiyo y'intoki ya AMS-X mold. Ikoresha icyuma gishya cyakozwe mu buryo bwa plate press...
Reba Imigabane n'Ibiciro
Icyuma Gupfa Imashini Ihuza Datacon 8800

Besi Datacon 8800 ni imashini igezweho yo guhuza chips, ikoreshwa cyane cyane mu ikoranabuhanga rya 2.5D na 3D, cyane cyane TSV ...
Reba Imigabane n'Ibiciro

IBIBAZO BY'UBUBABARE BW'UMUKIRIYA

Ibibazo Bikunze Kubaho Mu Gugura BESI Die Bonders

Abaguzi benshi ntibaba bashaka imashini gusa, ahubwo bakeneye umusaruro uhoraho, igihe gito cyo kuyigura, ingaruka nke n'ubufasha bwizewe nyuma yo kuyigura.

Igihe kirekire cyo kubona ibikoresho bishya

Gahunda nyinshi zo gukora ntizishobora gutegereza amezi menshi kugira ngo haboneke imashini nshya. Abakiriya bakeneye amasoko yihuse yo kongera ubushobozi cyangwa gusimbuza.

Moderi za kera zigoye kubona

Imirongo ishaje ikoreshwa mu gukora ikenera ubwoko bwa BESI bujyanye, ariko imiterere yahagaritswe cyangwa imiterere yihariye biragoye kuyibona ku isoko.

Igiciro Gihanitse cy'Ibikoresho Bishya

Ibikoresho bishya byo gupakira ibikoresho bya semiconductor bisaba ishoramari rihanitse. BESI die bonds zakoreshejwe cyangwa zavuguruwe zishobora gufasha kugabanya ingengo y'imari y'ibikoresho.

Imiterere y'imashini yakoreshejwe idasobanutse neza

Abaguzi bahangayikishijwe n'ibibazo byihishe nko kwangirika kw'umurongo, ibibazo byo kureba, amakosa ya porogaramu, ibice bibura n'uburyo bwo guhuza ibintu bidahindagurika.

Kutagira ubufasha bwa tekiniki

Abatanga serivisi bamwe bagurisha imashini gusa ariko ntibashobora gushyigikira guhitamo icyitegererezo, kugenzura, gushakisha ibice cyangwa guhuza umusaruro.

Igitutu cy'igihe cyo kuruhuka kw'umusaruro

Iyo ingwate y'agateganyo inaniwe, buri munsi w'igihe cyo kuruhuka ushobora kugira ingaruka ku ngengabihe yo kohereza ibicuruzwa, ibyo abakiriya batumije ndetse n'ikiguzi cyo kubitunganya.

Guhuza abantu Gushyira neza aho gupakira ibintu bya semiconductor

ICYO DUKEMURA

Si Umucuruzi w'Imashini Gusa — Umufatanyabikorwa mu Gukemura Ibikoresho Bihuza Ingufu

GEEKVALUE ifasha abakora ibikoresho bya semiconductor kubona imigozi ikwiye ya BESI hashingiwe ku byo imashini ikeneye gukora, imiterere yayo, ingengo y'imari n'igihe cyo kuyitanga.

Twibanda ku gukemura ibibazo nyabyo byo kugura: niba icyitegererezo gikwiriye, niba imiterere y'imashini igaragara, niba ibice byayo n'ubufasha bwa tekiniki bihari, ndetse niba ibikoresho bishobora gushyigikira umusaruro nyuma yo kuhagera.

Guhuza Modeli Saba ubwoko bukwiye bwa BESI die bonder hashingiwe ku bwoko bw'ipaki n'ibikenewe mu buryo bwo kuyitunganya.

Igenzura ry'imashini Reba sisitemu z'ingenzi mbere yo kohereza kugira ngo ugabanye ibyago byo kugura ibintu bihishe.

Inkunga y'Ibice Fasha gushaka ibikoresho by'ingenzi byo kubungabunga no gukora mu gihe kirekire.

Gutanga ku Isi Gupakira ibicuruzwa byoherezwa mu mahanga no gushyigikira ubwikorezi mpuzamahanga bw'ibikoresho bya semiconductor.

KUKI TWAHITAMO

Impamvu abakiriya bagura BESI Die Bonders muri GEEKVALUE

Twubaka urupapuro rushingiye ku ngaruka z'abakiriya, ntabwo ari amagambo y'ubusa. Intego ni ukwereka abaguzi ko ibibazo byabo nyakuri bishobora gukemurwa.

Gushakisha Imigabane Byihuse

Dufasha abakiriya kubona imigozi ya BESI ihari vuba, cyane cyane iyo bayisimbuye byihutirwa, imigozi ya kera n'imideli yahagaritswe.

Igenzura Mbere yo Kohereza

Mbere yo kohereza hanze, tugenzura imiterere y'imashini, uko ikoresha umuriro uhagaze, uburyo bwo kugenda, uburyo bwo kureba, porogaramu n'imikorere y'ingenzi.

Amahitamo Ahendutse

Imigozi ya BESI die bonds yakoreshejwe kandi ivuguruye ifasha abakiriya kugabanya ishoramari mu bikoresho mu gihe ikomeza ubushobozi bwo kuyikora.

Ubujyanama mu bya tekiniki

Dushyigikira guhitamo icyitegererezo, guhuza inzira n'ibiganiro ku miterere y'imashini mbere yo kugura.

Inkunga y'Ibikoresho Bisimbura

Ku bwoko bwa BESI die bonder bwa kera, kuboneka kw'ibice bisimbura ni ingenzi cyane. Dufasha abakiriya gushaka ibice no kugabanya ibyago byo kudakora.

Gupakira no Kohereza mu mahanga

Ibikoresho bya semiconductor bisaba gupakira neza, ibikoresho bihamye no kubikoresha neza kugira ngo bigerweho ku rwego mpuzamahanga.

IBISABWA

Porogaramu ya BESI Gupfa Bonders

BESI die bonders ikoreshwa cyane mu guteranya semiconductor, gupakira ku buryo bugezweho no mu buryo bwo gushyiramo die attachment bunoze cyane.

Ihuriro rya LED Die Ku bijyanye no gupfunyika kwa LED, gushyiramo vuba cyane no gutanga umusaruro uhamye.

Pakingi ya IC Uburyo bwo gufunga imiyoboro y'amashanyarazi n'imirongo yo gupakiramo.

Gupakira MEMS Ikoreshwa mu byuma bipima, ibikoresho bito n'ibikoresho by'ikoranabuhanga bigezweho.

Ikoranabuhanga rya Optoelectronics Inkunga ku bice by'izuba, fotoniki na microelectronics zigezweho.

Ingufu zikoresha semiconductor Ikwiriye modules z'amashanyarazi, ibikoresho by'ikoranabuhanga by'imodoka n'ibikoresho byizewe cyane.

Ibikoresho bya RF Uburyo bwo gufunga neza (Precision die attach) kuri module za RF n'ibice by'itumanaho.

Gupakira COB Gupakira chip-onboard kuri modules za elegitoroniki n'ibikoresho byihariye.

Gupakira mu buryo bugezweho Ku bijyanye no gupakira ibintu bya semiconductor bigoye no gukora imirongo y'agaciro kanini.

AMABWIRIZA YO KUGENZURA

Uburyo Tugabanya Ingaruka Mbere yo Kohereza

Ibikoresho bya semiconductor byakoreshejwe bigomba kugenzurwa neza mbere yo kugura. Uburyo bwacu bwo kugenzura bufasha abakiriya gusobanukirwa imiterere y'imashini no kugabanya ibibazo bitunguranye nyuma yo kuyitanga.

Igenzura ry'amaso

Genzura imiterere y'inyuma, isuku, imiterere y'imashini, ibifuniko, amapaneri n'insinga.

Ikizamini cyo gukoresha imbaraga

Genzura uburyo sisitemu itangira gukora, kwerekana, uburyo bwo kugenzura n'uburyo sisitemu ikora.

Igenzura rya sisitemu yo kugenda

Genzura uko uruziga rugenda, imiterere y'ikibuga, uburyo imikorere ihagaze n'urusaku rudasanzwe.

Igenzura rya Sisitemu yo Kubona

Genzura kamera, urumuri, imiterere n'uko amashusho agaragara.

Igenzura ry'imikorere yo guhuza

Suzuma umutwe w'ubuhuza, uburyo bwo gushyiramo ibintu neza, uburyo bwo gusohora umwuka, ubushyuhe n'ibindi bijyanye n'imikorere.

Igenzura rya Porogaramu

Emeza imikorere ya porogaramu, uburyo bwo kuyikoresha, amateka y'impamyabumenyi n'imikorere yo kuyigenzura.

AMAHITAMO YO GUTANGA IBICURUZWA

Amahitamo mashya, yakoreshejwe kandi yavuguruwe ya BESI Die Bonder

Abakiriya batandukanye bafite ingengo y'imari itandukanye, ibyo batanga n'ibyo basabwa mu gukora. Turabafasha kugereranya uburyo bwiza bwo kugura.

BESI nshya The Bonder

Bikwiriye guteganya umurongo mushya w'umusaruro no kwagura ubushobozi bw'igihe kirekire.

Imiterere mishya n'igenamigambi ry'igihe kirekire
Ni byiza ku mishinga ihamye yo gukora umusaruro mwinshi
Ikiguzi cy'ishoramari kiri hejuru
Igihe kirekire cyo gusaba ubufasha gishobora gukenerwa

BESI Die Bonder yakoreshejwe

Bikwiriye gusimburwa byihutirwa, imiyoboro y'ibikorwa bya kera ndetse no kugenzura ingengo y'imari.

Ishoramari riciriritse ry'ibikoresho
Gutanga vuba iyo ububiko buhari
Ni byiza cyane mu kongera ubushobozi bwihuse
Imiterere y'imashini igomba kugenzurwa neza

BESI Die Bonder yavuguruwe

Uburyo buringaniye ku bakiriya bakeneye ibiciro biri hasi no kwitegura neza imashini.

Igisubizo cy'umusaruro gihendutse
Igenzura n'isana mbere yo kohereza
Kugenzura ingaruka nziza kuruta ibikoresho bitazwi byakoreshejwe
Bikwiriye kwagura umusaruro

Modeli zikunzwe cyane

Modeli zakunzwe cyane za BESI Die Bonder dushobora gufasha

Kuboneka kwabyo bihora bihinduka. Twandikire kugira ngo urebe ububiko bwa BESI die bonder, imiterere yabwo n'igihe cyo kubitanga.

BESI Datacon 2200 evo Urubuga ruzwi cyane rw'imigozi yo gupakira ibikoresho bya semiconductor.

IRON Datacon 8800 Uburyo bugezweho bwo gufunga ibintu mu buryo bwo gupfunyika bufite agaciro kanini.

BESI Datacon 2200 ku mugoroba Ikoreshwa mu bikorwa bitandukanye byo gupfunyika no gupakira.

BESI Datacon 8800 fc Bikwiriye gukoreshwa mu gupfunyika no mu buryo bugezweho bwo gupfunyika.

Eagle y'icyuma Ikoreshwa mu guteranya ibyuma byihuta cyane no guteranya ibikoresho bya semiconductor bigezweho.

Sisitemu za BESI zifite module nyinshi Sisitemu zoroshye zo gukora ibintu bigoye no gupakira ibintu mu buryo busanzwe.

Modeli za LED Die Bonder Inkunga yo guhuza icyitegererezo n'ibikenewe mu gukora amapaki ya LED.

Modeli za BESI zizwi cyane Gushaka inkunga y'ibikoresho byabugenewe byahagaritse cyangwa bigoye kubibona.

IBICE N'INKUNGA

Inkunga ntihagarara nyuma yo kubona ibikoresho

Ku nganda zikora ibikoresho bya semiconductor, kuboneka kw'ibikoresho mu gihe kirekire ni ingenzi kuruta kugura rimwe gusa.

Inkunga y'ibice bya BESI Die Bonder

Ibikoresho bisimbura ibindi ni ingenzi cyane ku bikoresho byakoreshejwe kandi bya kera bya BESI. Dufasha abakiriya kubona ibikoresho by'ingenzi kugira ngo tugabanye ibyago byo kudakora.

Ibice bifitanye isano na kamera n'amaso
Ibice bifitanye isano n'umutwe n'ingendo bihuza
Ibice bifitanye isano n'ibikoresho byo mu bwoko bwa vacuum n'ibishyushya
Ibibaho by'ikoranabuhanga n'ibikoresho byo kugenzura
Ibikoresho bikoreshwa n'ibikoresho bisanzwe byo kubungabunga

Ubujyanama mu bya tekiniki

Mbere yo kugura, dufasha abakiriya gusobanura ibisabwa mu buryo bwo gukora no kwirinda kugura imiterere mibi.

Guhitamo icyitegererezo hashingiwe ku buryo bwo gukora
Isuzuma ry'imiterere y'imashini zakoreshejwe
Igenamiterere n'ihuzwa rya porogaramu
Inkunga yo gupakira no kohereza ibicuruzwa mu mahanga
Itumanaho rya kure ku bibazo bya tekiniki

Ubumenyi mu bijyanye no gushakisha amasoko

BESI Gupfa Bonder Sourcing & Ibibazo byo Kwishyira hamwe

Ibisubizo by'inzobere mu by'ubwubatsi ku bijyanye n'imiterere ya platform ya BESI (Datacon/Esec), gupima sub-micron, n'uburyo ibice bya turnkey biboneka.

Ni izihe configurations za BESI (Datacon & Esec) die bonder utanga ku buryo bufatika?

Dutanga, tuvugurura, kandi tugashyiraho porogaramu za BESI zigezweho kandi zinoze. Ku bijyanye no guhuza ama-chip menshi, flip chip igezweho, hamwe no gutanga epoxy/eutectic dispensing ihindagurika, turasaba koBESI Datacon 2200 evo na apm ikurikiranaKu bijyanye no kwihanganira sub-micron neza cyane na TCB (Thermo-Compression Bonding), dufite ububiko bwaBESI Datacon 8800 na 8800 fc ikurikiranaKu bijyanye no gucunga imiterere y'amakuru mu buryo bwikora, dutanga uburyo bwoBESI Esec 2100 series na Eagle platforms, byakozwe hifashishijwe ibikoresho byihariye byo gutwara kugira ngo ushyigikire intego zawe za OEE.

Ni gute wakwemeza ko sisitemu ya BESI 8800 cyangwa 2200 yavuguruwe ishyirwamo neza?

Buri porogaramu ya BESI yari isanzwe ikoreshwa inyura mu nzira yo kugenzura imiterere y’ibikoresho byinshi. Abatekinisiye bacu bo gupakira bakora igenzura ry’uburyo bwo gupima moteri, guhuza sisitemu yo kureba ibintu byinshi, no kugenzura uko ibintu bihora bigenda. Mbere yo gupakira ibicuruzwa byoherejwe mu mahanga, dukora igenzura ry’uburyo bwo gutoranya no gushyira ibintu mu mwanya w’ibikoresho by’ikoranabuhanga dukoresheje uburyo busanzwe bwo gupima no gushyira ibintu mu mwanya w’ibikoresho kugira ngo sisitemu ikomeze neza ibisabwa n’uruganda, kandi itange raporo z’igenzura ry’amashusho ku itsinda ryanyu ry’abahanga.

Ese mutanga ibikoresho bya Change Kits byihariye, ibikoresho byo gutwara ibintu, n'ibikoresho by'umwimerere bya moderi za BESI zishaje?

Yego. Kugabanya igihe cyo kudakora k'umurongo mu gihe cyo guhindura ingano ya chip ni cyo kintu twibandaho cyane. Dufite urutonde runini rw'ibikoresho byo mu bubiko by'ibikoresho n'ibikoresho byo guhindura ibikoresho byihariye bihuye na sisitemu za BESI. Ibi birimo ibikoresho byihariye byo gupima, inshinge zo gusohora, ibikoresho byo gushyushya byihariye, ibikoresho byo gusohora ibikoresho, na module zo kugenzura imashini. Twemeza ko n'imirongo ya BESI yahagaritswe cyangwa iy'igihe kirekire ihabwa inkunga y'ibikoresho byo gusohora ibikoresho.

Ese imigozi yawe ya BESI die bonds ishobora gushyigikira porogaramu za MEMS zo mu rwego rw'imodoka cyangwa izihariye?

Yego rwose. Bitewe n'imiterere y'ibikoresho byawe byo gupakira—byaba birimo Chip-on-Board (COB), module za RF, optoelectronics z'imodoka, cyangwa sensors zoroshye za MEMS—duhindura modules z'uburyo imashini ya BESI ikoresha kandi igatunganya. Duhuza valves zitanga, amasomero yo kumenya icyerekezo, n'uburyo bwo kugenzura imbaraga z'umugozi kugira ngo dukore ibice by'umubiri bidacitsemo ibice cyangwa inenge z'imiterere.

Igihe usanzwe utanga ibicuruzwa ni ikihe, kandi ni gute twasaba ibiciro birambuye bya tekiniki?

Ku bikoresho bya BESI die bonders biri mu bubiko, gutegura bisanzwe, gupima porogaramu, no guhuza ibikoresho byihariye bisaba ibyumweru 2 kugeza kuri 4. Imashini zose zifunze neza hakoreshejwe imifuka ikomeye irinda imihindagurikire y’ikirere (ESD) kandi zigashyirwa mu masanduku y’imbaho mpuzamahanga ashyigikiwe. Kugira ngo urebe ko ziboneka mu gihe nyacyo kandi ubone ibiciro bya FOB/CIF, kanda kuri link yacu ya WhatsApp cyangwa wohereze ibishushanyo mbonera byawe n’intego zawe ku ikipe yacu igurisha.