Imashini zikoresha ibyuma byinshi zikora neza cyane zikoreshwa mu gupakira ibikoresho bya semiconductor bigezweho
Besi Datacon 8800 CHAMEO Advanced ni yo igezweho kandi ifite ubuhanga bwo hejuruumufatanyabikorwaYagenewe gupakira ibikoresho bya semiconductor bigezweho, gupakira ibikoresho bya fan-out ku rwego rwa wafer (WL-FOP), guhuza ibintu bitandukanye, no guteranya ibikoresho bya 3D IC. Ihuza uburyo bwo gushyira ibintu neza cyane, uburyo bworoshye bwo gukora, n'umusaruro mwinshi mu nganda zikora ibikoresho bya semiconductor zisaba akazi kenshi.

Kuki wahitamo Datacon 8800 CHAMEO Advanced?
Uburyo bwo gushyira ibintu mu mwanya wabyo buri hejuru cyane
Ubushobozi bwo guteranya amachip menshi
Inkunga ihanitse yo gupakira ibintu bivamo umuyaga
Guhuza imikoranire y’imvange mu gihe kizaza
Uburyo bworoshye bwo gucunga substrate
Igishushanyo mbonera cy'umusaruro mwinshi
Imikorere ihamye y'inganda mu gihe kirekire
Byagenewe ikoranabuhanga rigezweho ryo gupakira
Datacon 8800 CHAMEO Advanced yakozwe by'umwihariko kuri:
Pakingi yo gushyiramo umuyaga ku rwego rwa Wafer (WL-FOP)– Uburyo bunini bwo gushyiramo umuyaga mu gice kinini n’aho ugera ku rugero rwa wafer busaba gushyiramo icyuma neza no kugenzura umusaruro.
Ihuriro rya 2.5D na 3D IC– Ishyigikira uburyo butandukanye bwo guhuza no gukoresha ikoranabuhanga rya silicon (TSV).
Guteranya Module za Chip nyinshi- Guteranya neza ibisigazwa byinshi mu ipaki imwe.
Ibikoresho bya mudasobwa bifite imikorere myiza cyane (AI) n'ibikoresho bya mudasobwa bifite imikorere myiza- Ijwi ry'umurongo rito cyane kandi rifite ubushobozi bwo kuringaniza neza.
Gupakira RF na Sensor- Gutunganya neza imikorere y'igikoresho ni ingenzi cyane ku mikorere yacyo.
Ikoranabuhanga ry'ibanze
Sisitemu yo hejuru-Icyerekezo cyo Guhuza Sisitemu– Kamera ya MP 4 ifite uburyo buhanitse bwo gukosora amakosa mu gihe nyacyo.
Uburyo bwo gutunganya robo ebyiri burimo ikoranabuhanga– Ibikorwa byo gutoranya no gushyira hamwe icyarimwe byongera umusaruro.
Igenzura ry'imikorere ry'ubwenge- Igenzura imbaraga zo guhuza, ubushyuhe, igihe, n'uburyo bwo gushyira ibintu mu mwanya wabyo.
Ikoranabuhanga ryo guhuza ibintu mu buryo buhindagurika– Ishyigikira ifatabuguzi rya "flip-chip", "face-up", "multi-chip", na "thermo-compression bonding".
Ibisobanuro by'ingenzi bya tekiniki
| Ibisobanuro | Imikorere |
|---|---|
| Ubuziranenge bw'ishyirwa ku rwego rw'isi | ± 5 μm @ 3 Sigma |
| Ubuziranenge bw'aho uherereye | ± 3 μm @ 3 Sigma |
| Ubushobozi bw'umusaruro | Kugeza kuri 6.000 – 7.000 UPH |
| Sisitemu yo Kureba | Kuboneza umuvuduko wo hejuru wa Megapixel 4 |
| Uburyo bwo Guhuza | Flip-Chip / Isura-Up / Multi-Chip |
| Inkunga y'amacupa | Kugeza kuri mm 300 |
| Ubufasha bwa FO-WLP | Ibice bigera kuri mm 340 |
| Guhuza icyumba cyo gusukura | ISO Icyiciro cya 5 |
| Igenzura ry'Imikorere | Ishobora gushyirwa muri gahunda byuzuye |
| Inkunga ihanitse yo gupakira | Yego |
Ibyiza ku bakora ibikoresho bya semiconductor
Umusaruro urushijeho kuba mwiza- Bigabanya amakosa yo gushyira ibintu mu mwanya wabyo kugira ngo umusaruro urusheho kuba mwiza.
Uburyo bworoshye bwo guhindura imikorere- Ishyigikira ubwoko bwinshi bwa paki kuri platform imwe.
Inganda Zigaragaza Ubuziranenge bw'ejo hazaza- Biteguye guhuza ibintu bitandukanye no guhuza ibisekuruza bishya.
Kugabanya ibyago byo gukora- Gukurikirana ibintu mu buryo bw'ubwenge bitanga icyizere cy'igihe kirekire.
Amahitamo y'ibikoresho biboneka
Datacon 8800 CHAMEO Yavuguruwe
Sisitemu zageragejwe byuzuye
Ibikoresho byiteguye gukora
Inkunga yo Gushyiramo Ibikoresho ku Isi
Ibikoresho byo gutanga
Ubufasha mu by'Ubwubatsi
Inkunga yo kunoza imikorere
Datacon 8800 CHAMEO vs Traditional Die Bonder
| Ikiranga | Datacon 8800 CHAMEO | Umuhuza usanzwe |
|---|---|---|
| Gupakira mu buryo bugezweho | ✓ | Hafi |
| Pakingi yo Gusohora Umuyaga | ✓ | Hafi |
| Guteranya Chip nyinshi | ✓ | Igice |
| Guhuza 3D IC | ✓ | Hafi |
| Ihuriro ry'ibinyabutabire ryiteguye | ✓ | Oya |
| Gushyira Ahantu | ± 3 μm | ± 10~ 20 μm |
| Gushobora Kwaguka mu Gihe Kizaza | Nibyiza cyane | Iringaniye |
Ibikoresho bifitanye isano
Ibikoresho byo guhuza by'ubwoko bwa Hybrid
Ibikoresho bigezweho byo gupakira
Sisitemu zo Gufata Amafunguro ya Wafer
BESI The Bonder
Ibibazo Bikunze Kubazwa ku Ikoreshwa rya Datacon 8800 Die Bonder
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Datacon 8800 CHAMEO Advanced ikoreshwa iki?
Ikoreshwa cyane cyane mu gupakira ibikoresho bya semiconductor birimo gupakira hanze y’umufana, guteranya ama-chip menshi, guhuza ibintu bitandukanye, no gukora 3D IC.
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Ese sisitemu ishyigikira guhuza flip-chip?
Yego. Uru rubuga rushyigikira inzira zo guhuza ibyuma (flip-chip) n'izo guhuza ibyuma (face-up die bonding).
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Ni ubuhe buryo bwo gushyira ahantu neza bushobora kugerwaho?
Sisitemu itanga ubuziranenge bwo gushyira ibintu mu mwanya wa ± 3 μm kuri 3 Sigma.
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Ese birakwiriye gupakira mu buryo bwa wafer-out?
Yego. Iyi mashini yakozwe by'umwihariko kugira ngo ishyigikire uburyo bwo gupakira ibintu mu buryo bworoshye kandi bunoze.
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Ese urubuga rushobora gushyigikira inzira zo guhuza ibintu mu buryo bw'ikoranabuhanga mu gihe kizaza?
Urubuga rw'ikoranabuhanga rwa CHAMEO rukora nk'ishingiro ry'iterambere ry'ubuhuza bw'ikoranabuhanga n'ikoranabuhanga rigezweho ryo guhuza.
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Ese mutanga sisitemu za Datacon 8800 CHAMEO Advanced zavuguruwe?
Yego. Sisitemu zavuguruwe kandi ziteguye gukora zishobora kuboneka bitewe n'uko ububiko buhagaze.












