BESI Datacon 2200 EVO ipfa imashini ihuza

BESI Datacon 2200EVO nuburyo bwikora bwuzuye, ultra-high-precision, sisitemu yimikorere myinshi ipfa gukoreshwa ikoreshwa muri semiconductor inyuma-yanyuma yo gupakira. Igikorwa cyacyo nyamukuru ntikiri gushushanya, ahubwo "guhuza."

Ibikorwa byayo byingenzi birimo:

Gupfa Gupfa (Gufata Umugereka): Hitamo umuntu ku giti cye apfa kuva kumurongo wafer hanyuma ukabishyira kuri substrate, leadframe, cyangwa undi upfa.

Surface Mount (SMT): Usibye gupfa kwambaye ubusa, irashobora kandi guhuza ibice bipakiye, ariko ntabwo aribikorwa byibanze.

Uburyo bwinshi bwo Gukoresha Porogaramu: Ntabwo ikora gusa guhuza imfu gakondo (ukoresheje ibifata nka epoxy resin) ahubwo ikora nuburyo butandukanye bwo gupakira.

Muri make, ni robot yinteko ishinzwe micromanipulation yoroheje ya fabic semiconductor fabs, igera kuri micron-urwego rwukuri.

II. Tekinoroji Yibanze, Ibiranga, nubusobanuro bwa "EVO"

"EVO" mubisanzwe bisobanura "Ubwihindurize," bisobanura ko iki gisekuru cyibibuga bitanga iterambere ryinshi mumuvuduko, ubunyangamugayo, no guhinduka ugereranije nabasekuruza babanjirije.

1. Ultra-High Precision & Flexibility

Ukuri: Gushyira mubyukuri mubisanzwe bigera kuri ± 15 μm @ 3σ cyangwa byiza. Ibi nibyingenzi mugushira utuntu duto duto hamwe nibinini byiza.

Ihuriro rinyuranye: 2200EVO ni urubuga rwa modular rushobora guhuza nuburyo butandukanye bwa porogaramu, kuva aho gakondo ipfa gushira kugeza inzira igoye cyane ya flip-chip, mugusimbuza imitwe itandukanye hamwe nibishusho.

2. Ikoranabuhanga rishyizwe hejuru

Guhuza Thermocompression Bonding (TC): Ubu ni bumwe mu buhanga bwibanze. Mugihe cyo gushyira, ubushyuhe hamwe nigitutu bikoreshwa icyarimwe kuri chip, bigakora imiyoboro yizewe yamashanyarazi nubukanishi hagati ya chip na padi ya substrate. Ibi bikoreshwa cyane mubikorwa bya flip-chip, cyane cyane mubucucike bwinshi, gupakira 3D.

Laser-Ifashwa na Bonding (LAB): Gukoresha lazeri nkisoko yubushyuhe bwaho cyane kugirango ushushe, igera ku gipimo cyihuse kandi ikagabanya imihangayiko yumuriro, bigatuma iba nziza kubushyuhe bukabije, chip-ultra-thin chips cyangwa ibice.

Kwerekana Misa: Chip zishyirwa mbere hanyuma zikagurishwa mu ziko ryerekana.

3. Sisitemu ikomeye yo kureba no guhuza gahunda

Sisitemu ya Multi-Kamera: Yashyizwe hamwe na kamera-yo hejuru-ireba kamera-yo hejuru (yo kumenya aho padi iherereye kuri substrate) hamwe na kamera ireba hepfo (yinjijwe mumutwe wo gushyira kugirango umenye aho ibisebe biri kuri chip).

Gutunganya Amashusho-Igihe nyacyo: Ukoresheje algorithms ihanitse, sisitemu ibara gutandukana (X, Y, na θ) hagati ya chip bump na substrate padi mugihe nyacyo kandi ikayishyura mbere yo kuyishyira, ikemeza neza.

Guhuza Chip Chip Guhuza: Sisitemu yayo yo kureba irashobora kubona binyuze mu rupfu (kubikoresho bimwe) hanyuma ikareba mu buryo butaziguye umurongo utambitse hepfo, urufunguzo rwo kugera kuri flip chip yuzuye.

4. Modularité na Configurable

Abakoresha barashobora guhitamo ibi bikurikira ukurikije umusaruro ukenewe:

Imitwe itandukanye yo gushyira: imitwe yihariye yo gushyira kubunini nuburyo butandukanye (nka TC na LAB).

Sisitemu yo kugaburira: Gushyigikira wafer-kuri-kadamu yipakurura hamwe nuburyo butandukanye bwa sisitemu yo gutwara abantu (gariyamoshi, akazi, nibindi).

Sisitemu yo Gutanga (Bihitamo): Gutanga indangagaciro zuzuye zituma habaho gukoresha neza flux cyangwa kuzuza substrate mbere yo kuyishyira.

5. Umusaruro no kwizerwa

Ibicuruzwa byinjira cyane: Igenzura ryimikorere hamwe nihuta ryihuta ryimitwe imitwe igera kumurongo mwinshi (UPH) mugihe ukomeje ultra-high precision.

Kwizerwa kwinshi (Uptime): Yateguwe kubidukikije bikaze 24/7 bikomeza umusaruro winganda, bitanga igihe kinini hagati yo kunanirwa (MTBF) nigihe gito cyo gusana (MTTR).

III. Ibisanzwe

BESI Datacon 2200EVO ikoreshwa cyane cyane murwego rwohejuru kandi rwuzuye rwo gupakira:

Flip Chip: Nibikorwa byayo bya kera cyane, bikoreshwa cyane mugupakira chip nka CPU, GPUs, na ASIC zohejuru.

2.5D / 3D Gupakira Byuzuye: Byakoreshejwe muguhuza chip kuri interineti ya silicon cyangwa gukora chip-on-chip stacking.

Kwishyira hamwe kwa Heterogene: Guhuza chip hamwe nibikorwa bitandukanye (nkibikoresho bya logic, chip yibuka, hamwe na chip ya RF) mubice bimwe.

Gupakira Sensor: Byakoreshejwe muguteranya neza ibicuruzwa nka CIS (sensor sensor) na sensor ya MEMS.

Gupakira Optoelectronics: Porogaramu nko guteranya lazeri na modul optique.

IV. Umwanya w'isoko n'incamake

BESI Datacon numuyobozi wisi yose muri flip chip hamwe niterambere ryambere rya tekinoroji.

Ubuyobozi bw'ikoranabuhanga: BESI Datacon ifite inyungu zikomeye za tekiniki n'umugabane ku isoko, cyane cyane mubikorwa byateye imbere nka thermocompression bonding (TCB) hamwe na laser ifashwa (LAB).

Kwibanda kuri High-End: 2200EVO platform yibanda kumurongo wohejuru usaba ubuhanga bwuzuye, bwizewe, hamwe nubushobozi bwo gutunganya, guhatana namasosiyete nka ASM ya tekinoroji ya ASM.

Gutwara udushya: Ibikoresho byayo nigikoresho cyingenzi cyo gukora ibikoresho byinshi byapakiye ibikoresho, nka 2.5D / 3D IC.

Muncamake, BESI Datacon 2200EVO nuburyo bwuzuye bwo gupfunyika sisitemu yo gupakira semiconductor igezweho, igaragaramo ultra-high precision hamwe nubushobozi bugezweho, cyane cyane guhuza thermocompression. Yerekana uburyo bugezweho bugezweho mu buhanga bwo gupfa kandi ni kimwe mu bintu by'ibanze bigize ibicuruzwa bikora nk'ibicuruzwa bitunganijwe neza, ibyuma by’ubwenge, hamwe n’itumanaho ryihuta.