BESI Datacon 2200 EVO kufa umatshini bonding

I-BESI Datacon 2200EVO i-automated ngokupheleleyo, i-ultra-high-precision, i-multifunctional die-bonding system esetyenziswa kwi-semiconductor back-end yokupakisha inkqubo. Umsebenzi wayo ophambili awusekho ukudayela, kodwa "ukudibanisa."

Imisebenzi yayo ephambili ibandakanya:

I-Die Bonding (Die Attach): Ukukhetha idayisi yomntu ngamnye kuyafa kwisakhelo se-wafer kwaye alibeke ngokuthe ngqo kwi-substrate, i-leadframe, okanye enye into.

INtaba yoMphezulu (SMT): Ukongeza kokufa okungenanto, inokuphinda idibanise izinto ezipakishweyo, kodwa lo ayingomsebenzi wayo ophambili.

Izicelo zeNkqubo ezininzi: Ayenzi nje kuphela i-die bonding yendabuko (usebenzisa i-adhesives ezifana ne-epoxy resin) kodwa kunye neenkqubo zokupakisha eziphambili.

Ukubeka nje ngokulula, yirobhothi yendibano enoxanduva lobuchule be-micromanipulation ye-semiconductor fabs, ukufezekisa ukuchaneka kwenqanaba le-micron.

II. Ubuchwephesha obungundoqo, iimpawu, kunye nentsingiselo ye "EVO"

"I-EVO" imele "i-Evolution," ebonisa ukuba esi sizukulwana samaqonga sibonelela ngophuculo olubalulekileyo kwisantya, ukuchaneka, kunye nokuguquguquka xa kuthelekiswa nezizukulwana ezidlulileyo.

1. Ukuchaneka okuphezulu kunye nokuguquguquka

Ukuchaneka: Ukuchaneka kokubekwa ngokuqhelekileyo kufikelela ku-±15 μm @ 3σ okanye ngcono. Oku kubalulekile ekubekeni iitshiphusi ezincinci ezikhulayo ezineepitshi ezicolekileyo.

I-Platform ye-Versatile: I-2200EVO i-platform yemodyuli enokuthi ivumelane noluhlu olubanzi lwezicelo, ukusuka kwindawo yokufa yendabuko ukuya kwiinkqubo ze-flip-chip eziyinkimbinkimbi, ngokutshintsha iintloko zokubeka ezahlukeneyo kunye nokucwangciswa.

2. ITekhnoloji yokuBeka ePhezulu

I-Thermocompression Bonding (TC): Le yenye yeetekhnoloji zayo eziphambili. Ngethuba lenkqubo yokubeka, ukushisa kunye noxinzelelo kusetyenziswa ngaxeshanye kwi-chip, ukudala uxhulumaniso oluthembekileyo lombane kunye nomatshini phakathi kwee-bumps ze-chip kunye neepads ze-substrate. Oku kusetyenziswa ngokubanzi kwiinkqubo ze-flip-chip, ngakumbi kwi-high-density, ukupakishwa kwe-3D.

I-Laser-Assisted Bonding (i-LAB): Ukusebenzisa i-laser njengomthombo wokushisa owenziwe kakhulu kwindawo yokufudumeza, ifezekisa imilinganiselo ye-ramp ekhawulezayo kwaye inciphisa uxinzelelo lwe-thermal, iyenze ibe yinto efanelekileyo kwiqondo lokushisa, i-ultra-thin chips okanye amacandelo.

I-Mass Reflow: Iitshiphusi zibekwe kuqala kwaye emva koko zithengiswe kwi-oven yokubuyisela kwakhona.

3. Umbono onamandla kunye neNkqubo yoLungiso

I-Multi-Camera System: Ixhotywe ngekhamera ephezulu ekhangele phezulu (ukukhangela indawo yeepads kwi-substrate) kunye nekhamera ejonge phantsi (idityaniswe kwintloko yokubeka ukukhangela indawo yokuqhuma kwi-chip).

I-Real-Time Image Processing: Ukusebenzisa i-algorithms eyinkimbinkimbi, inkqubo ibala ukutenxa (X, Y, kunye no-θ) phakathi kwe-chip bumps kunye ne-substrate pads ngexesha langempela kwaye ihlawulele ngaphambi kokubekwa, iqinisekisa ukulungelelaniswa okugqibeleleyo.

Ukulungelelaniswa kwe-Flip Chip: Inkqubo yayo yombono inokubona ngokufa (kwizinto ezithile eziphathekayo) kwaye ijonge ngokuthe ngqo i-bump array ezantsi, eyona nto ibalulekileyo ekufezekiseni ukubekwa kwe-chip chip ephezulu.

4. Ukumodareyitha kunye noLungiselelo

Abasebenzisi banokukhetha oku kulandelayo ngokusekelwe kwiimfuno zemveliso:

IiNtloko zokuBeka ezahlukeneyo: Iintloko zokubeka ezinikezelweyo zobukhulu obahlukeneyo kunye neenkqubo (ezifana ne-TC kunye ne-LAB).

Inkqubo yokutya: Ixhasa ukulayishwa kwe-wafer-on-frame kunye neentlobo ezahlukeneyo zeenkqubo zothutho ze-substrate (ii-rails, ii-worktables, njl.).

INkqubo yokuNika (Ngokuzikhethela): Iivalvu ezidityanisiweyo zokuchaneka ezichanekileyo zenza ukusetyenziswa okuchanekileyo kwe-flux okanye ukugcwalisa ngaphantsi kwi-substrates ngaphambi kokubekwa.

5. Imveliso kunye nokuthembeka

Ukuphumelela okuphezulu: Ukulawulwa kwentshukumo ephuculweyo kunye neentloko zokubeka isantya esiphezulu zifezekisa imijikelezo ephezulu yemveliso (UPH) ngelixa igcina ukuchaneka okuphezulu.

Ukuthembeka okuphezulu (Uptime): Yenzelwe iindawo ezinzima ze-24 / 7 imveliso yemveliso eqhubekayo, inika ixesha eliphakamileyo phakathi kokungaphumeleli (MTBF) kunye nexesha eliphantsi lokulungisa (MTTR).

III. Usetyenziso oluqhelekileyo

I-BESI Datacon 2200EVO isetyenziswa ngokukodwa kwi-high-end kunye nezicelo zokupakisha eziphambili:

I-Flip Chip: Esi sesona sicelo sayo sakudala, sisetyenziswa kakhulu ekupakishweni kweechips ezinjenge-CPU, ii-GPU, kunye nee-ASIC eziphezulu.

I-2.5D / 3D Ukupakishwa okuDityanisiweyo: Isetyenziselwa ukufaka iichips kwii-silicon interposer okanye ukwenza i-chip-on-chip stacking.

Ukudityaniswa kwe-Heterogeneous: Idibanisa ii-chips ezineendlela ezahlukeneyo zenkqubo kunye nemisebenzi (efana ne-logic chips, i-memory chips, kunye ne-RF chips) kwiphakheji enye.

I-Sensor Packaging: Isetyenziselwa ukudibanisa ngokuchanekileyo kweemveliso ezifana neCIS (imifanekiso yomfanekiso) kunye neenzwa ze-MEMS.

I-Optoelectronics Packaging: Izicelo ezifana nokuhlanganiswa kwee-lasers kunye neemodyuli zamehlo.

IV. Isikhundla seMarike kunye nesiShwankathelo

I-BESI Datacon yinkokeli yehlabathi kwi-flip chip kunye neteknoloji yokuncamathela okuphambili.

UbuNkokeli bobuChwephesha: I-BESI Datacon ibambe iinzuzo zobugcisa ezinamandla kunye nesabelo semarike, ngokukodwa kwiinkqubo eziphambili ezifana ne-thermocompression bonding (TCB) kunye ne-laser-assisted bonding (LAB).

Ukujolisa kwi-High-End: I-platform ye-2200EVO ijolise kwizicelo eziphezulu ezifuna ukuchaneka okuphezulu, ukuthembeka, kunye nobuchule benkqubo, ukukhuphisana neenkampani ezifana ne-ASM Pacific Technology.

I-Innovation yokuqhuba: Izixhobo zayo ziyimfuneko yokuvelisa izixhobo ezininzi zokupakisha eziphambili, ezifana ne-2.5D / 3D ICs.

Isishwankathelo, i-BESI Datacon 2200EVO yinkqubo yokuncamathela kwi-automated die ye-advanced semiconductor packaging, ebonisa ukuchaneka kwe-ultra-high kunye nobuchule benkqubo ephezulu, ngakumbi i-thermocompression bonding. Imele ubuchwephesha obukhoyo ngoku kwitekhnoloji ye-die attach kwaye iyinxalenye ephambili yeemveliso ezinje ngeeprosesa eziphezulu, iitshiphusi zobukrelekrele bokwenziwa, kunye neetshiphusi zonxibelelwano olukhawulezayo.