What specific BESI (Datacon & Esec) die bonder configurations do you actively supply?

We supply and configure mainstream BESI platforms: BESI Datacon 2200 evo for multi-chip packaging, BESI Datacon 8800/8800 fc for sub-micron flip chip interconnects, and BESI Esec 2100 platforms for high-volume leadframe mass production.

How do you guarantee the sub-micron placement accuracy of a refurbished BESI 8800 or 2200 system?

Every pre-owned BESI system undergoes linear motor calibration, vision system adjustment, and multi-axis alignment. We perform live recipe dry runs with real substrates to match original factory tolerances before transit.

Do you supply custom Change Kits, pickup tools, and original spare parts for legacy BESI models?

Yes. We maintain a large inventory of consumables and spare parts, including pick-up collets, ejector needles, customized heating blocks, and board modules to support both current and discontinued BESI lines.

What specific BESI (Datacon & Esec) die bonder configurations do you actively supply?

We supply and configure mainstream BESI platforms: BESI Datacon 2200 evo for multi-chip packaging, BESI Datacon 8800/8800 fc for sub-micron flip chip interconnects, and BESI Esec 2100 platforms for high-volume leadframe mass production.

How do you guarantee the sub-micron placement accuracy of a refurbished BESI 8800 or 2200 system?

Every pre-owned BESI system undergoes linear motor calibration, vision system adjustment, and multi-axis alignment. We perform live recipe dry runs with real substrates to match original factory tolerances before transit.

Do you supply custom Change Kits, pickup tools, and original spare parts for legacy BESI models?

Yes. We maintain a large inventory of consumables and spare parts, including pick-up collets, ejector needles, customized heating blocks, and board modules to support both current and discontinued BESI lines.

Can your configured BESI die bonders support automotive-grade or specialized MEMS applications?

Absolutely. Depending on your packaging layouts—whether complex COB, RF modules, automotive optoelectronics, or delicate MEMS sensors—we customize the handling and process modules to protect sensitive components.

What is your typical delivery lead time, and how can we request a detailed technical quote?

In-stock BESI bonders require 2-4 weeks for testing and integration. Systems are vacuum-packed in ESD bags and wooden cases. Contact our team via WhatsApp with package drawings for a formal quotation.

I-BESI The Bonder

Oomatshini abatsha, abasetyenzisiweyo nabahlaziyiweyo be-BESI die bonder be-LED, i-IC, i-MEMS, i-optoelectronics, i-power semiconductor kunye nemveliso yokupakisha ephucukileyo. Sinceda abathengi bafumane oomatshini abafanelekileyo ngokukhawuleza, sinciphise umngcipheko wokuthenga kwaye sibuyisele amandla emveliso.

Jonga iStock kwaye ufumane iQuote → Jonga Iingxaki Zabathengi →

Iimodeli Ezingafumanekiyo Xhasa i-legacy kunye ne-BESI die bonder sourcing engxamisekileyo.

Umngcipheko ophantsi wotyalo-mali Ukuhlolwa, uvavanyo kunye nokuhlolwa kwemeko ngaphambi kokuba ithunyelwe.

Uxhaso lobuchwepheshe Ukufunyanwa kwezixhobo, ukubonisana noomatshini kunye nenkxaso yemveliso.

10+ Iminyaka yamava ezixhobo ze-semiconductor

30+ Amazwe Akhonzwa Kwihlabathi Lonke

3-7 Ukuhanjiswa kweHlabathi okuKhawulezayo ngeentsuku

24H Inkxaso yokuQokelelwa ngokukhawuleza kunye neModeli yokuThathanisa

Uluhlu lwe-BESI olufumanekayo

Iimatshini ze-BESI Die Bonder ezibonisiweyo kunye neenketho zokufumana izinto ezintsha

Hlola ukhetho lwethu lobuchwephesha lwexesha langempela lweeplatifomu ze-BESI die bonding ezisele zisetyenziswa, ezisetyenzisiweyo, nezihlaziyiweyo, kuquka uthotho lweDatacon kunye ne-Esec. Inkqubo nganye inokulungiswa ngokwezifiso ngeekhithi zotshintsho ezizinikeleyo, iimodyuli zokulinganisa umbono, kunye nezixhobo zokuthatha ukuze zihlanganiswe ngokulula kumgca wakho wokupakisha.

Awufumani iBESI Datacon okanye imodeli ye-Esec oyifunayo? Sithumelele imifanekiso yakho yephakheji (i-BGA, i-QFN, i-LGA) kunye neenkcukacha zokulungelelanisa. Iinjineli zethu ziya kuhambelana nenkqubo efanelekileyo kwaye ziphathe uthutho lokuthumela ngaphandle kwihlabathi liphela.

I-Datacon 8800 CHAMEO Advanced Die Bonder

I-Besi Datacon 8800 CHAMEO Advanced yi-die bonder yesizukulwana esilandelayo eyilelwe i-semiconductor ephucukileyo...
Jonga isitokhwe kunye nexabiso
Umatshini wokubopha iBesi Datacon 8800 FC QUANTUM Advanced Die Bonding

I-Besi Datacon 8800 FC QUANTUM Advanced yi-die bonder ezenzekelayo enamandla aphezulu kakhulu eyenzelwe ngokukodwa i-m...
Jonga isitokhwe kunye nexabiso
BESI Datacon 2200 EVO kufa umatshini bonding

I-BESI Datacon 2200EVO yinkqubo yokubeka iitshiphusi ezisebenza ngokuzenzekelayo ngokupheleleyo, echanekileyo kakhulu, nenemisebenzi emininzi esetyenziswa kwi-semico...
Jonga isitokhwe kunye nexabiso
BESI ESEC 2100 hS BESI Die Bonder

I-ESEC 2100 hS die bonder liqonga elidumileyo le-die bonder elikhawulezayo elivela kwi-BESI.
Jonga isitokhwe kunye nexabiso
Umatshini wokubumba ams-x

Umatshini wokubumba we-BESI's AMS-X ngumatshini wokubumba we-servo hydraulic ophucukileyo oneengenelo ezininzi kunye neempawu
Jonga isitokhwe kunye nexabiso
kumatshini wokubumba iMMS-X

Umatshini wokubumba we-BESI we-MMS-X yinguqulelo yesandla yomatshini wokubumba we-AMS-X. Usebenzisa ipleyiti entsha eshicilelweyo...
Jonga isitokhwe kunye nexabiso
IRON Die Bonding Machine Datacon 8800

I-Besi Datacon 8800 ngumatshini wokubopha iitshiphusi ophucukileyo, osetyenziselwa kakhulu ubuchwepheshe bokupakisha be-2.5D kunye ne-3D, ngakumbi i-TSV ...
Jonga isitokhwe kunye nexabiso

IINGXAKI ZENTLUNGU ZOMTHENGI

Iingxaki Eziqhelekileyo Xa Uthenga iiBESI Die Bonders

Uninzi lwabathengi alufuni nje kuphela umatshini. Bafuna imveliso ezinzileyo, ixesha elifutshane lokubonelela, umngcipheko omncinci kunye nenkxaso ethembekileyo emva kokuthenga.

Ixesha Elide Lokukhokela Kwizixhobo Ezintsha

Izicwangciso ezininzi zemveliso azikwazi kulinda iinyanga ngaphambi kokuba kubekho i-die bonder entsha. Abathengi bafuna uncedo olukhawulezileyo lokwandisa amandla okanye ukutshintshwa ngokukhawuleza.

Iimodeli Ezililifa Ekunzima Ukuzifumana

Imigca emidala yemveliso idla ngokufuna iimodeli ze-BESI ezihambelanayo, kodwa uqwalaselo olungasasebenziyo okanye oluthile kunzima ukuzifumana kwimarike.

Ixabiso Eliphezulu Lezixhobo Ezintsha

Izixhobo zokupakisha ezintsha ze-semiconductor zifuna utyalo-mali olukhulu. Ii-BESI die bonds ezisetyenzisiweyo okanye ezihlaziyiweyo zinokunceda ukunciphisa uhlahlo-lwabiwo mali lwezixhobo.

Imeko Yomatshini Osetyenzisiweyo Engacacanga

Abathengi baxhalabile ngemiba efihlakeleyo efana nokuguguleka kwe-axis, iingxaki zokubona, iimpazamo zesoftware, iindawo ezingekhoyo kunye nokuchaneka kokubopha okungazinzanga.

Ukunqongophala kweNkxaso yoBugcisa

Abanye abathengisi bathengisa oomatshini kuphela kodwa abanakuxhasa ukukhethwa kwemodeli, ukuhlolwa, ukufumana iindawo okanye ukuhlanganiswa kwemveliso.

Uxinzelelo lwexesha lokungasebenzi kwemveliso

Xa i-die bond ingaphumeleli, yonke imihla yexesha lokungasebenzi inokuchaphazela iishedyuli zokuhanjiswa, ii-odolo zabathengi kunye neendleko zemveliso.

Ukubopha ngoDie Ukubekwa ngokuchanekileyo kokupakisha kwe-semiconductor

OKO SIKUSOMBULULAYO

Ayingomthengisi woomatshini nje kuphela — Iqabane lesisombululo sezixhobo zokubopha i-Die Bonding

I-GEEKVALUE inceda abavelisi be-semiconductor ukuba bafumane ii-BESI die bonds ezifanelekileyo ngokusekelwe kwiimfuno zemveliso, imeko yomatshini, uhlahlo-lwabiwo mali kunye nexesha lokuhanjiswa.

Sigxila ekusombululeni iingozi zokwenyani zokuthenga: nokuba imodeli ifanelekile na, nokuba imeko yomatshini icacile na, nokuba iindawo kunye nenkxaso yobugcisa ziyafumaneka na, nokuba izixhobo zinokuxhasa imveliso emva kokufika.

Ukufaniswa kweModeli Cebisa iimodeli ezifanelekileyo ze-BESI die bonder ngokusekelwe kuhlobo lwephakheji kunye neemfuno zenkqubo.

Ukuhlolwa koomatshini Jonga iinkqubo eziphambili ngaphambi kokuba zithunyelwe ukuze unciphise umngcipheko wokuthenga ofihlakeleyo.

Inkxaso yeenxalenye Nceda ufumane iindawo ezibalulekileyo zokugcina izinto kunye nokusebenza ixesha elide.

Ukuhanjiswa kweHlabathi Ukupakisha izinto ezithunyelwa kwamanye amazwe kunye nenkxaso yokuthunyelwa kwezixhobo ze-semiconductor kumazwe ngamazwe.

KUTHENI UKHETHE THINA

Kutheni Abathengi Bethenga iiBESI Die Bonders Kwi-GEEKVALUE

Sakha iphepha elijikeleze umngcipheko wabathengi, kungekhona izilogeni ezingenamsebenzi. Injongo kukwenza abathengi bazive ngathi iingxaki zabo zokwenyani zinokusingathwa.

Ukufunyanwa kweStock okuKhawulezayo

Sinceda abathengi bafumane ii-BESI die bonds ezifumanekayo ngokukhawuleza, ingakumbi xa zitshintshwa ngokukhawuleza, zifakwe iintambo ezindala kunye neemodeli ezingasasebenziyo.

Ukuhlolwa Ngaphambi Kokuthunyelwa

Sijonga inkangeleko yomatshini, imeko yokuvula amandla, inkqubo yokuhamba, inkqubo yokubona, isoftware kunye nemisebenzi ephambili ngaphambi kokuba sithumele kwamanye amazwe.

Iindlela Ezingabizi Kakhulu

Iibhondi ze-BESI ezisetyenzisiweyo nezihlaziyiweyo zinceda abathengi ukunciphisa utyalo-mali kwizixhobo ngelixa begcina amandla okuvelisa.

Ukubonisana ngoBugcisa

Sixhasa ukukhethwa kwemodeli, ukufanisa iinkqubo kunye nengxoxo yokumisela umatshini ngaphambi kokuba uthenge.

Inkxaso yeenxalenye zezinye

Kwiimodeli ezindala ze-BESI die bonder, ukufumaneka kwezixhobo ezingasetyenziswayo kubalulekile. Sinceda abathengi bafumane izixhobo kwaye sinciphise umngcipheko wexesha lokungasebenzi.

Ukupakisha nokuThumela ngaphandle

Izixhobo ze-semiconductor zifuna ukupakishwa okukhuselekileyo, uthutho oluzinzileyo kunye nokuphathwa ngononophelo ukuze zihanjiswe kumazwe ngamazwe.

IZICELO

Izicelo ze BESI Die Bonders

Ii-BESI die bonders zisetyenziswa kakhulu kwi-semiconductor assembly, kwi-advanced packaging kunye neenkqubo ze-die attachment ezichanekileyo.

Ukubopha i-LED Die Ukupakisha i-LED, ukubeka ngokukhawuleza okukhulu kunye nemveliso ezinzileyo.

Ukupakisha i-IC Izisombululo zokuncamathisela ii-die ze-combined circuit assembly kunye ne-packaging lines.

Ukupakisha kweMEMS Isetyenziselwa iisensors, izixhobo ezincinci kunye neemodyuli ze-elektroniki ezichanekileyo.

I-Optoelectronics Inkxaso yezinto ezibonakalayo, ii-photonics kunye nee-microelectronics eziphambili.

I-Power Semiconductor Ifanelekile kwiimodyuli zamandla, izixhobo ze-elektroniki zeemoto kunye nezixhobo ezithembeke kakhulu.

Izixhobo zeRF Isixhobo sokudibanisa ii-die esichanekileyo kwiimodyuli zeRF kunye nezixhobo zonxibelelwano.

Ukupakishwa kwe-COB Ukupakisha i-chip-on-board kwiimodyuli ze-elektroniki kunye nezicelo ezikhethekileyo.

Ukupakisha Okuphambili Kwiphakheji ye-semiconductor eyinkimbinkimbi kunye nemigca yemveliso enexabiso eliphezulu.

IMIGANGATHO YOHLOLO

Indlela Esinciphisa Ngayo Umngcipheko Ngaphambi Kokuthunyelwa

Izixhobo ze-semiconductor ezisetyenzisiweyo mazijongwe ngononophelo ngaphambi kokuba zithengwe. Inkqubo yethu yokuhlola inceda abathengi baqonde imeko yomatshini kwaye inciphise iingxaki ezingalindelekanga emva kokuhanjiswa.

Uhlolo olubonakalayo

Jonga imeko yangaphandle, ucoceko, ukugqibelela komatshini, izigqubuthelo, iiphaneli kunye neentambo.

Uvavanyo lwe-Power-On

Qinisekisa ukuqalisa, ukubonisa, ujongano lolawulo kunye nempendulo esisiseko yenkqubo.

Ukuhlolwa kweNkqubo yoMsindo

Hlola intshukumo ye-axis, imeko yesigaba, uzinzo loomatshini kunye nengxolo engaqhelekanga.

Ukuhlolwa kweNkqubo yoMbono

Jonga ikhamera, ukukhanya, ukulungelelaniswa kunye nemeko yokuqondwa komfanekiso.

Ukuhlolwa Komsebenzi Wokubopha

Hlola intloko yebhondi, ukuchaneka kokubekwa, i-vacuum, i-heater kunye neemodyuli ezinxulumene nenkqubo.

Ukuhlolwa kweSoftware

Qinisekisa ukusebenza kwesoftware, ukulayisha iresiphi, imbali ye-alamu kunye nemisebenzi yokulawula.

IINDLELA ZOKUBONELELA

Iinketho zeBESI Die Bonder ezintsha, ezisetyenzisiweyo nezihlaziyiweyo

Abathengi abahlukeneyo banebhajethi eyahlukileyo, iimfuno zokuhambisa kunye nemveliso. Sinceda ekuthelekiseni eyona ndlela ilungileyo yokuthenga.

I-BESI entsha iBonder

Ifanelekile kucwangciso lwemigca emitsha yemveliso kunye nokwandiswa komthamo wexesha elide.

Uqwalaselo olutsha kunye nocwangciso lwexesha elide
Ilungele iiprojekthi zemveliso ezizinzileyo
Ixabiso eliphezulu lotyalo-mali
Kusenokufuneka ixesha elide lokufumana isibonelelo

I-BESI Die Bonder esetyenzisiweyo

Ifanelekile ukutshintshwa ngokukhawuleza, imigca yemveliso esele ikhulile kunye nolawulo lwebhajethi.

Utyalo-mali oluphantsi kwezixhobo
Ukuhanjiswa ngokukhawuleza xa isitokhwe sifumaneka
Ilungele ukubuyiselwa kwamandla ngokukhawuleza
Imeko yomatshini mayijongwe ngononophelo

I-BESI Die Bonder ehlaziyiweyo

Ukhetho olulungeleleneyo kubathengi abafuna ixabiso eliphantsi kunye nokulungeleka okungcono komatshini.

Isisombululo semveliso esingabizi kakhulu
Ukuhlolwa nokulungiswa ngaphambi kokuthunyelwa
Ulawulo olungcono lomngcipheko kunezixhobo ezisetyenzisiweyo ezingaziwayo
Ifanelekile ukwandiswa kwemveliso

Iimodeli ezidumileyo

Iimodeli zeBESI Die Bonder ezidumileyo esinokuzinceda ngazo

Ukufumaneka kutshintsha rhoqo. Qhagamshelana nathi ukuze ujonge isitokhwe se-BESI die bonder sangoku, uqwalaselo kunye nexesha lokuhanjiswa.

I-BESI Datacon 2200 evo Iqonga le-die bond elidumileyo lezicelo zokupakisha ze-semiconductor.

Idatha ye-IRON 8800 Isisombululo sokudibanisa iidayi esiphucukileyo kwiinkqubo zokupakisha ezixabisa kakhulu.

I-BESI Datacon 2200 emva kwemini Isetyenziswa kwiindawo ezahlukeneyo zokuvelisa izinto zokuncamathisela kunye nokupakisha.

I-BESI Datacon 8800 fc Ifanelekile kwiinkqubo ezihambelana nokupakisha eziphucukileyo kunye ne-flip chip.

I-IRON Eagle Isetyenziselwa ukuhlanganisa i-die attach enesantya esiphezulu kunye ne-advanced semiconductor assembly.

Iinkqubo zeBESI zeeModule ezininzi Iinkqubo eziguquguqukayo zemveliso enzima kunye nemigca yokupakisha yemodyuli.

Iimodeli ze-LED Die Bonder Inkxaso yokufanisa imodeli yeemfuno zemveliso yokupakisha i-LED.

Iimodeli zeBESI zeLifa Inkxaso yokufumana iimodeli zemveliso ezingasasebenziyo okanye ezifumaneka nzima ukuzifumana.

IINDAWO NENKXASO

Inkxaso Ayipheli Emva Kokufumana Izixhobo

Kwiifektri ze-semiconductor, ukufumaneka kwezixhobo ixesha elide kubaluleke ngaphezu kokuthenga kube kanye.

Inkxaso yeenxalenye zeBESI Die Bonder

Izixhobo ezingasetyenziswayo zibalulekile kwiibhondi zeBESI ezisetyenzisiweyo nezisele zikho. Sinceda abathengi bafumane izinto ezibalulekileyo ukunciphisa umngcipheko wexesha lokungasebenzi.

Iinxalenye ezinxulumene nekhamera kunye nombono
Izinto ezinxulumene nentloko edibeneyo kunye nentshukumo
Iindawo ezinxulumene ne-vacuum kunye ne-heater
Iibhodi ze-elektroniki kunye neemodyuli zolawulo
Izinto ezisetyenziswayo kunye nezixhobo zolondolozo eziqhelekileyo

Ukubonisana ngoBugcisa

Ngaphambi kokuba sithenge, sinceda abathengi bacacise iimfuno zenkqubo kwaye baphephe ukuthenga uqwalaselo olungalunganga.

Ukukhethwa kwemodeli ngokusekelwe kwinkqubo yemveliso
Uvavanyo lwemeko yomatshini osetyenzisiweyo
Ulungelelwaniso loqwalaselo kunye nesicelo
Inkxaso yokupakisha nokuthumela impahla ngaphandle
Unxibelelwano olukude lwemibuzo yobugcisa

ULWAZI LWEZOBUGCISA LOKUFUMANA

BESI Die Bonder Sourcing & Integration FAQs

Iimpendulo zobunjineli bengcali malunga noqwalaselo lweqonga le-BESI (Datacon/Esec), ukulinganiswa kwe-sub-micron, kunye nokufumaneka kweendawo ze-turnkey.

Zeziphi ii-BESI (Datacon & Esec) die bonder configurations ezithile ozibonelelayo ngokukhutheleyo?

Sibonelela, sihlaziye, kwaye silungiselele ngokweemfuno iiplatifomu zeBESI eziphambili nezichanekileyo. Kwi-multi-chip bonding, i-flip chip ephucukileyo, kunye ne-flexible epoxy/eutectic dispensing, sicebisa ukubaBESI Datacon 2200 evo kunye apm series. Kwi-sub-micron tolerances ezichanekileyo kakhulu kunye ne-TCB (Thermo-Compression Bonding), sigcina i-BESI Datacon 8800 kunye 8800 fc seriesUkuze siphathe iileadframe ngokuzenzekelayo ngobuninzi obuphezulu, sinikezelaUthotho lwe-BESI Esec 2100 kunye namaqonga e-Eagle, eyenzelwe izixhobo ezithile zokuthatha ukuze kuqinisekiswe iinjongo zakho ze-OEE.

Uqinisekisa njani ukuchaneka kokubekwa kwe-sub-micron kwenkqubo ye-BESI 8800 okanye i-2200 ehlaziyiweyo?

Iqonga ngalinye le-BESI elisele liphethwe ngaphambili lidlula kwinkqubo yokuqinisekiswa kobunjineli obunamanqaku amaninzi. Iingcali zethu zokupakisha zenza ulungelelwaniso olupheleleyo lweemoto ezithe tyaba, ulungelelwaniso lwenkqubo yombono wokukhulisa okuphezulu, kunye nokuhlolwa kokuphindaphinda okuqhubekayo kwentshukumo. Ngaphambi kokupakisha kwamanye amazwe, senza iindlela zokupheka ezomileyo ezibukhoma sisebenzisa ii-substrates ezisemgangathweni ukuqinisekisa ukuba inkqubo igcina ngokungqongqo iinkcukacha zokuqala zefektri, inikezela ngeengxelo zokuqinisekiswa kwevidiyo ezicacileyo kwiqela lakho lobunjineli.

Ngaba nibonelela ngeeChange Kits ezenziwe ngokwezifiso, izixhobo zokuthathwa, kunye nezixhobo zokuqala zeemodeli zeBESI zakudala?

Ewe. Ukunciphisa ixesha lokungasebenzi kwemigca ngexesha lokuguqulwa kobukhulu beetshiphusi yeyona nto sijolise kuyo. Sigcina uluhlu olubanzi lwezinto ezisetyenziswayo kunye neekhithi zotshintsho ezenziwe ngokwezifiso ezihambelana neenkqubo ze-BESI. Oku kuquka ii-pick-up collets ezikhethekileyo, iinaliti ze-ejector, iibhloko zokufudumeza ezenziwe ngokwezifiso, ii-vacuum transducers, kunye neemodyuli zolawulo lwebhodi enkulu. Siqinisekisa ukuba imigca yemveliso ye-BESI engasebenziyo okanye esele idlulileyo ifumana inkxaso yehardware ye-turnkey.

Ngaba ii-BESI die bonds zakho ezicwangcisiweyo ziyakwazi ukuxhasa usetyenziso lwe-MEMS olukumgangatho we-automotive okanye olukhethekileyo?

Ngokuqinisekileyo. Ngokuxhomekeke kwiindlela ozipakisha ngazo—nokuba ziquka iChip-on-Board (COB) eyinkimbinkimbi, iimodyuli zeRF, ii-optoelectronics zemoto, okanye ii-sensors ze-MEMS ezithambileyo—senza ngokwezifiso iimodyuli zokuphatha kunye neenkqubo zomatshini we-BESI. Silungelelanisa iivalvu zokuhambisa, iilayibrari zokuqaphela umbono, kunye nolawulo lwe-bond-force ukuze siphathe izinto ezinobuthathaka ngaphandle kokwaphuka koxinzelelo okanye iziphene zesakhiwo.

Lingakanani ixesha lakho eliqhelekileyo lokuhambisa impahla, kwaye singayicela njani ikowuteshini yobugcisa eneenkcukacha?

Kwi-BESI die bonders ezikwisitokhwe, ukulungiswa okuqhelekileyo, uvavanyo lwesoftware, kunye nokuhlanganiswa kwezixhobo ezenziwe ngokwezifiso kufuna iiveki ezi-2 ukuya kwezi-4. Zonke iimatshini zitywinwe nge-vacuum ngeengxowa zokuthintela eziqinileyo (ESD) kwaye zifakwe kwiibhokisi zokhuni eziqinisiweyo zamazwe ngamazwe. Ukujonga ukufumaneka ngexesha langempela kwaye ufumane ikowuteshini ye-FOB/CIF ekhuphisanayo, nceda ucofe ikhonkco lethu le-WhatsApp elibukhoma okanye ungenise imizobo yakho yephakheji kunye neethagethi zemveliso ngqo kwiqela lethu lokuthengisa.