i-ave ukuya kuthi ga kwi-70% kuMacandelo e-SMT - KwiSitokhwe & Ukulungele ukuThunyelwa
Fumana iQuote →Sinikezela ngoomatshini bokubumba be-semiconductor abatsha, abahlaziyiweyo, nabasele benabo ngaphambili bokupakisha i-IC, i-EMC encapsulation, i-transfer molding, kunye nemigca yemveliso ye-semiconductor ephucukileyo.
Hlola uluhlu lwethu lweemashini zethu zokubumba ze-semiconductor ezichanekileyo kakhulu ezenzelwe ukubethelela i-IC, ukubumba kokudlulisa, ukubumba koxinzelelo kunye neenkqubo eziphambili zokupakisha. Umatshini ngamnye uhlolwa ngokupheleleyo, uvavanywe kwaye ulinganiswe ukuqinisekisa ukufudumeza okuzinzileyo, ulawulo loxinzelelo kunye nokusebenza kakuhle kwemveliso. Sinikezela ngeenkqubo zokubumba ezintsha, ezihlaziyiweyo nezazisele zikho ngokuthunyelwa kwehlabathi, uncedo lokufakelwa, inkxaso yobugcisa kunye nezisombululo ezingabizi kakhulu kwimigca yemveliso ye-semiconductor kwihlabathi liphela.
Sinceda abavelisi bee-semiconductor, iifektri ze-OSAT, kunye nemigca yemveliso ye-elektroniki ukufumana iinkqubo zokubumba ezithembekileyo ezinamaxesha akhawulezayo okukhokela, iindleko zotyalo-mali eziphantsi, kunye nenkxaso yobunjineli esebenzayo.
Inkqubo nganye yokubumba ihlolwa ukuba ikwimeko yomatshini, ulawulo lokufudumeza, uzinzo loxinzelelo, umsebenzi wokhuseleko, kunye nokulungelelaniswa kwemveliso.
Khetha kwiinkqubo ezintsha, ezisetyenzisiweyo, nezihlaziyiweyo ezikhoyo ngokwebhajethi yakho, ishedyuli yokuhanjiswa, kunye neemfuno zemveliso.
Sixhasa abathengi behlabathi ngokuthenga izixhobo, ukubonisana ngobuchwephesha, izixhobo ezingasetyenziswayo, ukuthelekisa imigca yokupakisha, kunye nokulungiselela ukuthunyelwa.
Oomatshini bokubumba abafumanekayo, iinxalenye, izifudumezi, ii-plunger, iimbiza zokudlulisa, kunye nezinto ezinxulumene nokubumba zinokucatshulwa ngokukhawuleza.
Umatshini wokubumba odluliselwayo sisixhobo sokupakisha se-semiconductor esisetyenziselwa ukufaka iitships ze-IC nge-epoxy molding compound ngexesha lenkqubo yokupakisha ye-semiconductor. Ukhusela izixhobo ze-semiconductor kumswakama, ungcoliseko, kunye nomonakalo woomatshini ngelixa uphucula ukuthembeka kwephakheji.
Yakha ukhuseleko oluqinileyo lwe-SEO ngokubandakanya amagama oomatshini aphambili abathengi abawasebenzisayo xa bekhangela izixhobo zokupakisha ze-semiconductor kunye ne-IC.
Kwi-IC package encapsulation, i-EMC molding, kunye nemveliso ye-semiconductor ephezulu.
Yenzelwe ukhuseleko lwepakethe yetshiphusi, uxinzelelo oluzinzileyo lokubumba, kunye nokupakishwa kwesixhobo okuthembekileyo.
Isetyenziswa kunye ne-epoxy molding compound ukuze i-semiconductor encapsulation ikwazi ukuthembeka kwiphakheji.
Ifanelekile kwiindlela ezikhethiweyo zokupakisha eziphambili kunye neefomathi ezithile zeepakeji ze-semiconductor.
Ukukhusela izixhobo ze-semiconductor kumswakama, ungcoliseko, kunye noxinzelelo loomatshini.
Inkxaso epheleleyo yokuhlanganisana kwe-semiconductor, ukubumba, ukubopha, ukumakisha, ukusika, kunye nokudibanisa.
Oomatshini bokubumba be-semiconductor abahlaziyiweyo lukhetho olusebenzayo kwiifektri ezifuna amandla okuvelisa athembekileyo ngelixa zinciphisa utyalo-mali lwezixhobo kwaye zinciphisa imijikelo yokuthenga.
Izisombululo zethu zomatshini wokubumba we-semiconductor zisetyenziswa kuzo zonke izicelo zokupakisha, ukusuka kupakisho oluqhelekileyo lwe-IC ukuya kwizixhobo zamandla kunye ne-elektroniki yeemoto.
Ukususela ekuqinisekisweni kwemodeli ukuya ekuthunyelweni, sinceda abathengi banciphise umngcipheko wokufumana izinto kwaye siqinisekise ngokukhawuleza izixhobo ezifanelekileyo zokubumba ze-semiconductor.
Sixelele uhlobo lwephakheji yakho, isicelo sakho, uhlobo oluthandayo, uhlahlo lwabiwo-mali, kunye neshedyuli yokuhanjiswa kwayo.
Sijonga isitokhwe esikhoyo, imeko yomatshini, uqwalaselo, kunye nezinye iindlela ezifanelekileyo.
Iifoto, iividiyo, iinkcukacha zemeko, kunye nekoteshini zinganikezelwa ngaphambi kokuqinisekiswa.
Silungiselela ukupakisha, ukuhambisa izinto, ukuthumela amaxwebhu kwamanye amazwe, kunye nokuthunyelwa kwindawo yakho yefektri.
Umatshini wokubumba we-semiconductor usetyenziselwa ukufaka iitships nge-epoxy molding compound (EMC) ukuze uzikhusele kumswakama, uxinzelelo, uthuli kunye nomonakalo wangaphandle ngexesha lokupakisha i-IC.
Umatshini wokubumba odluliselwayo usetyenziselwa ukufaka iitships ze-semiconductor nge-epoxy molding compound ngexesha lenkqubo yokupakisha ye-IC. Ukhusela iitships kumswakama, uthuli, uxinzelelo loomatshini, kunye nomonakalo ongqongileyo.
Sibonelela ngoomatshini bokubumba bokudlulisa, oomatshini bokubumba boxinzelelo, oomatshini bokubumba be-IC abazenzekelayo kunye nezixhobo zokutywina zeplastiki ze-semiconductor ezihlaziyiweyo.
Ewe, sinikezela ngoomatshini bokubumba abahlaziyiweyo abahlolwe ngokupheleleyo, abavavanyiweyo nabalinganisiweyo abasebenzayo ngokuzinzileyo kwimigca yemveliso yokupakisha ye-semiconductor.
I-EMC imele i-epoxy molding compound, izinto ze-thermoset ezisetyenziselwa ukugquma nokukhusela ii-semiconductor dies ngexesha lenkqubo yokudlulisa i-molding.
Umatshini wokudlulisa ufaka i-epoxy eshushu kwi-mold evaliweyo, ngelixa umatshini woxinzelelo ubeka izinto ngqo kwi-mold evulekileyo ngaphambi kokuba kwenziwe uxinzelelo oluphezulu.
Ewe, oomatshini bokubumba abavavanyiweyo nabalinganisiweyo banokuxhasa ngokuzinzileyo ukupakishwa kwe-IC ephezulu, izixhobo ze-elektroniki zeemoto kunye nokuveliswa kwee-semiconductor.
Oomatshini bokubumba basetyenziswa kakhulu ekupakisheni i-IC, kwii-power semiconductors, kwii-automotive chips, kwii-LEDs, kwii-sensors, kwizixhobo ze-MEMS nakwimveliso ye-electronics yabathengi.
Ewe, sibonelela ngokupakisha okukhuselekileyo kwamanye amazwe, uthutho lwamazwe ngamazwe kunye nokuhanjiswa kwihlabathi liphela kuzo zonke izixhobo zokubumba ze-semiconductor kunye nezokutywina zeplastiki.
Sibonelela ngokufakelwa kwindawo, ukulinganiswa kwesikhunta, ukuseta iiparameter, uqeqesho lwabaqhubi kunye nenkxaso yexesha elide emva kokuthengisa koomatshini bokubumba.
Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?
Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukusungulwa kweTshayina ngetekhnoloji ye-cutting-edge. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".
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