What is a wafer grinder?

A wafer grinder is semiconductor equipment used to thin wafers and remove backside material through controlled grinding.

What is a wafer grinder used for?

It is used for wafer thinning, back grinding, thickness control, surface quality improvement, advanced packaging, MEMS processing, and power semiconductor manufacturing.

What is the difference between wafer grinding and wafer dicing?

Wafer grinding reduces wafer thickness, while wafer dicing separates the wafer into individual chips or dies.

Can I buy a used or refurbished wafer grinder?

Yes. Used and refurbished wafer grinders are suitable for customers who need reliable grinding capability with lower investment.

How do I choose the right wafer grinder?

You should consider wafer size, target thickness, wafer material, TTV requirement, surface quality, automation level, budget, and available support.

Izisombululo zokuGrida zeSemiconductor Wafer

Izisombululo zeWafer Grinder zeSemiconductor Ukuncitshiswa kweWafer kunye nokuGrindzwa komqolo

Iinkqubo ze-wafer grinder ezinokuthenjwa zokunciphisa i-wafer, ukugawula umqolo, ulawulo lwe-TTV, ukugawula kakuhle, ukuphuculwa komgangatho womphezulu, ukupakishwa okuphucukileyo, ii-wafers ze-MEMS, izixhobo zamandla, kunye nokucubungula i-compound semiconductor.

Fumana isicatshulwa seWafer Grinder Jonga izixhobo ezikhoyo

4”–12” Inkxaso yeWafer

Si / SiC / GaN Iinketho zezinto eziphathekayo

Isetyenzisiwe kwaye ihlaziyiwe Ubonelelo lokonga iindleko

Wafer Grinder for Semiconductor Wafer Thinning

Ulawulo lwe-TTV Ukufana kobukhulu be-wafer ezinzileyo kwiinkqubo ezisezantsi

Ukusila Umqolo Ukususwa kwezinto ezingasemva ezilawulwayo ngaphambi kokuba zipakishwe

Imingeni yeNkqubo

Phucula Uzinzo Lokunciphisa I-Wafer kwaye Unciphise Umngcipheko Wokugaywa

Ukusila i-wafer kufuna izixhobo ezizinzileyo, ulungelelwaniso olufanelekileyo lwenkqubo, kunye nokusebenza okuthembekileyo kokuphatha. I-wafer grinder efanelekileyo inceda ukuphucula ukuqina kobukhulu, ukunciphisa umonakalo ongasemva, ukulawula umngcipheko wokuphuka kwe-wafer, kunye nokuxhasa ukulungiswa okuphambili kokupakishwa.

Ubungqingqwa obubi

Izixhobo zokusila ezizinzileyo zinceda ukuphucula ulawulo lwe-TTV kunye nokunciphisa ubukhulu be-wafer obungalinganiyo.

Ukuqhekeka kweWafer Ngexesha Lokuncipha

Ukuzibamba, ukuphatha, kunye nokuzinza kwenkqubo kunceda ekukhuseleni ii-wafers ezincinci ngexesha lokusila.

Umonakalo ongasemva kunye neeMicrocracks

Ukusila kakuhle kunye nokulinganisa inkqubo efanelekileyo kunceda ekunciphiseni uxinzelelo, amabala okusila, kunye nokuqhekeka okuncinci.

Utyalo-mali lweZixhobo eziPhakamileyo

Iigrinder ze-wafer ezisetyenzisiweyo nezihlaziyiweyo zibonelela ngokhetho olusebenzayo lokunciphisa iindleko zeprojekthi.

Ukufanisa Izixhobo

Ukukhethwa kweWafer Grinder Ngokusekelwe kwiimfuno zakho zeNkqubo

Sinceda ekulinganiseni iinkqubo ze-wafer grinder ngokobungakanani be-wafer, uhlobo lwezinto ezisetyenzisiweyo, ubukhulu bethagethi, imfuneko ye-TTV, umgangatho womphezulu, i-output, inqanaba le-automation, kunye nohlahlo-lwabiwo mali olufumanekayo.

Xoxa ngeMfuno yakho

Ukunciphisa iWafer

Iigrinder ze-wafer ezizenzekelayo zokunciphisa ubukhulu obuzinzileyo ngaphambi kokuzisika, ukuzibophelela, okanye ukupakishwa.

Yokugaya Kakuhle

Izisombululo zokusila zigxile ekunciphiseni umonakalo ongasemva, amabala, kunye noxinzelelo lwe-wafer.

KwiiWafers eziQokelelweyo

Izixhobo ezikhethiweyo zeSiC, GaN, GaAs, isafire, kunye nezinye izinto ze-hard wafer.

Utyalo-mali oluphantsi

Iinkqubo ze-wafer grinder ezisetyenzisiweyo nezihlaziyiweyo zeelabhoratri, ii-fabs, kunye nemigca yemveliso exabisa kakhulu.

Izixhobo ezikhoyo

Iintlobo zeeMveliso zeWafer Grinder

Khetha kwiigrinder ze-wafer ezizenzekelayo, oomatshini bokugrinda abangasemva, iinkqubo zokugrinda ezincinci, kunye nezixhobo zegrinder ze-wafer ezihlaziyiweyo ngokwenkqubo yakho ye-wafer kunye neemfuno zakho zemveliso.

Isixhobo sokugaya i-wafer seDISCO DFG8560

I-DISCO DFG8560 sisisombululo esizenzekelayo ngokupheleleyo sokuncitshiswa kwe-wafer ye-intshi ezili-12 esenzelwe imveliso ephezulu.
Jonga isitokhwe kunye nexabiso
Isixhobo sokugaya i-DISCO wafer DGP8761

I-DISCO DGP8761 ngumatshini wokugaya/wokupolisha ozenzekelayo omele eyona nto iphambili kubuchwepheshe bayo, eyilwe...
Jonga isitokhwe kunye nexabiso
Isixhobo sokugaya i-DISCO wafer DFG8541

I-DISCO DFG8541 ngumatshini wokugaya ozenzekelayo ngokupheleleyo owenzelwe ukuhlangabezana neemfuno zokuncitshiswa kwe-8-intshi kunye ne-smalle...
Jonga isitokhwe kunye nexabiso
Isixhobo sokugaya i-wafer seDISCO DFG8830

I-DISCO DFG8830 ngumatshini wokucutha nokugaya ozenzekelayo ngokupheleleyo wezinto eziqinileyo nezibuthathaka, owenziwe yi...
Jonga isitokhwe kunye nexabiso

Inkqubo Yokugaya I-Wafer

Ukusuka Ekugayeni Umqolo Ukuya Ekulungiseleleni I-Wafer Encinci

Isixhobo sokugalela i-wafer esifanelekileyo sixhasa inyathelo ngalinye lenkqubo ukusuka ekususweni kwezinto ezingasemva ukuya ekugayweni okucolekileyo kunye nokuqinisekiswa kobukhulu bokugqibela.

Ukufakelwa kweWafer

I-wafer ifakelwa kwi-tape okanye inamathele kwi-chuck ngaphambi kokuba igrunjwe.

Ukusila Okurhabaxa

Izinto ezingasemva zisuswa ngokukhawuleza ukuze zisondele kubukhulu obufunekayo.

Ukusila Kakuhle

Ukusila kakuhle kuphucula umgangatho womphezulu kwaye kunciphisa umonakalo ongasemva.

Ukuqinisekiswa koBungqingqwa

Ubukhulu bokugqibela, i-TTV, kunye nomgangatho womphezulu ziyajongwa ngaphambi kwenkqubo elandelayo.

Kutheni Khetha Thina

Ubonelelo lweWafer Grinder oluthembekileyo olunenkxaso ejolise kwinkqubo

Izixhobo zokugaya i-wafer ye-semiconductor zixabisa kakhulu. Sinceda abathengi ukunciphisa umngcipheko wokukhetha ngokuthelekisa imeko yezixhobo, uqwalaselo, iimfuno zenkqubo, ixesha lokuhambisa, kunye nohlahlo-lwabiwo mali.

Izixhobo Ezikhethiweyo Kwinkqubo Yakho Yokugalela I-Wafer

Siqwalasela ubungakanani be-wafer, ubulukhuni bezinto, ubukhulu bezinto ekujoliswe kuzo, imfuneko ye-TTV, umgangatho womphezulu, ubungakanani bemveliso, kunye neemfuno zenkqubo esezantsi ngaphambi kokuba sicebise iindlela ezifanelekileyo zokugaya i-wafer.

Iinketho Ezintsha, Ezisetyenzisiweyo Nezihlaziyiweyo

Iindlela zokubonelela eziguquguqukayo kwiibhajethi ezahlukeneyo kunye neeshedyuli zokuhanjiswa.

Ukuhlolwa kweMeko yeZixhobo

Imeko yomatshini, uqwalaselo, kunye nokulungelelaniswa okusisiseko kunokuhlolwa ngaphambi kokuba uthunyelwe.

Ukugxila kwiZixhobo zeSemiconductor

Inkxaso yezixhobo zokusila, ukunqumla, ukucoca, ukuphonononga, ukuvavanya, kunye nokupakisha.

Inkxaso yeHlabathi yokuthumela ngaphandle

Ukupakisha impahla kwamanye amazwe, ukulungelelaniswa kwezinto ezithunyelwa kwamanye amazwe, kunye nenkxaso yokuthunyelwa kwempahla kwamanye amazwe.

Usetyenziso

Izicelo zokuSila iWafer

Ukugaya i-wafer kusetyenziswa kwiinkqubo ze-semiconductor ezifuna ukunciphisa i-wafer elawulwayo, umgangatho ozinzileyo wangasemva, umonakalo omncinci wokugaya, kunye nokulungiselela okuthembekileyo kokupakisha okanye amanyathelo okuvelisa asezantsi.

Ukusila Umqolo Osikiweyo

Ukusila ngasemva kususa izinto ze-wafer ezingasemva ngaphambi kokuzisika, ukuzibophelela, okanye ukuhlanganisa iipakethe. Kunceda ukufezekisa ubukhulu be-wafer obufunekayo ngelixa kuxhasa uzinzo lwenkqubo esezantsi.

Imveliso yeWafer encinci

Iigrinder zewafer zisetyenziselwa ukunciphisa ubukhulu bewafer kwizixhobo ezincinci, iipakethe ezihlanganisiweyo, ukupakishwa okuphucukileyo, kunye nokuhlanganiswa kwe-semiconductor enoxinano oluphezulu.

I-Power Semiconductor

Izixhobo zamandla ezifana nee-IGBTs, iiMOSFETs, iidiode, kunye neemodyuli zamandla zihlala zifuna ukucuthwa kwe-wafer okuzinzileyo kunye nolawulo lomgangatho wangasemva ngaphambi kokupakishwa.

I-Compound Semiconductor

I-SiC, i-GaN, i-GaAs, i-sapphire, kunye nezinye izinto ze-hard wafer zifuna izixhobo ezifanelekileyo zokugaya kunye nokulinganisa inkqubo ukunciphisa umonakalo womphezulu kunye nokuphucula ukuhambelana.

Isikhokelo sokukhetha

Ungayikhetha njani i-Wafer Grinder efanelekileyo?

Ubungakanani beWafer

Qinisekisa ukuba i-grinder iyayixhasa na inkqubo yakho ye-wafer ye-intshi ezi-4, i-intshi ezi-6, i-intshi ezi-8, okanye i-intshi ezili-12.

Ubukhulu Bokujolisa

Ubukhulu bokugqibela obahlukeneyo kunye neemfuno ze-TTV zifuna ulungelelwaniso olwahlukileyo lokusila.

Izinto zeWafer

Iiwafer zeSilicon, iSiC, iGaN, iGaAs, kunye nesafire zifuna iimeko ezahlukeneyo zokusila.

Umgangatho womphezulu

Ukusila kakuhle kunceda ekunciphiseni umonakalo ongasemva, amabala okusila, kunye nokuqhekeka okuncinci.

Inqanaba lokuZenzekelayo

Imigca yemveliso idla ngokufuna ukuphathwa ngokuzenzekelayo, ukuveliswa okuzinzileyo, kunye nexesha eliphantsi lokungasebenzi.

Uhlahlo-lwabiwo mali kunye nexesha lokukhokela

Iigrinder ze-wafer ezisetyenzisiweyo nezilungisiweyo zinokunciphisa utyalo-mali kwaye zinciphise ixesha lokuhambisa.

Iimpawu kunye namaQonga

Iimpawu zeWafer Grinder esinokuzinceda ngazo

DISCO

I-ACCRETECH

Okamoto

ETokyo Seimitsu

I-G&N

I-Revasum

eStrasbaugh

Izinto ezisetyenzisiweyo

FAQ

Imibuzo Ebuzwa Rhoqo Nge-Wafer Grinder

Yintoni i-wafer grinder?

I-wafer grinder sisixhobo se-semiconductor esisetyenziselwa ukucutha ii-wafers nokususa izinto ezingasemva ngokuzigaya ngokulawulwayo.

Isetyenziselwa ntoni i-wafer grinder?

Isetyenziselwa ukunciphisa i-wafer, ukugawula umqolo, ukulawula ubukhulu, ukuphucula umgangatho womphezulu, ukupakishwa okuphucukileyo, ukucubungula i-MEMS, kunye nokuvelisa i-power semiconductor.

Yintoni umahluko phakathi kokugaya i-wafer kunye nokusika i-wafer?

Ukusila i-wafer kunciphisa ubukhulu be-wafer, ngelixa ukunqumla i-wafer kwahlula i-wafer ibe ziitships okanye ii-dies ezahlukeneyo.

Ndingathenga i-wafer grinder esetyenzisiweyo okanye ehlaziyiweyo?

Ewe. Iigrinder ze-wafer ezisetyenzisiweyo nezihlaziyiweyo zifanelekile kubathengi abafuna amandla okusila athembekileyo kunye notyalo-mali oluphantsi.

Ndingayikhetha njani i-wafer grinder efanelekileyo?

Kuya kufuneka uqwalasele ubungakanani be-wafer, ubukhulu bento ekujoliswe kuyo, izinto ze-wafer, imfuneko ye-TTV, umgangatho womphezulu, inqanaba lokwenziwa kwezinto ngokuzenzekelayo, uhlahlo lwabiwo-mali, kunye nenkxaso ekhoyo.

Ngaba ufuna i-Wafer Grinder?

Thumela iMfuneko yakho yokuGcada iWafer uze ufumane iNgcebiso eSebenzayo

Sixelele ubungakanani be-wafer yakho, izinto ezisetyenzisiweyo, ubukhulu bento ekujoliswe kuyo, imfuneko yenkqubo, uhlobo olukhethwayo, uhlahlo lwabiwo-mali, kunye nexesha lokuhambisa. Siza kukunceda ucebise ngeendlela ezifanelekileyo zokugaya i-wafer.

Qhagamshelana nathi