Isixhobo sokugaya i-wafer seDISCO DFG8560

Njengophuculo oluya kuthotho lwe-DFG800, i-DISCO DFG8560 ngumatshini wokucutha i-wafer ozenzekelayo ngokupheleleyo. Yenzelwe ngokukodwa ukuhlangabezana nemingeni yokucutha i-wafer eyi-intshi ezili-12. Umgaqo wayo ophambili wokusebenza usekelwe kulungiselelo lwe-dual-spindle kunye ne-triple-chuck, olugqibezela zombini izigaba "zokugaya okurhabaxa" kunye "nokugaya okucolekileyo" kwenkqubo yokucutha kwi-wafer clamping enye. Olu yilo luphucula kakhulu ukusebenza kakuhle kokucubungula kunye nolawulo oluchanekileyo.

**Umgaqo Wokusebenza**

I-DFG8560 ifezekisa ukuncitshiswa kwe-wafer ngokusebenzisa intshukumo yoomatshini echanekileyo kakhulu:

**Ulwakhiwo Oluqinileyo:** Lo matshini usebenzisa i-spindle enomoya oqinileyo, eqinisekisa uzinzo oluhle kakhulu kulo lonke inkqubo yokusila.

**Inkqubo Yokugaya Enezinyathelo Ezimbini:**

**Ukusila Okurhabaxa:** I-spindle yokuqala isebenzisa ivili elirhabaxa (umz., ivili ledayimani elibotshelelwe yi-resin). Ukujikeleza ngesantya esiphezulu kususa ngokukhawuleza uninzi lwezinto ezikwicala elingasemva le-wafer, nto leyo eyenza ukuba isebenze kakuhle.

**Ukusila Okucolekileyo:** I-spindle yesibini isebenzisa ivili elicolekileyo (umz., ivili ledayimani elibotshelelwe nge-ceramic) ukusila ngokuchanekileyo i-wafer. Le nkqubo idala umphezulu ogudileyo, othe tyaba kwaye isusa umaleko owonakeleyo owenziwe ngexesha lokusila okurhabaxa.

Xa isebenza ngokwenene, i-wafer ibanjwa kwindawo yayo kwi-chuck ejikelezayo ngokufunxa i-vacuum. I-chuck ijikeleza kwicala elichaseneyo nevili lokusila elikhawulezayo; ivili lihamba ngokuthe nkqo liye ezantsi, lisika umphezulu we-wafer.

**Ezona mpawu**

Umsebenzi oyintloko we-DFG8560 kukunciphisa i-wafer. Ngenxa yesi sizathu, idibanisa uthotho lwemisebenzi ephambili:

**Ukusebenza Okuzenzakalelayo Ngokupheleleyo:** Esi sixhobo senza yonke imisebenzi isebenze ngokuzenzekelayo ukusuka ekulayisheni iiwafer, ukulungelelanisa, ukugaya, ukucoca ukuya ekukhupheni izinto, kunciphisa kakhulu ukungenelela ngesandla kunye nokuphucula ukusebenza kakuhle kwemveliso.

**Ulawulo Lobukhulu Oluchanekileyo:** Ngokudibanisa inkqubo yokulinganisa ubukhulu ekwi-intanethi enesisombululo esiphezulu (0.1 μm), izixhobo zifikelela kulawulo oluvaliweyo lwenkqubo yokusila, ziqinisekisa ukuchaneka kobukhulu bokugqibela be-wafer.

**Ukucubungula iWafer eNcinci kakhulu:** Ngokuphucula iiparameter zenkqubo yokugaya nokucubungula, i-DFG8560 inokucubungula ngokuzinzileyo iiwafers ezincinci kakhulu ezinobukhulu obuyi-100 μm okanye ngaphantsi, ngelixa inciphisa umngcipheko wokuqhekeka kwewafer.

**Ukufumanisa Iziphene:** Le nkqubo inokuchonga iziphene kumphezulu we-wafer, inike inkxaso yedatha efunekayo kwiinkqubo zokulungisa ezilandelayo okanye ii-feedback loops.

**Ujongano Olusebenziseka Kakuhle:** Ixhotyiswe nge-LCD yesikrini sokuchukumisa kunye ne-graphical user interface (GUI), inkqubo ibonisa imeko yokucubungula kunye nesixhobo ngexesha langempela, okwenza ukusebenza kunye nokugcinwa kube lula kwaye kube lula ngakumbi.

**Ukuhlanganiswa kunye nokwandiswa kwi-Intanethi:** I-DFG8560 ingadityaniswa ngaphandle komthungo kwimigca yemveliso ezenzekelayo entsonkothileyo, efana nale:

**Inkqubo ye-DBG (Post-Die Grinding):** Idibanisa iinkqubo zokusika kunye nokunciphisa, okwenza ifaneleke ngokukodwa ekwenzeni iitships ezincinci kakhulu.

**Umatshini Wokupolisha Owomileyo (umz., DFP8160):** Yenza inkqubo edibeneyo eyenza ukupolisha okomileyo emva kweenkqubo zokusila, inciphisa ngakumbi uburhabaxa bomphezulu we-wafer (ixabiso le-Ry) kwaye isuse umonakalo obangelwa kukusila.

**I-Wafer Laminator/I-Stripper:** Idityaniswe ukufaka okanye ukususa iifilimu zokupholisha ezikhuselayo ngokuzenzekelayo, okwenza umsebenzi opheleleyo ozenzekelayo.

**Unxibelelwano lwe-SECS/GEM:** Esi sixhobo sixhasa iprotokholi yonxibelelwano lwe-SECS/GEM, evumela uqhagamshelo kwiNkqubo yokuSebenza koMveliso weFactory (MES) ukuze kubekwe esweni kude kunye nokufumana idatha yemveliso ezenzekelayo.

**Izicelo kunye neMisebenzi:**

Umsebenzi oyintloko we-DFG8560 kukubonelela ii-wafers ngobukhulu obufanayo kunye nomgangatho ophezulu womphezulu kwiinkqubo ezilandelayo ezifana nokusika kunye nokupakishwa; ukuhambelana kwayo ngokubanzi kuyenza ifaneleke kwiintlobo ngeentlobo zezicelo.

**Ukuncitshiswa kweWafer:** Ukunciphisa ubukhulu bewafer ukusuka kubukhulu bayo bokuqala ukuya kubukhulu obujoliswe kubo—imfuneko esisiseko phantse kuzo zonke izicelo.

**Ukususwa Kweeleya Zomonakalo:** Ukususa iileya ezonakeleyo ngenxa yoxinzelelo eziveliswa kwiinkqubo ezisezantsi (ezifana nokugaywa ngasemva)—inyathelo elibalulekileyo ekuqinisekiseni amandla oomatshini etshiphu.

**Ukucwangcisa Umphezulu:** Ukubonelela ngesiseko esithe tyaba kakhulu kwiinkqubo ezilandelayo zokuchaneka (ezifana ne-photolithography kunye nokubophelela)—imfuneko yokwenziwa ngokuchanekileyo.

**Ukupakisha kwe-3D kunye nokuKhangela kwi-TSV:** Ukubonelela ngee-wafers ezibhityileyo ezifunekayo ukuze kuphunyezwe ubuchwepheshe be-Through-Silicon Vias (TSV) kunye nokuveza ngokuchanekileyo isiseko sesakhiwo se-TSV—inxalenye ephambili yokupakisha okuphucukileyo.

Ukuveliswa kweZixhobo zamandla kunye neRF: Zisetyenziselwa ukunciphisa i-SiC, i-GaN, kunye nezinye ii-wafers ze-semiconductor ezidityanisiweyo ukunciphisa ukumelana nobushushu kunye nokuphucula ukusasazwa kobushushu.

Ukwenziwa kwesixhobo esibonakalayo kunye nesihluzi: Sisetyenziselwa ukucutha ngokuchanekileyo kunye nokudibanisa izinto eziqinileyo nezibuthathaka ezifana ne-sapphire (i-substrate ye-LED) kunye ne-lithium tantalate/lithium niobate (isihluzi se-RF).

Iinkcukacha ezineenkcukacha

Iinkcukacha Iinkcukacha

Ubungakanani Besixhobo Sokusebenza Esisebenzayo: Φ300 mm (12 intshi). I-Universal chuck ixhasa ii-wafers ze-Φ200 mm/Φ300 mm.

Indlela Yokugaya: Ukujikeleza kwe-wafer ngokujikeleza okude ngaphakathi kokutya.

Ulungelelwaniso lweSpindle: Iispindle ezimbini (ii-axes ezi-2). Ispindle eyakhelwe ngaphakathi eqhutywa yimoto eqhutywa ngumoya engashukumiyo.

Uqwalaselo lweTheyibhile yeChuck: Iitafile ezintathu zechuck, kusetyenziswa inkqubo yetafile ejikelezayo. Isantya seChuck: 0-300 rpm.

Amandla eSpindle: Isiphumo esilinganiswe yi-4.8 kW.

Isantya seSpindle: 1,000 - 4,000 min⁻¹ (rpm).

Uhambo lwe-Z-axis: 120 mm (kuquka nemvelaphi).

Izinga lokutya lokusila le-Z-axis: 0.0001 - 0.08 mm/s (0.1 - 80 μm/s).

Ubuncinane bokuhamba kwe-Z-axis: 0.1 μm.

Uluhlu lokulinganisa ubukhulu: 0 - 1,800 μm.

Isisombululo sokulinganisa ubukhulu: 0.1 μm.

Ukuphindaphinda komlinganiselo wobukhulu: ± 0.5 μm.

Iinkcukacha zevili lokusila: Ivili lokusila ledayimani le-Φ300 mm.

Ukuphambuka kobukhulu be-intra-wafer (TTV): Ngaphantsi kwe-3.0 μm (kusetyenziswa itafile yokusebenza ekhethekileyo, i-wafer ye-φ300 mm).

Ukuphambuka kobukhulu phakathi kwewafer: Ngaphantsi kwe ±3.0 μm.

Uburhabaxa bomphezulu emva kokugqiba: I-Ry malunga ne-0.13 μm (kusetyenziswa ivili lokusila elingu-#2000); I-Ry malunga ne-0.15 μm (kusetyenziswa ivili lokusila elingu-#1400).

Ubukhulu bezixhobo (W × D × H): Malunga ne-1,400 × 3,190 × 1,800 mm.

Ubunzima bezixhobo: Malunga ne-4,000 kg.

Amandla afunekayo: Isigaba sesithathu 200/220/380/400 V, 50/60 Hz, ukusetyenziswa kwamandla okuphezulu malunga ne-22 kVA.

Umoya ocinezelweyo ofunekayo: Ngaphezulu kwe-0.5 MPa, ucocekile kwaye awunayo ioyile, inqanaba lombethe lingaphantsi kwe--15℃, izinga lokuhamba kwamanzi limalunga ne-1,000 NL/min.

Iimfuno zobonelelo lwamanzi: Amanzi e-DI (amanzi acocekileyo), ubushushu obuyi-23±1℃, izinga lokuhamba kwamanzi yi-6-10 L/min.

Iingenelo ezingundoqo

I-DFG8560 iyaqhubeka nokuqinisa isikhundla sayo semarike njengesixhobo sokunciphisa iiwafer esisebenza kakuhle, kwaye ezi zibonelelo zilandelayo:

Ukuchaneka okuphezulu kokusila: Ngoyilo olucwangcisiweyo, umgangatho wokusila uphuculwa ngempumelelo, kufezekisa ukufana okuhle kakhulu kobukhulu be-intra-wafer (TTV) kunye nokungaguquguquki kwe-inter-wafer, okuqinisekisa ukusebenza kakuhle kwiinkqubo ezifuna amandla ezifana nokupakishwa okuphucukileyo.

Umgangatho Wokugaya Ozinzileyo: Iiparamitha zokugaya nokuphatha ezilungiselelweyo zivumela ukugaya kwe-wafer okuzinzileyo okuncinci kakhulu, okulawula ngempumelelo izinga lokuphuka, nto leyo ibalulekileyo kwii-wafer ezinkulu ezinexabiso eliphezulu.

Ubuchule bokuKhula obuPhezulu: Ibonelela ngobuninzi beendlela zokudibanisa ezikwi-intanethi (ezifana ne-DBG kunye nokupholisha okomileyo), ihlengahlengisa ngokulula ukuphuculwa kwemigca yemveliso kwaye ikhusela ngokupheleleyo utyalo-mali lwabasebenzisi.

Ukuhambelana Okuqinileyo: Iyakwazi ukuphatha izinto ezahlukeneyo (ezifana nesilicon, iSiC, iGaN, iSapphire, iLT/LN), ibonelela ngokuguquguquka okukhulu kwenkqubo yokwenza ii-semiconductors ezahlukeneyo kunye nezixhobo ze-optoelectronic.

Kulula ukuyisebenzisa kwaye kulula ukuyigcina: I-GUI kunye nesikrini sokuchukumisa esisebenziseka lula ziyawunciphisa kakhulu umda wokusebenza. Okwangoku, izinto eziphambili zinokutshintshana nothotho lwe-800, nto leyo enciphisa iindleko zempahla yezinto ezingasetyenziswayo kunye nemingcipheko yexesha lokungasebenzi.

Uyilo oluKhawulezayo: Ukunciphisa ubunzima obuziitoni ezili-1.0 (malunga nama-20%) kufezekisiwe ngelixa kugcinwa iinkcukacha kunye nokusebenza. Izixhobo ezikhaphukhaphu zenza lula inkqubo yokufaka kwaye zinciphise iimfuno zokuthwala umthwalo kumgangatho wefektri.

Isishwankathelo seempawu zobugcisa: Uyilo lwekomityi yokufunxa emithathu ene-Dual-Axis: Yahlula ukugaywa okurhabaxa nokugaywa okucolekileyo, ikwenza kube kanye xa ibotshelelwa, iphucula ukusebenza kakuhle ngelixa iqinisekisa ukuchaneka.

I-spindle enomoya oqinileyo: Isebenzisa i-spindle enomoya oqinileyo, olu yilo lususa unxibelelwano loomatshini, nto leyo ebangela ukuguguleka okuncinci kwaye igcine ukuchaneka okuphezulu kokujikeleza ixesha elide. Yinto ephambili ekufezekiseni ukuchaneka okuphezulu kakhulu koomatshini.

Iteknoloji yokulungelelanisa iindawo zokusila ezimbini: Le teknoloji ivumela iispindle ezimbini ukuba zabelane ngendawo efanayo yokusila ngokwasemzimbeni, isusa iimpazamo ezicwangcisiweyo ezibangelwa kukungalungelelani kweendawo zokusila. Oku ngaxeshanye kuphucula ukufana kobukhulu (TTV) ngaphakathi kwe-wafer enye kunye nokuhambelana kobukhulu phakathi kwee-wafer, okwenza kube yiteknoloji ephambili yokufezekisa ukusila okuzinzileyo nokuncinci kakhulu.

Isishwankathelo: Ukuqukumbela, i-DISCO DFG8560 sisisombululo sokuncitshiswa kwe-wafer esiyi-12-intshi esizenzekelayo ngokupheleleyo esenzelwe ukuvelisa ngobuninzi. Iimpawu zayo eziphambili ziquka uyilo oluchanekileyo lwe-dual-spindle kunye nozinzo oluphezulu lwenkqubo, okuvumela ukufana okuphezulu kunye nomgangatho womphezulu xa kusetyenzwa ii-wafer ezinkulu, ezincinci kakhulu, kunye nobuchule obunamandla bokudibanisa i-automation.