DISCO DFG8560 ekyuma ekikuba wafer

Nga okulongoosa ku DFG800 series, DISCO DFG8560 kyuma ekigonza wafer ekikola mu bujjuvu. Ekoleddwa mu ngeri ey’enjawulo okusobola okugumira okusoomoozebwa kw’okugonza wafer eya yinsi 12. Enkola yaayo enkulu eyesigamiziddwa ku nsengeka ya dual-spindle ne triple-chuck, okumaliriza emitendera gyombi egya "rough grinding" ne "fine grinding" egy'enkola y'okugonza mu nkola emu ey'okusiba wafer. Dizayini eno erongoosa nnyo obulungi bw’okukola n’okufuga obulungi.

**Omusingi gw'emirimu**

DFG8560 etuuka ku kugonza wafer ng’eyita mu ntambula y’ebyuma ey’obutuufu obw’amaanyi:

**Ensengekera y’obugumu obw’amaanyi:** Ekyuma kino kikozesa ekyuma ekiyitibwa ‘high-rigidity air-bearing spindle’, ekikakasa nti kinywevu bulungi mu nkola yonna ey’okusena.

**Enkola y'okusena ey'emitendera ebiri:**

**Rough Grinding:** Spindle esooka ekozesa nnamuziga ya coarser-grit (okugeza, nnamuziga ya dayimanda eriko resin-bonded). Okuzimbulukuka ku sipiidi ey’amaanyi kuggya mangu ebintu ebisinga obungi ku ludda olw’emabega olwa wafer, ne kiyamba okukola obulungi.

**Okusiiga Ennungi:** Omusipi ogwokubiri gukozesa nnamuziga esinga okubeera ennungi (okugeza, nnamuziga ya dayimanda eyungiddwa ku seramu) okusena obulungi wafer. Enkola eno ekola ekifo ekiweweevu, ekipapajjo era n’eggyawo oluwuzi olwonoonese olukolebwa mu kiseera ky’omutendera gw’okusena ogw’obukalu.

Mu nkola entuufu, wafer ekwatibwa mu kifo ku chuck ekyukakyuka nga eyita mu kusonseka mu vacuum. Chuck yeekulukuunya mu kkubo ery’ekikontana ne nnamuziga esika ku sipiidi ey’amaanyi; nnamuziga etambula mu vertikal wansi, n’esala ku ngulu wa wafer.

**Ebikulu Ebirimu**

Omulimu omukulu ogwa DFG8560 kwe kugonza wafer. Ku nsonga eno, egatta emirimu emikulu egy’enjawulo:

**Fully Automated Operation:** Ekyuma kino kikola emirimu gyonna mu ngeri ey’otoma okuva ku kutikka wafer, okugikwataganya, okugisenya, okuyonja okutuuka ku kutikkula, ekikendeeza nnyo ku kuyingirira mu ngalo n’okutumbula obulungi bw’okufulumya.

**High-Precision Thickness Control:** Nga tugatta enkola ey’okupima obuwanvu ku yintaneeti ey’obulungi obw’amaanyi (0.1 μm), ebyuma bituuka ku kufuga okuggaddwa-loop enkola y’okusena, okukakasa obutuufu bw’obuwanvu bwa wafer obusembayo.

**Okulongoosa Wafer Ennyo:** Nga elongoosa enkola y’okusena n’okulongoosa, DFG8560 esobola okulongoosa mu ngeri ennywevu wafers ezigonvu ennyo nga zirina obuwanvu bwa 100 μm oba wansi, ate ng’ekendeeza ku bulabe bw’okumenya wafer.

**Okuzuula obulema:** Enkola eno esobola okuzuula obulema ku wafer surface, okuwa obuyambi bwa data obwetaagisa ku nkola z’okuddaabiriza eziddako oba feedback loops.

**Enkolagana enyangu okukozesa:** Nga eriko touchscreen LCD ne graphical user interface (GUI), enkola eno eraga embeera y’okukola n’ebyuma mu kiseera ekituufu, ekifuula enkola n’okuddaabiriza okwangu era okunyangu.

**Okugatta n’okugaziya ku mutimbagano:** DFG8560 esobola okugattibwa mu ngeri etali ya buzibu mu layini z’okufulumya ez’otoma ezisingako obuzibu, gamba nga:

**DBG (Post-Die Grinding) System:** Egatta enkola ya dicing n’okugonza, ekigifuula esaanira naddala okukola chips ezigonvu ennyo.

**Ekyuma ekikalu (okugeza, DFP8160):** Kikola enkola ekwataganye ekola okusiimuula okukalu oluvannyuma lw’enkola z’okusiiga, okwongera okukendeeza ku bukaluba bw’okusiiga wafer (Ry value) n’okumalawo okwonooneka okuva mu kusena.

**Wafer Laminator/Stripper:** Eyungiddwa okusiiga oba okuggyawo firimu ezikuuma ezisiimuula mu ngeri ey’otoma, okukola enkola y’emirimu mu ngeri ey’otoma mu bujjuvu.

**Empuliziganya ya SECS/GEM:** Ekyuma kino kiwagira enkola y’empuliziganya eya SECS/GEM, esobozesa okuyungibwa ku nkola y’okukola ebintu mu kkolero (MES) okulondoola okuva ewala n’okufuna ebikwata ku bikolebwa mu ngeri ey’obwengula.

**Enkozesa n'Emirimu:**

Omulimu omukulu ogwa DFG8560 kwe kuwa wafers obuwanvu obufaanagana n’omutindo omulungi ogw’okungulu ku nkola eziddako nga dicing n’okupakinga; okukwatagana kwayo okw’ebintu ebigazi nakyo kigifuula esaanira okukozesebwa mu ngeri ez’enjawulo.

**Wafer Thinning:** Okukendeeza ku buwanvu bwa wafer okuva ku buwanvu bwayo obw’olubereberye okutuuka ku buwanvu obugendereddwamu-ekyetaagisa ekikulu kumpi mu kukozesebwa kwonna.

**Okuggyawo layeri eyonoonese:** Okumalawo layers ezonoonese olw’okunyigirizibwa ezikolebwa mu nkola ez’okungulu (nga okusena emabega)—omutendera omukulu ennyo mu kukakasa amaanyi g’ebyuma aga chip.

**Surface Planarization:** Okuwa substrate empanvu ennyo ku nkola entuufu eziddako (nga photolithography ne bonding)—ekyetaagisa okusooka okukola ebintu mu ngeri entuufu.

**Okupakinga 3D n’Okubikkula TSV:** Okuwa wafers ennyimpi ezeetaagisa okutegeera tekinologiya wa Through-Silicon Vias (TSV) n’okubikkula ddala wansi w’ensengekera ya TSV—ekitundu ekikulu eky’okupakinga okw’omulembe.

Okukola ebyuma by’amaanyi ne RF: Ekozesebwa okugonza SiC, GaN, n’ebirungo ebirala ebiyitibwa ‘compound semiconductor wafers’ okukendeeza ku kuziyiza (on-resistance) n’okulongoosa okusaasaana kw’ebbugumu.

Okukola ebyuma ebirabika n’okusengejja: Ekozesebwa mu kugonza mu ngeri entuufu n’okufuula ebintu ebikalu n’ebimenyamenya nga safiro (LED substrate) ne lithium tantalate/lithium niobate (RF filter).

Ebikwata ku nsonga eno mu bujjuvu

Ebikwata ku nsonga Ebikwata ku nsonga eno

Sayizi y’ekintu ekikola: Φ300 mm (yinsi 12). Universal chuck ewagira Φ200 mm/Φ300 mm wafers.

Enkola y’okusena: Okukyusa wafer longitudinal in-feed grinding.

Ensengeka ya Spindle: Ebiwujjo bibiri (2 axes). Yazimbibwamu ekyuma ekiziyiza empewo okutambula nga kivuga mmotoka ya firikwensi eya waggulu.

Okusengeka emmeeza ya Chuck: Emmeeza za chuck ssatu, nga tukozesa enkola ya rotary table. Sipiidi ya Chuck: 0-300 rpm.

Amaanyi ga Spindle: Amaanyi ga 4.8 kW.

Sipiidi ya Spindle: eddakiika 1,000 - 4,0001 (rpm).

Okutambula kwa Z-axis: mm 120 (nga mw’otwalidde n’ensibuko).

Omuwendo gw’emmere y’okusena mu Z-axis: 0.0001 - 0.08 mm/s (0.1 - 80 μm/s).

Entambula ya Z-axis esinga obutono: 0.1 μm.

Obuwanvu bw’okupima: 0 - 1,800 μm.

Okupima obuwanvu okusalawo: 0.1 μm.

Okupima obuwanvu okuddiŋŋana: ±0.5 μm.

Ebikwata ku nnamuziga y’okusena: Φ300 mm nnamuziga y’okusena dayimanda.

Okukyama obuwanvu mu wafer (TTV): Tekiri wansi wa 3.0 μm (nga tukozesa emmeeza y’emirimu eyetongodde, φ300 mm wafer).

Okukyama kw’obuwanvu wakati wa wafer: Wansi wa ±3.0 μm.

Obukaluba ku ngulu oluvannyuma lw’okumaliriza: Ry nga 0.13 μm (nga okozesa #2000 grinding wheel); Ry nga 0.15 μm (nga okozesa #1400 grinding wheel).

Ebipimo by’ebyuma (W × D × H): Nga mm 1,400 × 3,190 × 1,800.

Obuzito bw’ebyuma: Kiro nga 4,000.

Amaanyi ageetaagisa: Three-phase 200/220/380/400 V, 50/60 Hz, amaanyi agasinga okukozesebwa nga 22 kVA.

Empewo enyigirizibwa eyeetaagisa: Waggulu wa 0.5 MPa, nnyonjo era terimu mafuta, ekifo ky’omusulo wansi wa -15°C, omutindo gw’okukulukuta nga 1,000 NL/min.

Ebyetaago by’amazzi: Amazzi ga DI (amazzi agataliimu ayoni), ebbugumu 23±1°C, omutindo gw’okukulukuta 6-10 L/min.

Ebirungi Ebikulu

DFG8560 ekyagenda mu maaso n’okunyweza ekifo kyayo ku katale ng’ekyuma ekikola obulungi ennyo mu kugonza wafer nga kirimu ebirungi bino wammanga:

Obutuufu bw’okusiiga obw’amaanyi: Okuyita mu dizayini erongooseddwa, omutindo gw’okusiiga gulongoosebwa bulungi, okutuuka ku buwanvu obulungi obw’omu wafer (TTV) n’obutakyukakyuka wakati wa wafer, okukakasa omulimu gw’emirimu egyetaagisa ng’okupakinga okw’omulembe.

Omutindo gw’okusiiga ogunywevu: Enkola z’okusena n’okukwata ezirongooseddwa zisobozesa okusena kwa wafer okunywevu ennyo, okufuga obulungi omutindo gw’okumenya, ekintu ekikulu ennyo ku wafers ez’omuwendo omunene.

Superior Scalability: Ewa obugagga bw’enkola z’okugatta mu layini (nga DBG ne dry polishing), okukyusakyusa mu ngeri ekyukakyuka n’okulongoosa layini y’okufulumya n’okukuuma mu bujjuvu ssente z’abakozesa.

Okukwatagana okw’amaanyi: Esobola okukwata ebintu eby’enjawulo (nga silicon, SiC, GaN, sapphire, LT/LN), okuwa enkola ey’amaanyi okukyusakyusa mu kukola semiconductors ez’enjawulo n’ebyuma eby’amasannyalaze ag’amaaso.

Enyangu okukozesa era nnyangu okulabirira: GUI enyangu okukozesa ne touchscreen bikendeeza nnyo ku mutindo gw’okukola. Mu kiseera kino, ebitundu ebikulu bikyusibwakyusibwa ne 800 series, ekikendeeza ku ssente z’okutereka sipeeya n’obulabe bw’okuyimirira.

Enteekateeka y’obuzito obutono: Okukendeeza ku buzito bwa ttani 1.0 (nga 20%) kwatuukibwako nga bakuuma ebiragiro n’omutindo. Ebyuma bino ebiweweevu byanguyiza enkola y’okussaako era bikendeeza ku byetaago by’okusitula emigugu wansi w’ekkolero.

Ebintu eby’ekikugu Mu bufunze: Dual-Axis Three-Suction Cup Design: Yawula okusena okutali kwa maanyi n’okusena okulungi, okubimaliriza mu nkola emu ey’okusiba, okulongoosa obulungi ate ng’ekakasa nti bituufu.

Air-static spindle: Nga ekozesa air-static spindle, dizayini eno emalawo okukwatagana kw’ebyuma, ekivaamu okwambala okutono n’okukuuma obutuufu bw’okuzimbulukuka obw’amaanyi okumala ebbanga eddene. Ye kitundu ekikulu okutuuka ku ultra-high machining precision.

Tekinologiya wa Dual grinding point alignment: Tekinologiya ono asobozesa spindles bbiri okugabana ekifo kye kimu eky’okusiiga mu mubiri, ekimalawo ensobi entegeke eziva ku processing point misalignment. Kino mu kiseera kye kimu kitereeza obugumu obukwatagana (TTV) munda mu wafer emu n’okukwatagana kw’obugumu wakati wa wafers, ekigifuula tekinologiya omukulu okutuuka ku stable ultra-thin grinding.

Mu bufunze: Mu kumaliriza, DISCO DFG8560 ye nkola ya yinsi 12 ey’okugonza wafer ekoleddwa mu ngeri ey’otoma mu bujjuvu. Ebintu byayo ebikulu mulimu enzimba entuufu ey’ebipimo bibiri n’okutebenkera kw’enkola okw’omutindo ogw’awaggulu, okusobozesa okubeera n’omutindo ogw’oku ntikko ogw’oku ntikko n’omutindo gw’okungulu ng’okola ku wafers ennene, ezigonvu ennyo, wamu n’obusobozi obw’amaanyi obw’okugatta otomatiki.