Ekyuma ekikuba wafer ekya DISCO DGP8761

DISCO DGP8761 kyuma ekisekula/okusiimuula mu bujjuvu nga kikiikirira entikko ya tekinologiya waakyo, ekyakolebwa naddala mu nkola z’okugonza wafer eza yinsi 12 (mm 300) ezikola obulungi. Ekintu kyayo ekikulu bwe busobozi bwayo okumaliriza enkola yonna —okuva ku kusena okukaluba ku ludda lw’emabega n’okusena okulungi okutuuka ku kuggyawo situleesi —mu kukola omulundi gumu, okutambula obutasalako, okulongoosa buli kiseera wafers okutuuka ku buwanvu obugonvu ennyo wansi wa 25μm.

Nga okulongoosa mu butongole okutuuka ku DGP8760 emanyiddwa ennyo era esinga okutunda, yeewaanira ku mutindo gw’okutunda ogw’enjawulo mu bakola ebintu eby’oku ntikko mu nsi yonna era nga kye kimu ku byuma ebikulu ennyo mu kupakinga eby’omulembe, ebyuma ebikozesa amaanyi, n’enkola endala ezeetaaga okukola wafer ezigonvu ennyo.

Hardware Core: Obuyiiya n’enkulaakulana y’enkola ya Three-Axis Design

Omusingi gw’enkulaakulana y’omutindo gwa DGP8761 guli mu nsengeka yaayo entuufu ey’ensengekera ssatu (3 axes) ne four-chuck-tables (4 chuck tables).

Ekitongole ky’abakozi eky’emisingi esatu:

Z1 Axis (Rough Grinding): Evunaanyizibwa ku kuggya amangu ebintu ebisinga obungi ku ludda olw’emabega olwa wafer.

Z2 Axis (Fine Grinding): Ekola okusena okulungi ku wafer surface, okutuuka ku kufuga obuwanvu obutuufu.

Z3 Axis (Versatile Processing): Kino kye kisumuluzo ky’okukyukakyuka kwayo. Abakozesa basobola okulonda dry polishing (stress relief), ultra-precision grinding (Poligrind/UltraPoligrind), oba modules ez’enjawulo eza CMP okutuuka ku kuggyawo stress, okuggyawo getter, n’emirimu emirala, okusinziira ku byetaago by’enkola.

Spindle Empya Ekoleddwa: Spindle empya ewagira okusena ku sipiidi ey’amaanyi, mu ngeri ennungi ekendeeza ku budde bw’okulongoosa wafers ennyimpi. Mu kiseera kye kimu, ensengeka y’entambula erongooseddwa ekendeeza ku budde obutakola, okulongoosa obulungi okutwalira awamu.

Ebikwata ku mutindo gwa Spindle ogw'oku ntikko:

Z1/Z2 Axis: Amaanyi ga spindle geeyongedde okutuuka ku kW 6.3, sipiidi 1,000 - 4,000 min−1, Z-axis okutambula mm 120.

Z3 Axis: Amaanyi ga spindle 5.3 kW, Z-axis okutambula mm 65.

Z-Axis Accuracy: Vertical feed rate ya 0.0001 - 0.08 mm/s, okutambula okutono okwa 0.1 μm kukakasa obutuufu bw’ebyuma.

Ebikwata ku nsonga eno mu bujjuvu Okulaba

Ekika kya Parameter | Ebiraga Ebitongole

Sayizi y’ekintu ekikola: Φ200 mm / Φ300 mm (yinsi 8 / yinsi 12)

Enkola y’okusena: Z1/Z2 Axis: Okusena mu mmere (okukyusakyusa wafer) .

Z3 Axis: Okusena mu mmere etali ya bulijjo (okukyusakyusa wafer okw’enjawulo) .

Ensengeka ya Spindle: Spindle ssatu (embazzi 3) .

Ensengeka y’emmeeza y’emirimu: Emmeeza za chuck nnya (emmeeza za chuck 4), nga tukozesa enkola y’emmeeza ezikyukakyuka

Ebikozesebwa mu kusena/okusiimuula: Z1/Z2 Ekisiki: Φ300 mm nnamuziga y’okusena dayimanda

Z3 Axis (DP): Φ450 mm paadi enkalu ey’okusiimuula

Z3 Axis (CMP): Φ450 mm CMP paadi y’okusiimuula

Ebipimo by’ebyuma: mm 1,690 (W) × mm 3,315 (D) × mm 1,800 (H)

FOUP Omutindo ogussiddwako: × mm 3,452 (D)

Obuzito bw’Ebyuma: Nga. kkiro 6,700 (DP, ensengeka ya Poligrind)

Nga. kkiro 6,900 (ensengeka ya CMP) .

Amaanyi Ageetaagisa: Amaanyi ga phase ssatu 200/220/380/400 V, 50/60 Hz

Empewo Enyigirizibwa: Esukka 0.5 MPa, nnyonjo era terimu mafuta, omusulo guli wansi wa -15°C

Emirimu emikulu n’Ebirungi ebiri mu nkola:

Okuvuganya okukulu okwa DGP8761 kuli mu kugatta kwayo obulungi enkola eziwera, okutuuka ku "1+1>2" effect.

One-Stop Solution: Okuyita mu mukono gwa robotic ogw’omunda, wafer esobola okumaliriza mu ngeri ey’otoma enkola yonna ey’okusena okutali kwa maanyi → okusena obulungi → okusiimuula okukalu → okuyonja n’okukaza, okwewala obulabe bw’okukutukakutuka obuva ku kukwata emirundi mingi n’okukendeeza ennyo ku nsengekera y’okufulumya. DGP8761 esobola okutuuka ku buli kiseera enkyukakyuka mu buwanvu bwonna (TTV) obutasukka 3μm ate ng’ekuuma amaanyi g’okubeebalama aga waggulu.

Dry Polishing ne Gooey Pickup (Getting): Kino kye kimu ku bintu ebisinga okusiimibwa mu DGP8761. Ekozesa Z3-axis dry polishing okuggyawo grinding stress layer, nga kino tekikoma ku kukuuma butonde okusinga enkola ez’ennono ennyogovu (tewali ddagala oba mazzi gakozesebwa), naye era ekola layer micro-damage efugibwa munda mu wafer, ekola nga "getter zone" okukwata obucaafu bw'ebyuma, okulongoosa amakungula n'okwesigamizibwa kwa chip. Tekinologiya wa DISCO ow’enjawulo owa UltraPoligrind micro-abrasive akuuma getter effect ate ng’atuuka ku maanyi ga chip aga waggulu agaali tegatuukirizibwa.

Ensengeka ekyukakyuka n’enkola y’okukozesa

DGP8761 si kyuma ekyetongodde; esobola okwegatta awatali buzibu mu nkola ez’enjawulo ez’okukola otomatiki.

Okugaziya okuyungibwa: Kisobola okuyungibwa ku DFM2800 multi-functional wafer attacher okusobola okusiba obutereevu DAF (Die Attach Film) oluvannyuma lw’okugonza. Era esobola okukozesebwa okuzimba enkola z’enkola ez’omulembe nga DBG (Dicing Before Grinding) okutumbula amakungula ga wafers ennyimpi.

Okuddaabiriza ne Sipeeya: Ekwatagana ne DISCO Series 8000 ekuuma okukwatagana kwa waggulu, ng’ebitundu ebikulu nga nnamuziga ezisenya n’ebipande ebisiba bikyusibwakyusibwa, ekyanguyiza okuddaabiriza n’okukendeeza ku ssente za sipeeya.

Sofutiweya n’enkola: Nga tukozesa enkola ya GUI eyesigamiziddwa ku tekinologiya wa 8000 series akuze, enzikiriziganya y’emirimu ey’omuggundu ekendeeza ku budde bw’okutendekebwa kw’omukozi.

Ekifo ky’akatale n’okukozesa: DGP8761 ekozesebwa nnyo mu kupakinga okw’omulembe (HPC/AI/3D IC), semiconductor z’amaanyi, n’ebyuma bya MEMS. DISCO era ekola emirimu gy’okukola dicing ne grinding foundry nga ekozesa ekyuma kino mu bifo byayo ebya tekinologiya mu nsi yonna (nga mu China ne Singapore).

Ebirina okulowoozebwako mu ndabirira: Okukakasa nti bituufu, okunywerera ennyo ku DISCO ebyetaago by’obutonde (ebbugumu n’obunnyogovu mu ±1°C, empewo ennyonjo enyigirizibwa) n’ebikozesebwa kyetaagisa. Ekirala, enzikiriziganya y’entambula y’ekisiki kya Z3 (nga mw’otwalidde n’ensengekera z’ebyuma 5 n’ebipimo by’ekifo) ekosa butereevu amakungula g’ebyuma; ensengeka za parameter ezitali ntuufu ziyinza okuvaako obuzibu mu nkola.

Mu bufunze: DISCO DGP8761 kyuma kya mutindo gwa waggulu eky’okusenya/okusiimuula ekigatta obulungi obutuufu obw’amaanyi, okukola obulungi ennyo, n’okukyukakyuka mu nkola. Tekoma ku kuggulawo kkubo lya kukola chip ez’omulembe ezigonvu ennyo naye era, okuyita mu nkola yaayo ey’amaanyi ey’okulinnyisa enkola, efuuka ekitundu ekikulu mu kuzimba amakolero ag’omulembe aga semiconductor smart. Ku bakola ebintu abakulembedde abanoonya omulimu ogw’oku ntikko n’okutebenkera kw’enkola, kikiikirira okuteeka ssente mu nteekateeka ez’amaanyi.