DISCO wafer grinder DGP8761

The DISCO DGP8761 is a fully automated grinding/polishing machine representing the pinnacle of its technology, designed specifically for high-efficiency 12-inch (300mm) wafer thinning processes. Its key feature is its ability to complete the entire process—from back-side rough grinding and fine grinding to stress removal—in a single, continuous operation, consistently processing wafers to ultra-thin thicknesses below 25μm.

As the official upgrade to the well-known and best-selling DGP8760, it boasts outstanding sales performance among top manufacturers worldwide and is a crucial piece of equipment for advanced packaging, power devices, and other processes requiring ultra-thin wafer fabrication.

Hardware Core: The Ingenuity and Evolution of the Three-Axis Design

The core of the DGP8761's performance evolution lies in its precise three-axis (3 axes) and four-chuck-tables (4 chuck tables) architecture.

Three-Axis Division of Labor:

Z1 Axis (Rough Grinding): Responsible for quickly removing most of the material from the back side of the wafer.

Z2 Axis (Fine Grinding): Performs fine grinding on the wafer surface, achieving precise thickness control.

Z3 Axis (Versatile Processing): This is key to its flexibility. Users can select dry polishing (stress relief), ultra-precision grinding (Poligrind/UltraPoligrind), or special CMP modules to achieve stress removal, getter removal, and other functions, depending on process requirements.

Newly Developed Spindle: The new spindle supports high-speed grinding, effectively shortening the processing time for thin wafers. Simultaneously, the optimized transport layout reduces non-processing time, improving overall efficiency.

Higher Spindle Performance Specifications:

Z1/Z2 Axis: Spindle power increased to 6.3 kW, speed 1,000 - 4,000 min⁻¹, Z-axis travel 120 mm.

Z3 Axis: Spindle power 5.3 kW, Z-axis travel 65 mm.

Z-Axis Accuracy: Vertical feed rate of 0.0001 - 0.08 mm/s, minimum travel of 0.1 μm ensures machining accuracy.

Detailed Specifications Overview

Parameter Category | Specific Indicators

Applicable Workpiece Size: Φ200 mm / Φ300 mm (8 inches / 12 inches)

Grinding Method: Z1/Z2 Axis: In-feed grinding (wafer rotation)

Z3 Axis: Anomalous in-feed grinding (special wafer rotation)

Spindle Configuration: Three spindles (3 axes)

Worktable Configuration: Four chuck tables (4 chuck tables), using a rotary table system

Grinding/Polishing Tools: Z1/Z2 Axis: Φ300 mm diamond grinding wheel

Z3 Axis (DP): Φ450 mm dry polishing pad

Z3 Axis (CMP): Φ450 mm CMP polishing pad

Equipment Dimensions: 1,690 mm (W) × 3,315 mm (D) × 1,800 mm (H)

FOUP Mounted Model: × 3,452 mm (D)

Equipment Weight: Approx. 6,700 kg (DP, Poligrind configuration)

Approx. 6,900 kg (CMP configuration)

Power Requirements: Three-phase 200/220/380/400 V, 50/60 Hz

Compressed Air: Above 0.5 MPa, clean and oil-free, dew point below -15℃

Core Functions and Process Advantages:

The core competitiveness of the DGP8761 lies in its successful integration of multiple processes, achieving a "1+1>2" effect.

One-Stop Solution: Through an internal robotic arm, the wafer can automatically complete the entire process of rough grinding → fine grinding → dry polishing → cleaning and drying, avoiding the risk of fragmentation caused by multiple handling and significantly shortening the production cycle. The DGP8761 can consistently achieve a total thickness variation (TTV) of less than 3μm while maintaining high bending strength.

Dry Polishing and Gooey Pickup (Getting): This is one of the most acclaimed features of the DGP8761. It utilizes Z3-axis dry polishing to remove the grinding stress layer, which is not only more environmentally friendly than traditional wet processes (no chemicals or water used), but also creates a controllable micro-damage layer inside the wafer, acting as a "getter zone" to capture metallic impurities, improving yield and chip reliability. DISCO's unique UltraPoligrind micro-abrasive technology retains the getter effect while achieving previously unattainable high chip strength.

Flexible Configuration and Application Ecosystem

The DGP8761 is not an isolated device; it can seamlessly integrate into various automation systems.

Connectivity Expansion: It can be connected to the DFM2800 multi-functional wafer attacher for direct DAF (Die Attach Film) attachment after thinning. It can also be used to build advanced process systems such as DBG (Dicing Before Grinding) to improve the yield of thin wafers.

Maintenance and Spare Parts: Compatible with DISCO The 8000 series maintains high compatibility, with key components such as grinding wheels and dressing plates being interchangeable, facilitating maintenance and reducing spare parts costs.

Software and Operation: Utilizing a GUI interface based on mature 8000 series technology, the unified operating logic shortens operator training time.

Market Position and Applications: The DGP8761 is widely used in advanced packaging (HPC/AI/3D IC), power semiconductors, and MEMS devices. DISCO also provides dicing and grinding foundry services using this equipment in its global technology centers (such as in China and Singapore).

Maintenance Considerations: To ensure accuracy, strict adherence to DISCO's environmental (temperature and humidity within ±1°C, clean compressed air) and consumable requirements is essential. Furthermore, the Z3 axis motion logic (including 5 machining sequences and position parameters) directly impacts machining yield; improper parameter settings can lead to process problems.

Summary: DISCO The DGP8761 is a high-end grinding/polishing machine that perfectly combines high precision, high efficiency, and process flexibility. It not only paves the way for cutting-edge ultra-thin chip manufacturing but also, through its powerful system scalability, becomes a core component in building advanced semiconductor smart factories. For leading manufacturers seeking the highest performance and process stability, it represents a significant strategic investment.