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The core pick-and-place module of the sorter is responsible for chip transfer
The main function of the control card is to receive instructions from the host computer, plan multi-axis movements (such as the XYZ axes of the turret and nozzle), and generate signals to precisely dr...
Precisely and gently pick up the chips, transfer them to the test station, and subsequently sort and place them into designated locations based on the test results
BESI die bonders are positioned in the global mid-to-high-end market, and with their leading flip-chip and hybrid bonding technologies, they hold a dominant position in the field of high-precision adv...
BESI die bonders are positioned in the global mid-to-high-end market, and their products are widely used in AI chips and high-performance computing, which is the core driving force for their rapid gro...
DISCO is the undisputed leader in the global semiconductor dicing machine market, with cutting, grinding, and polishing technologies at its core. Its equipment can process a variety of materials with ...
DISCO is a leading global manufacturer of dicing machines, specializing in cutting, grinding, and polishing technologies. Its dual-spindle and laser cutting solutions support precision and high-effici...
The K&S wire bonder preheating element—also known as the heating block—is installed beneath the clamp.
DISCO is a leading global manufacturer of wafer thinning machines with a high market share. Its equipment boasts high precision, supports ultra-thin wafer processing, and employs unique processes such...
The K&S signal interface board is an electrical interface module within the wire bonder; its function is to relay signals between the control board and actuating components (such as motors, linear...
DISCO thinning machines are characterized by high precision and low-damage grinding. Their unique TAIKO process can strengthen wafer edges and is widely used in memory, power devices and advanced pack...
The clamp arm of the K&S wire bonder is a core actuating component of the wire bonder's clamping system, mounted on the bond head or the clamp platform.
The rubber gripper for K&S wire bonders is a contact-type consumable mounted at the tip of the bonding arm, making direct contact with the surface of the lead frame or substrate.
The K&S dual-head copper wire unit is the core wire-feeding assembly for the copper wire bonding process; it features a dual-spool structure that supports rapid wire changes or simultaneous dual-w...
The vibratory bowl feeder is a core material feeding module in the semiconductor packaging and testing process.
The vibratory bowl feeder for sorters is a core material-feeding module in the semiconductor packaging and testing process, specifically designed for high-speed sorters.
The IC bowl feeder is the core feeding module of the semiconductor test handler.
It is a precision motion control module for semiconductor test handlers.
The LED vibratory bowl feeder is a precision feeding device specifically designed for LED lead frames and SMD components.
The core pick-and-place module of the sorter is responsible for chip transfer
The main function of the control card is to receive instructions from the host computer, plan multi-axis movements (such as the XYZ axes of the turret and nozzle), and generate signals to precisely drive the machine operation
Precisely and gently pick up the chips, transfer them to the test station, and subsequently sort and place them into designated locations based on the test results
BESI die bonders are positioned in the global mid-to-high-end market, and with their leading flip-chip and hybrid bonding technologies, they hold a dominant position in the field of high-precision advanced packaging
BESI die bonders are positioned in the global mid-to-high-end market, and their products are widely used in AI chips and high-performance computing, which is the core driving force for their rapid growth
Our clients are all from large publicly listed companies.
SMT Technical Articles
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Semiconductor accessories FAQ
MORE+Fuji smt mounter is an efficient and accurate surface mount device that is widely used in the electr
Why do regular maintenance on Fuji smt mounters? In fact, many people ignore this point. In the mode
In the electronics manufacturing industry, SMT (Surface Mount Technology) equipment is an essential
Even the most advanced equipment requires regular maintenance and care to ensure long-term stable op
In today’s fast-paced world of electronics manufacturing, staying ahead of the competition requires
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