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Aluminum wire machine fixture is a key component used in ASMPT automatic wire bonding machine and die bonding machine. It is mainly used to fix and position aluminum wire to ensure the stability and a...
ASMPT wire bonder spark rod is mainly used in the LED production process to achieve the welding of gold wire, copper wire, alloy wire and other media through high voltage discharge. The spark rod is ...
Asmpt ball bonder splitter plays an important role in the field of microelectronic packaging and is mainly used for cutting transistor wafers in ball bonder machines.
The hardness of gold bonding wire can be adjusted by doping with different elements, such as silver, palladium, magnesium, iron, copper, silicon, etc., thereby changing its hardness, rigidity, ductili...
Characteristics of silver wireCheap: The price of silver wire is about one-fifth that of gold wire, which gives it a significant cost advantage.Good conductivity: Silver wire has excellent conduc...
Copper wire is a common conductor material, widely used in wires, cables, brushes and other fields, and is favored for its good conductivity and processing performance.
The die bonder motherboard is the core control unit of the die bonder, responsible for the operation and coordination of the entire device. Its main functions include:Control various actions of the d...
It is an important accessory for ASM wire bonding machine, mainly used to connect the wire bonding machine and the welding wire to ensure the stability and efficiency of the welding process
Aluminum wire machine fixture is a key component used in ASMPT automatic wire bonding machine and die bonding machine. It is mainly used to fix and position aluminum wire to ensure the stability and accuracy of welding and die bonding process.
ASMPT wire bonder spark rod is mainly used in the LED production process to achieve the welding of gold wire, copper wire, alloy wire and other media through high voltage discharge. The spark rod is usually made of highly conductive, high temperature and
Asmpt ball bonder splitter plays an important role in the field of microelectronic packaging and is mainly used for cutting transistor wafers in ball bonder machines.
The hardness of gold bonding wire can be adjusted by doping with different elements, such as silver, palladium, magnesium, iron, copper, silicon, etc., thereby changing its hardness, rigidity, ductility and conductivity.
Characteristics of silver wireCheap: The price of silver wire is about one-fifth that of gold wire, which gives it a significant cost advantage.Good conductivity: Silver wire has excellent conductivity and is suitable for applications requiring high
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SMT Technical Articles
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Semiconductor accessories FAQ
MORE+Fuji smt mounter is an efficient and accurate surface mount device that is widely used in the electr
Why do regular maintenance on Fuji smt mounters? In fact, many people ignore this point. In the mode
In the electronics manufacturing industry, SMT (Surface Mount Technology) equipment is an essential
Even the most advanced equipment requires regular maintenance and care to ensure long-term stable op
In today’s fast-paced world of electronics manufacturing, staying ahead of the competition requires
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