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Get Quote →Provides a wide range of high-performance semiconductor equipment to support all stages of the semiconductor manufacturing process. From wafer manufacturing to packaging, our equipment ensures precision, efficiency and reliability, enabling companies to meet the growing needs of the electronics industry.
Semiconductor equipment is essential in the production and fabrication of microchips that power the technology we rely on every day. These advanced machines are designed to manufacture semiconductor devices, such as integrated circuits, sensors, and microprocessors, which are at the core of modern electronics.
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DISCO DAD323 is a high-performance automatic dicing machine suitable for diversified processing from semiconductor wafers to electronic components
DAD324 uses a high-performance MCU to improve software operation speed and operation response speed. The X, Y, and Z axes all use servo motors to increase axis speed and production efficiency. The sta...
DISCO-DAD3230 is an automatic cutting machine, mainly used for cutting operations of processed objects
DISCO-DAD3241 is a high-performance automatic slicer suitable for cutting needs of various materials with high productivity and high precision
ASMPT Laminator IDEALmold™ 3G is an advanced automatic molding system, especially suitable for processing strip and roll substrates
ASMPT IdealMold™ R2R Laminator is a programmable molding system for single or double roll molding with vertical glue injection packaging technology (PGS™), especially suitable for ultra-thin packages...
ASMPT's AUTOPIA-TCT equipment is a fully automatic test system designed for wafer semiconductor packaging
ASMPT's vehicle-mounted AA active calibration equipment has multiple functions, mainly used to ensure the accuracy of the relative position and posture of the camera module during the assembly p...
ASM die bonder AD819 is an advanced semiconductor packaging equipment used to accurately place chips on substrates and is a key device in the automated die bond process
ASM AD800 is a high performance fully automatic die bonder with many advanced functions and features
The working principle of the ASM die bonder AD50Pro mainly includes heating, rolling, control system and auxiliary equipment.
ASM Wire Bonder AB550 is a high performance ultrasonic wire bonder with many advanced functions and features
ASM Eagle Aero Reel to Reel is a high-performance wire bonding machine designed for semiconductor packaging and testing production
ASM Laser Cutting Machine LS100-2 is a laser scribing machine designed for high-precision cutting needs, especially suitable for the manufacture of Mini/Micro LED chips
ASM laser cutting machine LASER1205 is a high-performance laser cutting equipment
The ASM LED Automated Packaging Machine AD838L is a high-performance LED packaging device designed to meet the demands of modern electronics industries for precision, efficiency, and automation. Wheth...
SC-810 is an integrated fully automatic semiconductor package chip online cleaning machine, which is used for online precision cleaning of residual flux and organic and inorganic pollutants after weld...
AC-420 is an integrated fully automatic semiconductor chip packaging online cleaning machine, which is used for online precision cleaning of residual flux and organic and inorganic pollutants after we...
The fully automatic semiconductor chip packaging online water washing machine uses efficient cleaning agents and special cleaning processes, which can clean a large number of components in a short tim...
SF-680 is an integrated fully automatic MICRO LED, MINILED online water washing machine, which is used for online cleaning of residual water-based flux and organic and inorganic pollutants after produ...
Test Handler is an equipment that automates the final testing of semiconductor devices. It handles device transportation, controls temperature during semiconductor testing, and sorts devices based on test results.
V93000 EXA Scale ArchitectureAll EXA Scale boards feature Advantest’s latest generation test processors, with eight cores per chip and unique features that accelerate test speed and simplify test execution.The V93000 EXA Scale system features Advantest’s
ACCRETECH Probe Station AP3000 is a high-precision, high-efficiency, low-vibration, low-noise probe machine designed to achieve high-precision, high-throughput, low-vibration and low-noise performance. It inherits the functions and operability of its pred
AD420XL provides high-speed, high-precision pick and place Mini LED COB solutions for large-size LCD BLUs (for local dimming) and ultra-fine pitch LED displays, with small chip handling capabilities, as small as 2 x 4 mil LED chips*. Thanks to the XY corr
ACCRETECH Probe Station UF3000EX is an electrical signal detection device for each chip on each wafer, designed to ensure the quality of semiconductor products. The device uses next-generation technology and significantly improves productivity through new
Our clients are all from large publicly listed companies.
SMT Technical Articles
MORE+2026-01
Fuji smt mounter is an efficient and accurate surface mount device that is widely used in the electr
2026-01
Why do regular maintenance on Fuji smt mounters? In fact, many people ignore this point. In the mode
2026-01
In the electronics manufacturing industry, SMT (Surface Mount Technology) equipment is an essential
2026-01
Even the most advanced equipment requires regular maintenance and care to ensure long-term stable op
2026-01
In today’s fast-paced world of electronics manufacturing, staying ahead of the competition requires
Semiconductor equipment FAQ
MORE+Fuji smt mounter is an efficient and accurate surface mount device that is widely used in the electr
Why do regular maintenance on Fuji smt mounters? In fact, many people ignore this point. In the mode
In the electronics manufacturing industry, SMT (Surface Mount Technology) equipment is an essential
Even the most advanced equipment requires regular maintenance and care to ensure long-term stable op
In today’s fast-paced world of electronics manufacturing, staying ahead of the competition requires
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