ULTRALUX™ PLUS is K&S's high-end ball bonding platform for large-scale, cost-effective mass production of LEDs and Mini-LEDs. Positioned above OptoLux™ Plus, it boasts higher UPH throughput, 2.5μm@3σ bonding accuracy, and enhanced copper/silver alloy wire bonding capabilities, aiming to help packaging plants reduce overall production costs by more than 10%. It is specifically designed for 24/7 uninterrupted high-volume production of lighting LEDs, Mini-LEDs, and infrared optoelectronic devices.
ULTRALUX™ PLUS Complete Machine
I. Equipment Positioning
ULTRALUX™ PLUS is K&S's flagship ball bonder for optoelectronic packaging, focusing on ultrasonic ball bonding interconnects for SMD LEDs, high-power LEDs, Mini-LEDs, infrared emitting/receiving devices, and light sensors, completing wire bonding between chip PADs and the substrate/support.
Compared to OptoLux™ / OptoLux™ Plus, the motion architecture, vision, gas protection, and process kit have been comprehensively upgraded. It is designed for medium to large-scale packaging plants pursuing maximum output, large-scale copper/silver wire bonding, and small-pad Mini-LEDs, and is not intended for high-end logic IC chip packaging.
II. Core Hardware System
Lightweight, High-Rigidity XYZ Full-Closed-Loop Servo System: Low-mass, high-rigidity motion structure improves acceleration and reduces idle time; bonding speed of up to 25 lines/second (2mm wire length) significantly increases UPH; high-precision Z-axis pressure closed loop suppresses the risk of damage to thin electrodes, suitable for long-term continuous mass production.
Next-Generation Progressive Scan Vision Engine (PRS): Compact miniature optical lens with smaller crosshair offset; Look-Ahead pre-scan; standard 3.5× magnification optics (OptoLux Plus is 2×/4×), balancing large field-of-view scanning and small pad recognition; optimized recognition algorithm for strong reflections, color differences, and contamination on electroplated supports.
Enhanced automatic fault recovery supports automatic retry for multiple anomalies such as SHTL, NSOP, and NSOL, significantly improving the average auxiliary interval of MTBA and reducing manual intervention downtime.
Enhanced gas flow control system: Specifically optimized for free-air ball FAB forming of copper and silver alloy wires, stabilizing the quality of arcing and ball formation, reducing copper ball oxidation and silver ball shape defects. With an optional micro-environment protection kit, it can directly run copper and silver wires in large batches, supporting factory cost reduction solutions.
Quick-LED-2 Suite complete optoelectronic process package: Integrates Quick Bond, Quick Stitch, and Quick Loop, pre-configured with a large number of mature wire arc, arcing, and ultrasonic pressure timing parameters; coupled with ACCUBMP solder ball control and Auto-BITS process self-optimization, it dynamically compensates for cutter wear and wire material fluctuations during equipment production, enabling rapid certification and deployment of new machines and products, shortening product introduction cycles.
KNet PLUS Device Networking System supports real-time equipment status monitoring and production data acquisition, integrates with factory MES systems to achieve full traceability of process data, and is compatible with Industry 4.0 automated production lines; it is also compatible with continuous support frames and pallet carriers, and can be integrated with automatic loading and unloading mechanisms.
III. Key Process Specifications
Compatible Wires: Gold wire, silver alloy wire, palladium copper wire, copper wire (with matching microenvironment protection kit)
Applicable Wire Diameter: 20-50μm, covering mainstream wire diameters for conventional LEDs, high-power LEDs, and Mini-LEDs
Bonding Accuracy: 2.5μm@3σ, superior to OptoLux Plus's 3μm@3σ, suitable for Mini-LED production with smaller pad spacing
Effective Bonding Area: 56mm (X) × 80mm (Y), compatible with various LED bridging brackets and ceramic substrates
Wire Arc Performance (25.4μm wire): Maximum wire length 5mm, minimum arc height 65μm; Quick-Loop-LED supports various complex wire arc shapes, reducing wire wobble and improving device reliability
Carrier Compatibility: Bracket box width 35-98mm, supporting multi-specification LED bridging bracket production
IV. Main Application Scenarios
LED Packaging: Full range of SMD surface mount LEDs, high-power ceramic LEDs, COB modules, Mini-LEDs Mass production of LED chips
Optoelectronic devices: Infrared (IR) emitters/receivers, photoelectric sensors, optocouplers (discrete devices)
Cost-reducing production lines suitable for mass production of copper wire and silver alloy wire
V. Core Equipment Advantages
Exceptional Mass Production Capacity: Features a next-generation servo-motion architecture that further boosts UPH compared to the OptoLux™ Plus; higher per-unit output dilutes manufacturing costs per LED, resulting in a >10% reduction in overall production costs.
Robust Copper/Silver Wire Bonding: Enhanced airflow control and superior FAB (Free Air Ball) consistency ensure stable yields in high-volume silver and copper wire production, meeting factory demands for cost reduction.
Higher Bonding Precision: Achieves 2.5μm@3σ precision with 3.5× optics, effectively handling Mini-LED processes involving small pads and fine pitches while offering a wider process window.
High Equipment Utilization: Features automatic recovery from various error types and Auto-BITS adaptive compensation to minimize setup and downtime, making it ideal for 24/7 continuous production.
Rapid Product Introduction: The Quick-LED-2 process suite shortens new product qualification cycles and alleviates the setup workload for process engineers.
Digital Production Line Compatibility: KNet-PLUS connectivity enables comprehensive production data traceability and integration with automated loading/unloading systems, making it fully compatible with modern packaging facilities. VI. Brief Comparison: ULTRALUX™ PLUS vs. OptoLux™ Plus
Table
Item ULTRALUX™ PLUS OptoLux™ Plus
Positioning Flagship model; ultra-high throughput; designed for Mini-LED and mass production with copper/silver wire Mainstream mass production; high-volume production of conventional LEDs
Optical Magnification Standard 3.5× Standard 2×; 4× optional
Bonding Accuracy 2.5μm @ 3σ 3μm @ 3σ
Maximum Speed 25 wires/second (2mm wire length) Relatively lower
Gas Control Enhanced airflow for optimized Cu/Ag wire FAB formation Standard airflow control
Process Suite Quick-LED-2 Suite Quick-LED Suite
Target Customers High-requirement Mini-LED lines; high-volume Cu/Ag wire lines focused on cost reduction Standard lines for conventional SMD and high-power LEDs
VII. Summary
The K&S ULTRALUX™ PLUS is the flagship model in the K&S optoelectronics ball bonding portfolio. Centered on the three core pillars of higher throughput, superior accuracy, and stable mass production with copper/silver alloy wires, it addresses critical challenges such as small bond pads on Mini-LEDs, poor ball formation with copper wire, and process drift during mass production. It enables LED packaging manufacturers to reduce per-unit production costs while maintaining high yields and reliability, making it the preferred wire bonding platform for next-generation LED and Mini-LED mass production.
