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Explore our range of high-precision semiconductor molding machines designed for IC encapsulation, transfer molding, compression molding and advanced packaging processes. Each machine is fully inspected, tested and calibrated to ensure stable heating, pressure control and production efficiency. We supply new, refurbished and pre-owned molding systems with global shipping, installation assistance, technical support and cost-effective solutions for semiconductor production lines worldwide.
The Towa CPM1180 is a compression molding system designed for the mass production of large-format Panel-Level Packages (...
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The Towa Y1E4120 is a market-proven semiconductor molding and packaging device. It belongs to the mature Y-series.
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The Towa CPM1080 is a compression molding system designed for advanced semiconductor packaging
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AMS-i in BESI molding machine is an automated assembly and test system produced by BESI. BESI is a semiconductor and m...
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ASMPT Laminator IDEALmold™ 3G is an advanced automatic molding system, especially suitable for processing strip and ro...
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ASMPT IdealMold™ R2R Laminator is a programmable molding system for single or double roll molding with vertical glue in...
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The ASM LED Automated Packaging Machine AD838L is a high-performance LED packaging device designed to meet the demands o...
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BESI's AMS-X mold machine is an advanced servo hydraulic molding machine with many advantages and features
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BESI's MMS-X mold machine is a manual version of the AMS-X mold machine. It uses a newly developed plate press wit...
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The FML function of the BESI molding machine is mainly used for precise control and management during the packaging an...
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The main function of BESI’s AMS-LM machine is to process large substrates and provide high productivity and good perfor...
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Features●Independent packaging equipment, suitable for both die up and die down wafer level and substrate packaging●Suit...
Check Stock & QuoteWe help semiconductor manufacturers, OSAT factories, and electronics production lines source reliable molding systems with faster lead times, lower investment cost, and practical engineering support.
Each molding system is inspected for machine condition, heating control, pressure stability, safety function, and production readiness.
Choose from available new, used, and refurbished systems according to your budget, delivery schedule, and production requirement.
We support global customers with equipment sourcing, technical consultation, spare parts, packaging line matching, and shipment arrangement.
Available molding machines, parts, heaters, plungers, transfer pots, and mold-related components can be quoted quickly.
A transfer molding machine is semiconductor packaging equipment used to encapsulate IC chips with epoxy molding compound during the semiconductor packaging process. It protects semiconductor devices from moisture, contamination, and mechanical damage while improving package reliability.
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For IC package encapsulation, EMC molding, and high-volume semiconductor production.
Designed for chip package protection, stable molding pressure, and reliable device packaging.
Used with epoxy molding compound for semiconductor encapsulation and package reliability.
Suitable for selected advanced packaging applications and specific semiconductor package formats.
For protecting semiconductor devices from humidity, contamination, and mechanical stress.
Complete support for semiconductor assembly, molding, bonding, marking, trimming, and singulation.
Refurbished semiconductor molding machines are a practical choice for factories that need reliable production capacity while reducing equipment investment and shortening procurement cycles.
Our semiconductor molding machine solutions are used across multiple packaging applications, from standard IC packaging to power devices and automotive electronics.
From model confirmation to shipment, we help customers reduce sourcing risk and quickly confirm suitable semiconductor molding equipment.
Tell us your package type, application, preferred brand, budget, and delivery schedule.
We check available inventory, machine condition, configuration, and suitable alternatives.
Photos, videos, condition details, and quotation can be provided before confirmation.
We arrange packing, logistics, export documents, and shipment to your factory location.
A semiconductor molding machine is used to encapsulate chips with epoxy molding compound (EMC) to protect them from moisture, stress, dust and external damage during IC packaging.
A transfer molding machine is used to encapsulate semiconductor chips with epoxy molding compound during the IC packaging process. It protects chips from moisture, dust, mechanical stress, and environmental damage.
We supply transfer molding machines, compression molding machines, automatic IC molding machines and refurbished semiconductor plastic sealing equipment.
Yes, we offer fully inspected, tested and calibrated refurbished molding machines with stable performance for semiconductor packaging production lines.
EMC stands for epoxy molding compound, the thermoset material used to encapsulate and protect semiconductor dies during the transfer molding process.
Transfer molding injects heated epoxy into a closed mold, while compression molding places material directly into an open mold before high-pressure forming.
Yes, fully tested and calibrated molding machines can stably support high-volume IC packaging, automotive electronics and semiconductor manufacturing.
Molding machines are widely used in IC packaging, power semiconductors, automotive chips, LEDs, sensors, MEMS devices and consumer electronics manufacturing.
Yes, we provide safe export packing, international logistics and worldwide delivery for all semiconductor molding and plastic sealing equipment.
We provide on-site installation, mold calibration, parameter setting, operator training and long-term after-sales support for molding machines.
Why do so many people choose to work with GeekValue?
Our brand is spreading from city to city, and countless people have asked me, "What is GeekValue?" It stems from a simple vision: to empower Chinese innovation with cutting-edge technology. This is a brand spirit of continuous improvement, hidden in our relentless pursuit of detail and the delight of exceeding expectations with every delivery. This almost obsessive craftsmanship and dedication is not only the persistence of our founders, but also the essence and warmth of our brand. We hope you will start here and give us an opportunity to create perfection. Let us work together to create the next "zero defect" miracle.
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