DISCO DAD323 is a high-performance automatic dicing machine suitable for diversified processing from semiconductor wafers to electronic components
DAD324 uses a high-performance MCU to improve software operation speed and operation response speed. The X, Y, and Z axes all use servo motors to increase axis speed and production efficiency. The sta...
DISCO-DAD3230 is an automatic cutting machine, mainly used for cutting operations of processed objects
DISCO-DAD3241 is a high-performance automatic slicer suitable for cutting needs of various materials with high productivity and high precision
ASM Laser Cutting Machine LS100-2 is a laser scribing machine designed for high-precision cutting needs, especially suitable for the manufacture of Mini/Micro LED chips
ASM laser cutting machine LASER1205 is a high-performance laser cutting equipment
Maximum workpiece size mm ø200Processing method Fully automaticX-axis effective feed speed range mm/s 1.0 - 1,000Y-axis positioning accuracy mm within 0.003/210Dimensions (WxDxH) mm 950 x 1,732 x 1,80...
Equipment size: 1.180 meters wide, 1.080 meters deep, 1.820 meters high. Equipment weight: about 1.500 kilograms. Maximum processing object size: Φ8 inches (about 200 mm). Spindle configurati...
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SMT Technical Articles
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Wafer cutting machine FAQ
MORE+Fuji smt mounter is an efficient and accurate surface mount device that is widely used in the electr
Why do regular maintenance on Fuji smt mounters? In fact, many people ignore this point. In the mode
In the electronics manufacturing industry, SMT (Surface Mount Technology) equipment is an essential
Even the most advanced equipment requires regular maintenance and care to ensure long-term stable op
In today’s fast-paced world of electronics manufacturing, staying ahead of the competition requires
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