Semiconductor News

Evaluate a used wire bonder by its exact configuration, bonding process, inspection evidence, application-based FAT, bond test results and delivery scope.

Compare ball, fine-wire wedge and heavy-wire bonders by wire material, package geometry, current, loop profile, thermal limits and production needs.

Evaluate a used ASM SIPLACE CA2 by its installed configuration, machine records, application-based FAT evidence and final delivery scope.

Evaluate a used ASM SIPLACE CA4 or CA4 V2 by its head configuration, SWS and feeder positions, conveyor, software, tooling and line replacement fit.

Learn what the MRSI-705 5-micron die bonder is, how its motion, force control and vision systems work, and why process capability depends on configuration.

Learn how the MRSI-605 AP combined stable mechanics, multi-tool handling, force control and vision for legacy advanced-packaging assembly.

Review verified ASMPT FT2026 platform information, including its 26-nozzle turret, package direction, test sites, media handling and used-machine checks.

Learn how to evaluate a used ASM AMICRA AFC Plus by reviewing its machine identity, installed configuration, tooling, software, condition, FAT evidence and delivery scope.

Learn how the ASM AMICRA AFC Plus supports precision die and flip-chip bonding, how its process functions relate and why project capability depends on the installed configuration.

Learn how die format, substrate flow, bonding method, tooling, alignment, software and production volume affect MRSI-705 configuration decisions.

Review verified ASMPT FT2018 specifications, package range, test sites, vision and tape-and-reel functions, plus key checks for a used machine.

Evaluate a used ASMPT MS100 Plus by checking wafer handling, pickup tooling, vision, software, output routing, FAT evidence and delivery scope.

Compare ASMPT MS100, MS100 Plus and MS100 Plus II machines by configuration, tooling, software, condition and operating evidence—not model name alone.

Learn what the ASMPT MS100 wafer mapping die sorter does, how die sorting differs from electrical testing and what to verify before buying a used machine.

Learn 10 production-readiness checks for K&S IConn PLUS wire bonders, including wire feed, capillary, FAB, looping, vision, workholder and recipe validation.

Compare K&S IConn PLUS and IConn wire bonders before purchase. Review bond head, capillary, wire feed, workholder, vision, software and FAT differences.

Learn how to validate copper wire, capillary tools, FAB, looping, vision and thermal conditions for product transfer on ASM AERO wire bonders.

Planning to buy a used ASM AERO wire bonder? Review 12 checks for bond heads, wire feed, capillary tools, vision, software, refurbishment and FAT.

Learn how to review ASM AD838 die bonder configuration for wafer, carrier, substrate, tooling, vision and material handling in LED and photonics assembly.

Planning to buy a used ASM AD838 die bonder? Review 12 checks for machine identity, tooling, wafer handling, vision, software, refurbishment and FAT.