Amawulire ga Semiconductor

Advantest V93000 test head teyungibwa oba okukutula nga ekola? Weekenneenye ebiwandiiko, embeera ya controller, connections ne system alarms nga tonnaba kukyusa bitundu.

Tegeera die bonding machine price factors omuli enkola, obutuufu, automation, embeera, tooling, software, okugezesa n'okutuusa scope.

Londa ekyuma ekikwata die nga ogeraageranya enkola za epoxy, eutectic, soft solder ne silver sintering, okutambula kw’ebintu, okubuguma, amaanyi n’obwetaavu bw’okufulumya.

Geraageranya omupiira, fine-wire wedge ne heavy-wire bonders okusinziira ku bintu bya waya, package geometry, current, loop profile, thermal limits n’obwetaavu bw’okufulumya.

Weekenneenye bonder ya waya ekozesebwa okusinziira ku nsengeka yaayo entuufu, enkola ya bonding, obujulizi bw’okukebera, FAT eyesigamiziddwa ku kukozesa, ebivudde mu kukebera bond n’obunene bw’okugituusa.

Weekenneenye ASM SIPLACE CA4 oba CA4 V2 ekozesebwa okusinziira ku nsengeka y’omutwe gwayo, SWS ne feeder positions, conveyor, software, tooling ne line replacement fit.

Weekenneenye ASM SIPLACE CA2 ekozesebwa okusinziira ku nsengeka yaayo etekeddwa, ebiwandiiko by’ebyuma, obujulizi bwa FAT obusinziira ku nkola n’obuwanvu bw’okutuusa obusembayo.

Manya engeri MRSI-605 AP gye yagatta makanika anywevu, okukwata ebikozesebwa ebingi, okufuga amaanyi n’okulaba okusobola okukuŋŋaanya eby’omulembe eby’okupakinga.

Yiga engeri die format, substrate flow, enkola ya bonding, tooling, alignment, software ne production volume gye bikwata ku MRSI-705 configuration decisions.

Manya MRSI-705 5-micron die bonder kye ki, engeri enkola zaayo ez’entambula, okufuga amaanyi n’okulaba gye zikolamu, n’ensonga lwaki obusobozi bw’enkola businziira ku nsengeka.

Manya engeri ASM AMICRA AFC Plus gy’ewagira precision die ne flip-chip bonding, engeri emirimu gyayo egy’enkola gye gikwataganamu n’ensonga lwaki obusobozi bwa pulojekiti businziira ku nsengeka etekeddwa.

Yiga engeri y’okwekenneenyaamu ASM AMICRA AFC Plus ekozesebwa nga weetegereza endagamuntu y’ekyuma kyayo, ensengeka y’ebikozesebwa, pulogulaamu, embeera, obujulizi bwa FAT n’obuwanvu bw’okugituusa.

Weekenneenye amawulire agakakasibwa ku musingi gwa ASMPT FT2026, omuli turret yaayo eya nozzle 26, obulagirizi bw’ebipapula, ebifo eby’okugezesa, enkwata y’emikutu gy’amawulire n’okukebera ebyuma ebikozesebwa.

Weekenneenye ebikwata ku ASMPT FT2018 ebikakasibwa, obuwanvu bw’ebipapula, ebifo eby’okugezesa, okulaba n’emirimu gya tape-and-reel, n’okukebera ebisumuluzo ku kyuma ekikozesebwa.

Geraageranya ebyuma bya ASMPT MS100, MS100 Plus ne MS100 Plus II okusinziira ku nsengeka, ebikozesebwa, pulogulaamu, embeera n’obujulizi bw’emirimu-so si linnya lya mulembe lyokka.

Weekenneenye ASMPT MS100 Plus ekozesebwa nga okebera enkwata ya wafer, ebikozesebwa mu pickup, okulaba, software, output routing, FAT evidence ne delivery scope.

Manya ASMPT MS100 wafer mapping die sorter ky’ekola, engeri die sorting gye yawukana ku kugezesa amasannyalaze ne by’olina okukakasa nga tonnagula kyuma kikozesebwa.

Yiga okukebera 10 okwetegekera okufulumya ku K&S IConn PLUS waya bonders, omuli okuliisa waya, capillary, FAB, looping, okulaba, workholder n’okukakasa enkola.

Geraageranya K&S IConn PLUS ne IConn wire bonders nga tonnagula. Weekenneenye omutwe gwa bond, capillary, wire feed, workholder, okulaba, software ne FAT enjawulo.

Yiga engeri y’okukakasa waya y’ekikomo, ebikozesebwa mu misuwa, FAB, looping, vision n’embeera z’ebbugumu okusobola okutambuza ebintu ku ASM AERO wire bonders.