Amawulire ga Semiconductor

Yiga okukebera 10 okwetegekera okufulumya ku K&S IConn PLUS waya bonders, omuli okuliisa waya, capillary, FAB, looping, okulaba, workholder n’okukakasa enkola.

Geraageranya K&S IConn PLUS ne IConn wire bonders nga tonnagula. Weekenneenye omutwe gwa bond, capillary, wire feed, workholder, okulaba, software ne FAT enjawulo.

Yiga engeri y’okukakasa waya y’ekikomo, ebikozesebwa mu misuwa, FAB, looping, vision n’embeera z’ebbugumu okusobola okutambuza ebintu ku ASM AERO wire bonders.

Oteekateeka kugula bonder ya waya ya ASM AERO ekozesebwa? Weekenneenye okukebera 12 ku mitwe gya bond, emmere ya waya, ebikozesebwa mu misuwa, okulaba, pulogulaamu, okuddaabiriza ne FAT.

Yiga engeri y’okuddamu okwetegereza ASM AD838 die bonder configuration for wafer, carrier, substrate, tooling, okulaba n’okukwata ebintu mu LED ne photonics assembly.

Oteekateeka kugula die bonder ya ASM AD838 ekozesebwa? Weekenneenye okukebera 12 okuzuula ebyuma, ebikozesebwa, okukwata wafer, okulaba, software, okuddaabiriza ne FAT.

Geraageranya emikutu gya BESI DATACON 8800 FC QUANTUM ne CHAMEO okusobola okuddamu okukulukuta mu bungi, okugifulumya empewo n’okupakinga eby’omulembe. Weekenneenye enkola y’okutambula, ebikozesebwa n’okukebera RFQ.

Geraageranya BESI DATACON 2200 evo plus vs evo ku pulojekiti za die attach ne multi-chip. Weekenneenye kkamera, okuliyirira ebbugumu, ebikozesebwa, okukwata n’okukebera ebyuma ebikozesebwa.

Yiga engeri y’okulondamu BESI flip chip bonder for mass reflow, multi-chip ne fan-out packaging ng’ogeraageranya enkola y’okutambula, ebikozesebwa, okulaba n’okukwata ebyetaago.

Lwaki ebyuma bibiri ebya BESI DATACON 2200 evo bisobola okwawukana? Geraageranya enkyusa, emitwe gya bond, vision, tooling, handling ne software nga tonnagula.

Oteekateeka kugula BESI die bonder ekozesebwa? Weekenneenye 12 DATACON ne Esec checks ezikwata ku configuration, tooling, FAT, software n'obuyambi.

Ekyuma ekiyitibwa wire bonder kye kimu ku byuma ebikulu ebikozesebwa mu kupakinga kwa semiconductor n’okukola microelectronics. Kivunaanyizibwa ku kutondawo ebiyungo by’amasannyalaze wakati wa chips za semiconductor ne package leads nga ekozesa waya ezikwatagana ennungi ennyo.

Wire bonders byuma bikulu ebikozesebwa mu kupakinga semiconductor, okukuŋŋaanya IC, okukola LED, n’okukola microelectronics. Ziwa enkolagana entuufu ey’amasannyalaze wakati wa chips za semiconductor ne package leads nga zikozesa waya ennungi ezikwatagana. Wansi