ASM AERO Wire Bonder Enkola Ekitabo | Waya y'ekikomo, Capillary & Looping

Okutambuza ekipapula ku ASM AERO wire bonder si mulimu gwa kuteekawo kyuma gwokka.Okukwatagana kwa waya okunywevu kwesigamye ku nneeyisa y’ebintu bya waya, geometry y’emisuwa, okutondebwa kw’omupiira ogw’empewo ey’eddembe, ensengeka z’okukwatagana okusooka, ensengeka z’okukwatagana okw’okubiri, profile ya loopu, ebbugumu ly’omukwasi w’omukozi, embeera ya die pad, leadframe oba substrate surface, vision alignment n’okuteekawo ekyuma.

Ku waya y’ekikomo oba ebintu ebirala ebya waya ezikola, okukyusa enkola tekulina kukkirizibwa kubanga ekyuma kisobola okukola omupiira ne kimaliriza enzirukanya enkalu. Ekipapula ekigendererwa kirina okukakasibwa okuyita mu nsengekera y’okuyunga efugibwa ekebera okutondebwa kw’enkolagana esooka, okukwatagana kw’ekiyungo ekyokubiri, geometry ya loopu, okutebenkera kw’okuteekebwa n’okuddamu kw’enkola y’ebintu ebituufu.

Ekitabo kino kinnyonnyola enkyukakyuka z’enkola enkulu ezirina okwekenneenya nga tukyusa ekipapula okudda mu kiyungo kya waya ekya ASM AERO, omuli okulonda emisuwa, okuliisa waya, enneeyisa ya FAB, looping, embeera z’ebbugumu, okuteekawo okulaba n’okuteekateeka okukakasa.

Mu bufunze: Kiki Ekifuga Obunywevu bw’okusiba waya ku kyuma kya ASM AERO?

Okutebenkera kw’okusiba waya kufugibwa olujegere lw’enkola olujjuvu okusinga okuteekebwawo kw’ekyuma kimu. Enkyukakyuka ezisinga obukulu mu ngeri entuufu mulimu embeera ya die pad, substrate oba leadframe surface, waya material ne diameter, capillary geometry, EFO behavior, first-bond parameters, second-bond parameters, loop profile, ebbugumu ly’omukozi, vision alignment n’okukakasa enkola.

• Tokyusa bintu bya waya nga totunuulidde ensengeka za capillary, FAB ne bond.

• Tokozesa capillary yokka kubanga yakola ku package eyasooka.

• Tokkiriza loopu profile okuva mu kifo kimu ku sample unit emu.

• Tokitwala nti bond esooka enywevu ekakasa okukola obulungi mu bond eyokubiri.

• Tofulumya nkola okutuusa ng’ekipapula kyennyini, ebikozesebwa n’embeera y’okufulumya bikakasiddwa.

Lwaki AERO Process Transfer Esinga Okuteekawo Ekyuma

Okuteekawo ekyuma kitundu kimu kyokka eky’okutambuza enkola. Ekipapula kiyinza okwetaagisa emisuwa emipya, abakozi ab’enjawulo, ebifo ebisomesa okulaba ebipya, pulogulaamu ya loopu erongooseddwa, ensengeka empya ez’okuliisa waya oba embeera y’ebbugumu ekyusiddwa ne bwe kiba nti bonder ya waya y’emu eya AERO yakola dda ekintu ekirala.

Okukyusa kufuuka kwa maanyi nnyo nga die pad metallization, leadframe plating, substrate finish, wire material, die thickness, pad geometry, package clearance oba ebiziyiza ebikwata ku kikuta bikyuse. Ekyuma ekigatta kirina okutegekebwa okwetoloola enkola yennyini ey’omubiri okusinga enkola eyasooka eya generic.

Enkola-okukyusa enkola:Kakasa okugatta ekipapula, ebintu n’ebikozesebwa ng’enkola emu. Tokakasa bonder ya waya mu kweyawula.

Enkyukakyuka 10 Ezifuga Obutebenkevu bw’okukwatagana kwa waya

1. Okukola ebyuma bya Die Pad n’embeera y’okungulu

Bond esooka esinziira nnyo ku mbeera ya die pad. Ekika ky’ekyuma, obuyonjo bwa paadi, oxidation, obucaafu, obunene bwa paadi, okugguka kwa pasivation, topography n’ebyafaayo by’okukwata die byonna bisobola okukwata ku nneeyisa y’okukwatagana.

Nga tonnakyusa nteekateeka za kyuma, kebera oba ensonga ya first-bond ekwatagana ne die pad yennyini. Enkola eyali enywevu ku nsibuko emu eya die eyinza okweyisa mu ngeri ey’enjawulo nga wafer lot empya, pad finish oba die supplier eyingiziddwa.

2. Leadframe, Substrate oba Package Bonding Surface

Ekiyungo ekyokubiri kikwatibwako embeera y’oludda lw’ekiyungo ekifuna. Leadframe plating, substrate metal finish, bond finger geometry, obucaafu, flatness, package support n’enneeyisa y’ebbugumu bisobola okukosa okutondebwa kw’emisono n’obutakyukakyuka bwa bond.

Enkyukakyuka ya second-bond bwe yalabika, ekizibu kiyinza obutava ku maanyi oba empalirizo ya ultrasonic yokka. Weekenneenye ebintu ebipakiddwa, embeera y’okusiiga, okunyweza n’okutebenkera kw’omukozi ng’ekimu ku bitundu by’okunoonyereza.

3. Ebintu bya waya, Diameter ne Lot Consistency

Ebintu bya waya ne dayamita ya waya bikosa okutondebwa kwa FAB, enkolagana y’emisuwa, okukyukakyuka kw’enkolagana, enneeyisa ya loopu n’eddirisa ly’enkola. Enkyukakyuka mu kika kya waya, dayamita, okusiiga, embeera y’okutereka oba ekitundu ky’omugabi erina okutwalibwa ng’enkyukakyuka y’enkola efugibwa.

Waya erina okukakasibwa nga tonnaddukanya kukyusa kukola. Kakasa nti okutikka okutuufu, okuyisa ekkubo, okulungamya spool, obuyonjo bw’ekkubo ly’emmere n’okukwatagana n’enkola y’emisuwa n’okusiba essiddwawo.

4. Geometry y’emisuwa n’okwambala kw’ebikozesebwa

Geometry ya capillary y’emu ku nkyukakyuka ezisinga okukwata ennyo mu kukwatagana kw’omupiira. Kikosa enneeyisa y’omupiira ogw’empewo ey’eddembe, okukyukakyuka kw’ekiyungo ekisooka, ekigere ky’ekiyungo, okutondebwa kw’emisono, enkula y’olukoba n’embeera z’okufuluma.

Emisuwa girina okulondebwa okusinziira ku dayamita ya waya, geometry ya pad, target ya bonded-ball, dizayini ya leadframe oba substrate, obwetaavu bwa loop n’okuzimba package. Omusuwa ogwakola ku kyuma ekimu guyinza obutasaanira ku kipapula kirala.

Okwambala kw’ebikozesebwa, obucaafu, okwonooneka oba geometry etakwatagana kiyinza okuleeta okukwatagana okutali kunywevu ne bwe kiba nti parameters z’ekyuma zirabika nga tezikyusiddwa.

5. Okuliisa waya, Okukola Clamp ne Tail Formation

Okuliisa waya ezitebenkedde kyetaagisa okusobola okutondebwawo kwa FAB okuddiŋŋana n’okukola loopu. Ekkubo lya waya, embeera ya clamp, obudde bwa clamp, obuwanvu bw’omukira, capillary interface n’okuddamu kw’emmere birina okwekenneenya nga tonnaba kukola nkyukakyuka nnene mu bond parameters.

Obubonero nga emipiira egy’empewo ey’eddembe egitakwatagana, okumenya kwa waya mu ngeri etasuubirwa, obugulumivu bwa loopu obutali bunywevu oba enneeyisa ya first-bond etali ya bulijjo eyinza okukwatagana n’okuliisa waya, okutambula kwa clamp oba embeera y’okufuga omukira.

6. Okutondebwa kw’omupiira gwa EFO ne Free-Air Ball

Okutondebwa kw’omupiira ogw’empewo ey’eddembe kitundu kya musingi mu kukwatagana kw’omupiira. Enkola ya EFO, embeera y’obusannyalazo, omukira gwa waya, okuliisa waya, okuteekawo emisuwa n’obutonde bwa ggaasi byonna bisobola okukwata ku bunene, enkula n’obutakyukakyuka bw’omupiira.

Mu kiseera ky’okukyusa enkola, teekawo FAB enywevu nga tonnaba kugezaako kulongoosa kwa nkomerero esooka-bond. Enkola ya first-bond tesobola kulongoosebwa mu ngeri eyesigika ng’omupiira ogw’empewo ey’eddembe oguyingira tegukwatagana.

7. Bbalansi ya Parameter ya Bond esooka

Omulimu gwa first-bond gukosebwa amaanyi, amaanyi ga ultrasonic, obudde bw’okusiba, ebbugumu, embeera y’emisuwa, embeera ya FAB, omutindo gwa die pad n’obutuufu bw’okukwatagana. Enkyukakyuka zino zirina okutereezebwa nga ziyita mu nkola efugibwa okusinga okuyita mu nkyukakyuka empanvu ez’omu kiseera kye kimu.

Ebivudde mu kusooka-bond bwe biba tebikwatagana, kozesa okwekenneenya okutegekeddwa: kakasa embeera ya die pad, kebera okwambala kw’emisuwa, okukakasa enneeyisa ya FAB, okukakasa okukwatagana, olwo okwekenneenya embeera z’amaanyi, amaanyi, obudde n’ebbugumu.

8. Okutondebwa kwa Second-Bond ne Stitch

Omutindo gwa second-bond gusinziira ku surface efuna, stitch parameters, capillary geometry, wire tension, loop trajectory, workholder condition and the thermal stability. Bond esooka stable tekakasa bond eyokubiri stable.

Weekenneenye endabika y’omusono n’obutakyukakyuka bwa bond mu bifo eby’enjawulo eby’okupakinga. Enkyukakyuka ku ludda olumu olwa leadframe oba substrate eyinza okulaga obuwagizi bw’ebintu ebinyweza, obuwanvu, ebbugumu oba ensonga z’okukwatagana mu kitundu okusinga ekizibu ky’enkola y’emmere ey’ensi yonna.

9. Loop Profile, Span ne Loop Height

Looping erina okukolebwa okwetoloola enzimba ya package. Obugulumivu bwa loopu, span, geometry y’ekisinziiro, okufuluma kwa waya, ebanga okuva ku die-to-lead, waya eziriraanye, okutambula kw’ekikuta n’obuzibu bw’ekipapula byonna birina okulowoozebwako.

Profaayili ya loopu erina okwekenneenya mu kipapula kyonna, si mu kifo kimu kyokka eky’okuyunga wakati. Enfo z’empenda, ebiwanvu ebiwanvu, waya eziriraanye n’enkoona za package enzibu bisobola okulaga ensonga ezitalabika mu kugezesebwa okwangu okw’okuteekawo.

10. Ebbugumu ly’omukozi n’okutebenkera kw’ebbugumu

Ebbugumu likosa enneeyisa y’ebintu, okutebenkera kwa substrate, okuddamu kwa leadframe, okutondebwa kw’enkolagana n’obutakyukakyuka obw’ekiseera ekiwanvu. Workholder, heater plate, fixture contact ne package support birina okukeberebwa nga tonnaba kussa nkyukakyuka ku bonding parameters zokka.

Ku bipapula ebikwatagana n’ebbugumu oba okudduka okumala ebbanga eddene mu kukola, kebera oba ebbugumu lisigala nga litebenkedde mu kifo kyonna ekikwata omulimu era oba obuwagizi bw’ebipapula bukyuka okuva mu kifo ekimu okudda mu kirala.

Engeri y'okuddukanyaamu enkola ya ASM AERO ey'omugaso Transfer FAT

A process-transfer FAT erina okukakasa nti ekyuma ekiweereddwa kisobola okuddukanya ekkubo lyennyini erya package n’ebintu ebikiikirira, ebikozesebwa ebituufu n’ebivuddemu ebiwandiikiddwa. Tekirina kukoma ku kutandikawo kyuma oba okwolesebwa okw’okusiba waya okwa bulijjo.

Omutendera 1 — Kakasa Ebiyingizibwa mu Package n’Ebintu

Tegeka ebifaananyi by’ekipapula, ebikwata ku die pad, ebikwata ku leadframe oba substrate, ebintu bya waya, dayamita ya waya, ekiteeso ky’emisuwa, ebyetaago by’omukwasi w’omukozi ne profile ya loopu esuubirwa nga tonnatandika kugezesebwa.

Omutendera 2 — Teeka Emisuwa n’Ebikozesebwa Ebikakasibwa

Kozesa ensengeka ya capillary ne workholder esaanira ekyuma ekigendererwa. Wandiika ekika ky’emisuwa, embeera y’ekintu, ekika kya waya, endagamuntu y’ekintu ekinyweza n’okuteekawo ekyuma nga tonnaba kukebera.

Omutendera 3 — Okuteekawo ensengeka y’omupiira ogw’empewo ogw’eddembe ogunywevu

Kakasa okutondebwa kwa FAB okuddibwamu nga tonnamaliriza nteekateeka za bond esooka. Weetegereze obutakyukakyuka bw’omupiira, okutebenkera kw’omukira gwa waya n’enkolagana wakati wa EFO, okufuga kwa clamp n’okuteekawo emisuwa.

Omutendera 4 — Okukakasa Bond esooka ku Representative Die Pads

Duka okugezesebwa okufugibwa okusooka-bond ku paadi ezifa entuufu oba ezikiikirira. Weekenneenye endabika ya bond, okukyukakyuka, ekifo, okuddiŋŋana n’okuddamu kw’enkola nga tonnagenda ku kwekenneenya loopu enzijuvu.

Omutendera 5 — Okukakasa Bond eyokubiri ku ngulu za Package Entuufu

Kakasa okutondebwa kw’emisono, obutakyukakyuka bwa second-bond n’obutuufu bw’ekifo ku leadframe yennyini, substrate oba receiving metal surface. Muteekemu ebifo ebizibu ebya bond we kisoboka.

Omutendera 6 — Kakasa Loop Profile Okubuna Ebifo Package

Weekenneenye obuwanvu bwa loopu, span, enkula, clearance n’okuddiŋŋana mu bifo eby’omu makkati, ku mabbali n’ebiwanvu. Wandiika pulogulaamu ya loopu n’ekkomo lyonna ery’enkola erizuuliddwa mu kiseera ky’okugezesa.

Eddaala 7 — Weekenneenye Ensengeka y’Okwolesebwa n’Okusomesa Okutebenkera

Kakasa nti die pads, leads, substrates oba package references zisobola okumanyibwa obutakyukakyuka. Kakasa ensonga z’okusomesa, ensengeka za kkamera, amataala n’enkola y’okulaganya ng’okozesa ekintu ekigendereddwamu.

Omutendera 8 — Wandiika Ebipimo, Ebivuddemu n’Ekkomo ly’Okuddamu Ebisaanyizo

Ebiwandiiko ebikozesebwa mu waya, ebikwata ku misuwa, embeera za EFO, ebipimo bya bond, ensengeka ya hhuta, pulogulaamu ya loopu, ensengeka y’okulaba, ebivudde mu kukebera n’embeera ezeetaaga okuddamu okutuukiriza ebisaanyizo.

Obubonero obwa bulijjo obw’okusiba waya n’enkyukakyuka ezisooka okwekenneenya

Nga Enkola y’okusiba waya Eteekwa Okuddamu Okufuna Ebisaanyizo

Enkola y’okusiba waya erina okwekenneenya era eyinza okuddamu okuweebwa ebisaanyizo nga ekintu kyonna ekiyingizibwa ekikulu mu nkola kikyuse. Kuno kw’ogatta enkyukakyuka mu bintu bya waya, dayamita ya waya, ekika ky’emisuwa, okumaliriza die pad, leadframe oba substrate plating, package geometry, workholder, embeera ya heater, machine controller, bonding head, vision configuration oba major software environment.

Okuddamu okutuukiriza ebisaanyizo tekikwetaagisa kuddamu kuzimba nkola yonna okuva ku ziro. Naye enkyukakyuka ekyusiddwa erina okuzuulibwa, okwekenneenya akabi era n’okukakasibwa okusinziira ku kkubo lyennyini erya package nga tennafulumizibwa mu kukola.

Kiki Ekisaanidde Okuwandiikibwa Mu kiseera ky’Okukyusa Enkola ya AERO?

• Omutindo gw'ekyuma ekituufu, ennamba ya serial n'ensengeka etekeddwa

• Okukuba ekifaananyi kya package, layout ya die pad n’okufuna bonding surface

• Ebintu bya waya, diameter, supplier lot n'embeera y'okutereka

• Ekika ky’emisuwa, geometry, embeera n’emisingi gy’okukyusaamu

• Enteekateeka ya EFO, embeera ya FAB n’okuteekawo omukira gwa waya

• Ekisengejjo kya parameter ya bondi esooka n’eya bondi eyookubiri

• Loop profile, loop height, span ne package clearance ebyetaagisa

• Okuzuula omukozi, ekyuma ekibugumya n’ekintu ekinyweza

• Vision teach points, ensengeka za kkamera n’enkola y’okugikwataganya

• Okwetegereza okwekebejja, emisingi gy‟okugaana n‟ebivaako okuddamu okutuukiriza ebisaanyizo

Ekiteeso ekisembayo: Okukakasa Enkola ya Bonding Enzijuvu

ASM AERO wire bonder esobola okuwa enkola ey’amaanyi platform nga ensengeka y’ekyuma entuufu, capillary tooling, waya material, workholder, package geometry, vision setup n’enkola y’okukakasa bikwatagana.

Nga tonnafulumya kintu ekikyusiddwa mu kukola, kakasa okutondebwa kwa FAB okutebenkevu, omutindo gwa bond esooka, obutakyukakyuka bwa bond eyookubiri, loop profile, vision alignment n’okuddiŋŋana ku ddaala lya package. Kino kiziyiza ensobi eya bulijjo ey’okutambuza enkola: okukakasa enzirukanya y’ekyuma awatali kukakasa kugatta kwa kipapula n’ebintu byennyini.

Ebikozesebwa mu ASM Wire Bonder ebikwatagana

• ASM AERO Wire Bonder Ekitabo Ekilungamya

• Ekitabo ky’okugula waya za ASM AERO ezikozesebwa

• Ekitabo ky’Ebyuma bya ASM Wire Bonder

• Browse Ebikwata ku Waya Ebiriko

Ebibuuzo Ebitera Okubuuzibwa Ku ASM AERO Wire Bonder Process Transfer

Kiki ekikyukakyuka ekisinga obukulu mu kusiba waya z’ekikomo?

Tewali nkyukakyuka emu ekola nga yeetongodde. Ebintu bya waya, geometry y’emisuwa, embeera ya FAB, kungulu kwa paadi, ebipimo by’okukwatagana, embeera z’ebbugumu ne dizayini ya loopu birina okwekenneenyezebwa awamu ng’enkola emu ey’enkola.

Embeera ya capillary ekosa etya obutakyukakyuka bwa first-bond?

Geometry y’emisuwa, okwambala, obucaafu n’okwonooneka bisobola okukosa enkolagana ya FAB, okukyukakyuka kw’enkolagana, okukyusa amaloboozi amangi, ekigere ky’enkolagana n’obutuufu bw’ekifo. Embeera ya capillary erina okukeberebwa nga tonnaba kukola nkyukakyuka za parameter empanvu.

Lwaki okutondebwa kw’omupiira ogw’empewo ey’eddembe kikulu?

FAB ye kakwakkulizo akatandikira ku bond esooka. Enkula y’omupiira, enkula oba enneeyisa y’omukira gwa waya ezitakwatagana zisobola okuleeta ebiva mu kukwatagana okusooka ebitali binywevu ne bwe kiba nti ebipimo ebirala eby’okukwatagana bisigala nga tebikyusiddwa.

Kiki ekikosa obuwanvu bwa loopu n’obutebenkevu bwa loopu?

Obugulumivu bwa loopu n’obutebenkevu bikwatibwako pulogulaamu ya loopu, okuliisa waya, obudde bwa clamp, embeera y’emisuwa, ebintu bya waya, die-to-lead distance, package geometry, workholder support n’okupima ekyuma.

Ddi enkola y’okusiba waya gy’erina okuddamu okuweebwa ebisaanyizo?

Enkola y’emmere erina okwekenneenya nga ebintu bya waya, ekika ky’emisuwa, embeera ya die pad, leadframe oba substrate finish, package geometry, workholder, bonding head, vision setup, heater condition oba ebirala ebiyingizibwa ebikulu mu nkola bikyuse.

Omusuwa gumu gusobola okukozesebwa ku dizayini z’ebipapula ez’enjawulo?

Oluusi, naye okusaanira kisinziira ku dayamita ya waya, geometry ya pad, bonded-ball requirement, lead oba substrate design, loop target ne package clearance. Okukwatagana kw’emisuwa kulina okukakasibwa ku buli kkubo ly’enkola.

Lwaki omutindo gwa second-bond gwawukana wakati wa substrate lots?

Enjawulo esobola okukwatibwako okumaliriza kungulu, embeera y’okusiiga, obucaafu, obupapajjo, obuwagizi bw’ekinyweza, enneeyisa y’ebbugumu, ebipimo by’okutunga n’embeera y’okukwatagana mu kitundu. Ekitundu ekifuna kisaana okwekenneenya ku mabbali g’ensengeka z’okusiba.

Kiki ekirina okuwandiikibwa mu kiseera ky’okukyusa enkola ya ASM AERO?

Wandiika ensengeka y’ekyuma, ebikwata ku waya ne capillary, embeera ya EFO, bond parameters, loop program, workholder setup, vision settings, package materials, inspection findings and requalification limits.

Weetaaga Obuyambi Okwetegereza Enkola Ya ASM AERO Wire Bonding?

Gabana ekifaananyi ky’ekipapula, ensengeka ya die pad, ebikwata ku leadframe oba substrate, ebintu bya waya, dayamita ya waya, amawulire agakwata ku misuwa, target loop profile, embeera y’omukozi n’ebyetaago ebisuubirwa mu kukola. Okwekenenya okw’omugaso kutandikira ku nkola ya package enzijuvu okusinga bonding parameter emu yokka.