ave okutuuka ku 70% ku SMT Parts – Mu Stock & Ready to Ship
Funa Quote →Ensonda ebyuma ebipya eby’omutindo ogwa waggulu, ebikozesebwa era ebiddaabiriziddwa die bonder ne die bonding eby’okupakinga semiconductor, okukuŋŋaanya, substrate bonding n’okukola chip. Tuwa die bonders ezigezeseddwa mu bujjuvu era ezipimiddwa n’obutuufu obutebenkevu, obulungi obw’amaanyi n’omutindo ogwesigika ku layini z’okufulumya semiconductor mu nsi yonna.
Yeekenneenya ebyuma byaffe ebya Die Bonder ebitera okusabibwa, ebirungi ennyo mu kukwata chip mu ngeri entuufu, okuteekawo layini ya SMT, okugaziya obusobozi, n’okulongoosa okufulumya mu ngeri etali ya ssente nnyingi. Tokakasa model ki ekwatagana n’enkola yo? Gabana ebyetaago byo eby’okufulumya era abakugu baffe bajja kukuteesa ku nkola esinga okutuukagana.
Besi Datacon 2200 APM ye die bonder ekola bulungi nnyo, ekola mu bujjuvu. Nga bakozesa tekinologiya ow’omulembe ow’okulonda n’okuteeka,...
Kebera Stock & Quote
Ekozesebwa ASM AD830 Plus die bonder for silver epoxy die attach, n'okukebera ebyuma, okukakasa ebikozesebwa n'ensi yonna sup...
Kebera Stock & Quote
ESEC 2100 hS die bonder ye nkola ya die bonder ey’amaanyi emanyiddwa ennyo okuva mu BESI.
Kebera Stock & Quote
BESI Datacon 2200EVO ye nkola ya otomatiki mu bujjuvu, ekola bulungi nnyo, ekola emirimu mingi egy’okuteeka chip ekozesebwa mu semico...
Kebera Stock & Quote
ASM die bonder AD819 ye kyuma eky’omulembe ekipakinga semiconductor ekikozesebwa okuteeka obulungi chips ku substrates ne i...
Kebera Stock & Quote
ASM AD800 ye die bonder ekola obulungi mu bujjuvu mu ngeri ya otomatiki ng’erina emirimu n’ebintu bingi eby’omulembe
Kebera Stock & Quote
Enkola y’emirimu gya ASM die bonder AD50Pro okusinga erimu ebbugumu, okuyiringisibwa, enkola y’okufuga n’ebyuma ebiyamba...
Kebera Stock & Quote
AD420XL egaba emisinde egy’amaanyi, egy’obutuufu obw’okulonda n’okuteeka Mini LED COB solutions ku LCD BLUs eza sayizi ennene (for local dim...
Kebera Stock & Quote
Enkola ya ASMPT eya SD8312 fully automatic soft solder die bonder system kyuma kya mulembe ekikoleddwa okukola wafer ya yinsi 12...
Kebera Stock & Quote
Ebipimo n’ebipimo by’enkola ya ASMPT fully automatic die bonding system bye bino wammanga:Ebipimo: W x D x H 1...
Kebera Stock & Quote
AD838l plus fully automatic disk bonding ne flip chip system ya die bonding e...
Kebera Stock & Quote
Ebirimu● Omulembe omupya ogw'obusobozi obw'amaanyi AD8312 series die bonders ziteekawo omutindo omupya eri amakolero● Universal worktable...
Kebera Stock & Quote
Ebifaananyi●Obutuufu ± 3 μm @ 3s●Glue dispensing/jetting for die bonding●Okulondoola ensibuko y'ebintu okusobola okutumbula omutindo ...
Kebera Stock & Quote
Ebifaananyi●Obutuufu ± 12.5 μm @ 3s●Asobola okukola butereevu ku substrates za ceramic●Okugukola enkola ne modulo design●Independent...
Kebera Stock & Quote
MRSI Systems Die Bonder kiva mu Mycronic Group, essira erisinga kulissa ku kuwa fully automatic, high-precision...
Kebera Stock & Quote
Besi Datacon 8800 kyuma kya mulembe ekikola chip bonding, okusinga ekozesebwa mu tekinologiya w’okupakinga 2.5D ne 3D naddala TSV ...
Kebera Stock & Quote
ASMPT’s AD838 series ye die bonder ya sipiidi ya waggulu, ekola bulungi era emanyiddwa nnyo ku katale.
Kebera Stock & QuoteDie bonder kye kyuma ekipakinga semikondokita ekituufu ekikozesebwa okulonda, okukwataganya n’okusiba die za semikondokita ku substrates, lead frames, ceramic carriers, packages oba enkuŋŋaana endala ez’ebyuma.
Y’emu ku byuma ebikulu mu kupakinga semiconductor, okupakinga LED, okukuŋŋaanya IC n’okukola ebyuma eby’omulembe. Ku makolero mangi, okulonda die bonder entuufu kikosa butereevu obutuufu bwa bonding, amakungula, obusobozi bw’okufulumya n’omuwendo gw’okukola ogw’ekiseera ekiwanvu.
Ebyuma bya die bonder eby’omulembe bikoleddwa okutuuka ku high-precision semiconductor die placement, stable bonding performance n’omutindo gw’okufulumya obutakyukakyuka mu kupakinga semiconductor n’okukozesa ebyuma eby’amasannyalaze.
Okuteeka die mu ngeri ey’obutuufu ennyo kukosa butereevu omutindo gw’ebipapula, omuwendo gw’amakungula n’obutakyukakyuka mu kukola.
Enkola ez’omulembe ez’okulaga amaaso ziyamba okutuuka ku kuteeka mu kifo ekituufu eky’okufa n’okuddiŋŋana okukwatagana.
Stable bonding pressure is critical for reliable die attach n'okukola ekyuma okumala ebbanga eddene.
Tekinologiya ow’enjawulo ow’okusiba awagira ebyetaago eby’enjawulo eby’okupakinga semikondokita n’okukozesebwa.
Okufumbisa okutuufu n’okufuga ebbugumu birongoosa omutindo gw’okukwatagana n’okukendeeza ku nkyukakyuka mu nkola.
Sipiidi y’ebifulumizibwa n’obulungi bw’okufulumya bintu bikulu mu kukola ebintu ebingi.
Die bonders zikozesebwa buli wa semikondokita die, chip oba microelectronic component we kyetaaga okuteekebwa mu butuufu era nga ziyungibwa mu ngeri eyesigika.
Ku IC okukuŋŋaanya, die attach ne package-level okufulumya.
Ku LED chip bonding, okupakinga LED n’ebintu eby’amasannyalaze ag’amaaso.
Ku modulo za semikondokita ez’amaanyi, ebyuma by’emmotoka n’ebyuma ebikozesa amaanyi.
Ku sensa, ebyuma ebitonotono n’ebitundu by’ebyuma ebituufu.
Ku modulo z’amaaso, ebyuma bya layisi n’ebitundu ebyesigika ennyo.
Ku modulo za RF, circuit za hybrid n’okukuŋŋaanya ebyuma eby’omuwendo omungi.
Newankubadde nga enkola ez’enjawulo ez’okupakinga semikondokita ziyinza okukozesa enkola ez’enjawulo, enkola z’emirimu ezisinga obungi ez’okusiba die zigoberera emitendera gy’okufulumya emikulu egiwerako.
Semiconductor dies zitegekebwa ne zitikkibwa mu nkola ya die bonder.
Omutwe gw’okusiba gusitula bulungi ekifa kya semikondokita.
Enkola z’amaaso zikwataganya die ne substrate okusobola okuteekebwa obulungi.
Epoxy dispensing oba eutectic heating eteekateeka ekifo ekikwatagana.
Die eteekebwa ku substrate oba package n’obutuufu obufugibwa.
Omutindo gwa bonding n’obutakyukakyuka mu kuteekebwa bikeberebwa nga okufulumya tekunnagenda mu maaso.
Esaanira okukola semiconductor ne LED ez’obuzito obw’amaanyi.
Flexible option for medium-volume oba ebyetaago by’okufulumya eby’enjawulo.
Ekozesebwa mu R&D, okufulumya sampuli n’okukuŋŋaanya mu ngeri entuufu mu bungi obutono.
Ekozesebwa mu kupakinga okw’omulembe n’okukozesa okuyungibwa kwa density enkulu.
Ku nkola ezeetaagisa okukola obulungi mu bbugumu n’amasannyalaze.
Ya bulijjo ku nkola z’okupakinga LED, IC ne semiconductor eza bulijjo.
Die bonding ne wire bonding zombi nkola nkulu ez’okupakinga semiconductor, naye zikola emirimu egy’enjawulo mu kiseera ky’okufulumya.
Ng’omugabi w’ebyuma ow’ekikugu, GEEKVALUE eyamba bakasitoma okuzuula die bonder esinga okusaanira okusinziira ku mbalirira, ekiruubirirwa ky’okufulumya, obudde bw’okubituusa n’ebyetaago by’ekikugu.
Ku layini empya ez’okufulumya, okuteekateeka obusobozi obw’ekiseera ekiwanvu ne pulojekiti z’amakolero ezeesigika ennyo.
Ku makolero ageetaaga ebyuma ebigezeseddwa, okutuusa amangu n’okukendeeza ku nsimbi eziteekebwamu.
Ku kukyusa, okugezesa okufulumya, pulojekiti ezifugibwa embalirira n’obwetaavu bw’ebyuma mu bwangu.
Nga tebannagula die bonder, bakasitoma balina okugeraageranya ekyuma kino okusinziira ku byetaago ebituufu eby’okufulumya, so si kika oba bbeeyi yokka.
Kebera obutuufu bw’okuteekebwa, okuddiŋŋana n’okutebenkera kw’enkola.
Kakasa die size range, ekika kya substrate n'okukwatagana kwa package.
Londa ebyuma bya otomatiki, semi-automatic oba manual okusinziira ku bifulumizibwa.
Geraageranya enkola za epoxy, eutectic, flip chip oba endala ez’okusiba die.
Ebyuma ebipya, ebikozesebwa n’ebiddaabiriziddwa biwa enkizo ez’enjawulo mu nsaasaanya.
Sipeeya, okukebera, okupima n’okuwagira oluvannyuma lw’okutunda bikulu nnyo.
GEEKVALUE eyamba bakasitoma okukendeeza ku bulabe bw’ebyuma nga bakebera embeera y’ebyuma, enkola z’entambula, enkola ya bonding n’embeera y’emirimu enkulu nga tebannasindikibwa.
Kebera embeera y’ebweru, obulungi bw’ekizimbe n’obuyonjo bw’ekyuma.
Kakasa nti ekyuma kitandika, enkola y’okuddamu n’okutebenkera kw’emirimu.
Kebera entambula y’ekisiki, obutuufu bw’okuteeka mu kifo n’embeera y’ebyuma.
Kebera enkola za kkamera, okukwatagana kw’amaaso n’enkola y’ebifaananyi.
Weekenneenye enkola y’omutwe gwa bonding, okufuga amaanyi n’obusobozi bw’okufulumya.
Okuwagira okupakinga okunywevu n’okutuusa ebyuma bya semiconductor mu nsi yonna.
Bakasitoma balondawo GEEKVALUE kubanga tubayamba okugonjoola ebizibu ebituufu eby’okugula: ebyuma ebiriwo, okufuga ssente, akabi ak’ekikugu, sipiidi y’okutuusa ebintu n’okuwagira emirimu egy’ekiseera ekiwanvu.
Gabana enkola yo ey’okufulumya, ekyetaagisa mu bonding n’embalirira.
Tuyamba okukwataganya model, embeera, brand ne technical specifications.
Tukakasa nti ekyuma kiriwo, embeera, obudde bw'okutuusa n'okuweebwa quotation.
Okukebera ebyuma, okupakinga ebweru w’eggwanga, okutambuza ebintu n’obuyambi obw’ekikugu bitegekebwa.
Die bonder kye kyuma ekipakinga ekya semiconductor ekikozesebwa okulonda, okuteeka n’okusiba dies ku substrates, lead frames, packages oba carriers.
Tugaba epoxy die bonders, eutectic die bonders, flip chip bonders, automatic die bonders n'ebyuma ebiddaabiriziddwa die bonding okufulumya semiconductor.
Yee, tuwaayo die bonders ezizzeemu okukeberebwa mu bujjuvu, ezigezeseddwa era ezipimiddwa nga zirina omulimu ogutebenkedde n’okugonjoola ensonga ezitasaasaanya ssente nnyingi ku layini z’okupakinga.
Die bonding ekwataganya die ya semiconductor ku package oba substrate, ate wire bonding eyunga die mu masannyalaze nga ekozesa waya z’ebyuma ebirungi.
Yee. Die bonders eziddaabiriziddwa zisaanira ebyetaago bingi eby’okufulumya ng’ekyuma kyekenneenyezebwa, ekigezeseddwa era nga kiwagirwa n’ebitundu n’okukikola.
Die bonders zikozesebwa nnyo mu kupakinga semiconductor, okukuŋŋaanya IC, optoelectronics, chips z’emmotoka, ebyuma ebikozesebwa n’okukola ebyuma eby’obujjanjabi.
Yee, tuwa okupakinga ebweru w’eggwanga mu ngeri ey’obukuumi, okutambuza ebintu mu ngeri ey’ekikugu n’okutuusa mu nsi yonna ku byuma byonna ebiyitibwa die bonder ne die bonding.
Tuwa okuteeka mu kifo, okupima ebyuma, okutendeka abaddukanya emirimu n’obuyambi obw’ekikugu obw’ekiseera ekiwanvu oluvannyuma lw’okutunda ku byuma ebisiba die.
Olina okugeraageranya obutuufu bw’okusiba, sayizi ya die, ekika kya substrate, enkola y’okusiba, obungi bw’okufulumya, embalirira, obudde bw’okutuusa n’obuyambi oluvannyuma lw’okutunda.
Osobola okutuukirira ttiimu yaffe ey’abatunzi ng’oyita ku WhatsApp, foomu ya yintaneeti oba email okukebera sitooka mu kiseera ekituufu, obusobozi n’emiwendo egy’omulembe ku die bonders.
Lwaki abantu bangi basalawo okukola ne GeekValue?
Brand yaffe esaasaana okuva mu kibuga okudda mu kirala, era abantu abatabalika bambuuzizza nti, "GeekValue kye ki?" Kisibuka mu kwolesebwa okwangu: okutumbula obuyiiya bw’Abachina nga bakozesa tekinologiya ow’omulembe. Guno mwoyo gwa kika ogw’okulongoosa obutasalako, ogukwese mu kugoberera kwaffe okutasalako okukola buli kantu n’essanyu ery’okusukka ebisuubirwa buli lwe tutuusa. Obukugu buno kumpi obw’okwewaayo n’okwewaayo si kugumiikiriza kwokka kw’abatandisi baffe, wabula n’omusingi n’ebbugumu ly’ekibinja kyaffe. Tusuubira nti ojja kutandikira wano era otuwe omukisa okutondawo obutuukirivu. Tukolere wamu okutondawo ekyamagero ekiddako ekya "zero defect".
Ebikwata ku ddyoTuukirira omukugu mu by’okutunda
Tuuka ku ttiimu yaffe ey’abatunzi okunoonyereza ku nkola ezikoleddwa ku mutindo ogutuukana obulungi n’ebyetaago bya bizinensi yo n’okukola ku bibuuzo byonna by’oyinza okuba nabyo.
© Eddembe lyonna liri mu buyinza bwaffe. Obuwagizi mu by'ekikugu:TiaoQingCMS
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