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BESI Omukwasi wa Bonder

Ebyuma ebipya, ebikozesebwa era ebiddaabiriziddwa BESI die bonder okukola LED, IC, MEMS, optoelectronics, power semiconductor n’okukola okupakinga okw’omulembe. Tuyamba bakasitoma okufuna ebyuma ebisaanira amangu, okukendeeza ku bulabe bw’okugula n’okuzzaawo obusobozi bw’okufulumya.

Kebera Stock & Funa Quote → Laba Ebizibu bya Bakasitoma →
Ebikozesebwa Ebizibu Okusanga Wagira legacy n'amangu BESI die bonder sourcing.
Obulabe bw’okusiga ensimbi obutono Okukebera, okugezesa n’okukebera embeera nga tonnasindikibwa.
Waliwo nnyunzi Okunoonya ebitundu, okwebuuza ku byuma n’okuwagira okufulumya.
BESI Die Bonder Machine
10+ Emyaka Obumanyirivu mu Byuma bya Semiconductor
30+ Amawanga Agaweereddwa Mu Nsi Yonna
3-7 Ennaku Fast Global Delivery Ku Sitooki Eriwo
24H Fast Quotation Ne Model Okukwatagana Obuwagizi
Inventory ya BESI eriwo

Ebikozesebwa mu byuma bya BESI Die Bonder & Sourcing Options

Yeekenneenya okulonda kwaffe okw’ekikugu mu kiseera ekituufu okw’emikutu gya BESI die bonding egyasooka okubeera egy’obwannannyini, egyakozesebwa, n’egyaddaabirizibwa, omuli Datacon ne Esec series. Buli nkola esobola okuteekebwateekebwa mu ngeri ey’enjawulo ng’erina ebikozesebwa eby’enkyukakyuka eby’enjawulo, modulo z’okupima okulaba, n’ebikozesebwa mu kulonda okusobola okukwatagana obulungi mu layini yo ey’okupakinga.

Tosobola kufuna model ya BESI Datacon oba Esec entongole gy'olina? Tuweereze ebigere bya package yo (BGA, QFN, LGA) ne alignment specs. Bayinginiya baffe bajja kukwatagana n’enkola esinga obulungi era bajja kukola ku nteekateeka z’okutunda ebweru w’eggwanga mu nsi yonna.
EBINTU EBIKULUMIRA KASITOMA

Ebizibu Ebitera Okubaawo Nga Ogula BESI Die Bonders

Abaguzi abasinga tebakoma ku kunoonya kyuma. Zeetaaga okufulumya okutebenkevu, ekiseera ekitono eky’okukulembera, akabi akatono n’obuwagizi obwesigika oluvannyuma lw’okugula.

01

Long Lead Time Okuva Mu Byuma Ebipya

Enteekateeka nnyingi ez’okufulumya teziyinza kulinda myezi ku die bonder empya. Bakasitoma beetaaga okunoonya ensibuko ez’amangu okusobola okugaziya oba okukyusa obusobozi mu bwangu.

02

Ebikozesebwa Ebizibu Okuzuula Eby’Obusika

Layini z’okufulumya enkadde zitera okwetaaga ebika bya BESI ebikwatagana, naye ensengeka eziyimiriziddwa oba ezitali zimu kizibu okusanga ku katale.

03

Bbeeyi Ennene Y'Ebyuma Ebipya

Ebyuma ebipya ebipakinga semikondokita byetaaga okussaamu ssente nnyingi. BESI die bonders ezikozesebwa oba eziddaabiriziddwa zisobola okuyamba okukendeeza ku mbalirira y’ebyuma.

04

Embeera y’Ekyuma Ekikozesebwa Tetegeerekeka bulungi

Abaguzi beeraliikirivu olw’ensonga ezikusike nga okwambala kw’ekisiki, obuzibu mu kulaba, ensobi mu pulogulaamu, ebitundu ebibula n’obutuufu bw’okukwatagana obutanywevu.

05

Obutaba na buyambi bwa tekinologiya

Abamu ku bagaba ebyuma batunda byuma byokka naye tebasobola kuwagira kulonda model, okwekebejja, okunoonya ebitundu oba okugatta okufulumya.

06

Puleesa y’obudde bw’okufulumya ebintu

Die bonder bw’eremererwa, buli lunaku lw’okuyimirira luyinza okukosa enteekateeka z’okutuusa ebintu, ebiragiro bya bakasitoma n’omuwendo gw’okufulumya.

BESI Die Bonding Process
Okufa Bonding Okuteekebwa mu ngeri entuufu ey’okupakinga kwa semiconductor
BYE TUGONJOLA

Si Mugabi w’Ekyuma Kyokka — Omukwanaganya w’Ebyuma Bwa Die Bonding Solution

GEEKVALUE eyamba abakola semiconductor okunoonya BESI die bonders ezisaanira okusinziira ku byetaago by’okufulumya, embeera y’ekyuma, embalirira n’obudde bw’okuzituusa.

Essira tulitadde ku kugonjoola akabi akatuufu ak’okugula: oba omuze gusaanira, oba embeera y’ekyuma ntangaavu, oba ebitundu n’obuyambi obw’ekikugu biriwo, era oba ebyuma bisobola okuwagira okufulumya oluvannyuma lw’okutuuka.

Okukwatagana n’ekyokulabirako Teesa ku bikolwa bya BESI die bonder ebisaanira okusinziira ku kika kya package n’obwetaavu bw’enkola.
Okukebera Ebyuma Kebera enkola z’ebisumuluzo nga tonnasindika okukendeeza ku bulabe bw’okugula obukwese.
Okuwagira Ebitundu Yamba okunoonya sipeeya omukulu okusobola okuddaabiriza n’okukola okumala ebbanga eddene.
Okutuusa ebintu mu nsi yonna Okupakinga ebweru w’eggwanga n’okuwagira okusindika mu nsi yonna ku byuma bya semiconductor.
LWAKI OTULONDA

Lwaki Bakasitoma Bagula BESI Die Bonders Okuva mu GEEKVALUE

Tuzimba page okwetoloola customer risk, so si slogans njereere. Ekigendererwa kwe kuleetera abaguzi okuwulira nti ebizibu byabwe ebya nnamaddala bisobola okukolebwako.

BESI Die Bonder Stock Sourcing Okunoonya Sitoowa mu bwangu

Tuyamba bakasitoma okuzuula amangu BESI die bonders eziriwo naddala ku kukyusibwa mu bwangu, layini ez’edda n’ebika ebiyimiriziddwa.

BESI Die Bonder Inspection Okukebera Nga Tonnasindika

Tukebera endabika y’ekyuma, embeera y’okutandika amaanyi, enkola y’entambula, enkola y’okulaba, pulogulaamu n’emirimu emikulu nga tetunnaba kutunda bweru.

Cost Effective BESI Die Bonder Enkola ezitali za ssente nnyingi

BESI die bonders ezikozesebwa n’okuddaabiriza ziyamba bakasitoma okukendeeza ku nsimbi eziteekebwa mu byuma ate nga bakuuma obusobozi bw’okufulumya.

BESI Die Bonder Technical Support Okwebuuza ku by’ekikugu

Tuwagira okulonda model, okukwatagana kw'enkola n'okukubaganya ebirowoozo ku nsengeka y'ebyuma nga tetunnagula.

BESI Die Bonder Spare Parts Obuwagizi bwa Sipeeya

Ku mmotoka za BESI die bonder enkadde, okubeerawo kwa sipeeya kikulu nnyo. Tuyamba bakasitoma okunoonya ebitundu n’okukendeeza ku bulabe bw’okuyimirira.

BESI Die Bonder Export Packing Export Okupakinga & Okutuusa ebintu

Ebyuma bya semiconductor byetaaga okupakinga obulungi, okutambuza ebintu okunywevu n’okubikwata n’obwegendereza okusobola okubituusa mu nsi yonna.

OKUSABA

Enkozesa Ya BESI Die Bonders

BESI die bonders zikozesebwa nnyo mu kukungaanya semiconductor, okupakinga okw’omulembe n’enkola z’okuyunga die mu ngeri entuufu.

LED Die Bonding Ku kupakinga LED, okuteeka ku sipiidi n’okufulumya okufulumya okutebenkevu.
Okupakinga kwa IC Die attach solutions for integrated circuit okukuŋŋaanya n'okupakinga layini.
Okupakinga kwa MEMS Ekozesebwa ku sensa, ebyuma ebitonotono ne modulo z’ebyuma ebituufu.
Ebyuma ebikozesebwa mu kulaba Okuwagira ebitundu by’amaaso, photonics ne microelectronics ez’omulembe.
Amaanyi Semikondokita Esaanira modulo z’amaanyi, ebyuma by’emmotoka n’ebyuma ebyesigika ennyo.
Ebyuma bya RF Precision die attach for RF modules n'ebitundu by'empuliziganya.
Okupakinga kwa COB Okupakinga chip-on-board ku modulo ez’ebyuma n’okukozesa okw’enjawulo.
Okupakinga eby’omulembe Ku kupakinga kwa semiconductor okuzibu ne layini z’okufulumya ez’omuwendo omungi.
BESI Die Bonder Inspection And Testing
OMUTENDO GW’OKWEKEBEJJA

Engeri gye Tukendeezaamu Obulabe Nga Tetunnasindika

Ebyuma bya semikondokita ebikozesebwa birina okukeberebwa obulungi nga tonnagula. Enkola yaffe ey’okukebera eyamba bakasitoma okutegeera embeera y’ekyuma n’okukendeeza ku bizibu bye batasuubira oluvannyuma lw’okubituusa.

Okukebera n’amaaso

Kebera embeera y’ebweru, obuyonjo, ekyuma ekijjuvu, ebibikka, ebipande ne waya.

Okugezesa Okukozesa Amasannyalaze

Kakasa okutandika, okulaga, okufuga enkolagana n'okuddamu okusookerwako okw'enkola.

Okukebera Enkola y’Entambula

Kebera entambula y’ekisiki, embeera ya siteegi, okutebenkera kw’ebyuma n’amaloboozi agatali ga bulijjo.

Okukebera Enkola y’Okulaba

Kebera kkamera, amataala, alignment n’embeera y’okutegeera ebifaananyi.

Okukebera omulimu gw’okukwatagana

Weekenneenye omutwe gwa bonding, obutuufu bw’okuteeka, vacuum, heater ne modules ezikwata ku nkola.

Okukebera Sofutiweya

Kakasa enkola ya software, okutikka enkola, ebyafaayo bya alamu n’emirimu gy’okufuga.

ENKOZESA Y’OKUTWALA OKUTWALA

Ebipya, Ebikozesebwa & Ebiddaabiriziddwa BESI Die Bonder Options

Bakasitoma ab’enjawulo balina embalirira ey’enjawulo, ebyetaago by’okutuusa n’okufulumya. Tuyamba okugeraageranya ekkubo erisinga obulungi ery’okugula.

Ekipya BESI The Bonder

Esaanira okuteekateeka layini empya ez’okufulumya n’okugaziya obusobozi okumala ebbanga eddene.

  • Ensengeka empya n’okuteekateeka okw’ekiseera ekiwanvu
  • Kirungi ku pulojekiti ezitebenkedde ez’okufulumya ebintu mu bungi
  • Ensimbi ezisaasaanyizibwa mu kusiga ensimbi ezisingako
  • Oyinza okwetaagisa obudde obuwanvu obw’okukulembera

Ekozesebwa BESI Die Bonder

Esaanira okukyusa mu bwangu, layini z’okufulumya eby’edda n’okufuga embalirira.

  • Okukendeeza ku nsimbi eziteekebwa mu byuma
  • Okutuusa amangu nga sitooka eriwo
  • Kirungi nnyo okuzzaawo obusobozi mu bwangu
  • Embeera y’ekyuma erina okukeberebwa obulungi

BESI Die Bonder erongooseddwa

Balanced option eri bakasitoma abeetaaga ssente entono n’okwetegekera ebyuma obulungi.

  • Ekizibu ky’okufulumya ekitali kya ssente nnyingi
  • Okukebera n’okuddaabiriza nga tonnasindika
  • Okufuga akabi okulungi okusinga ebyuma ebikozesebwa ebitamanyiddwa
  • Esaanira okugaziya okufulumya
EBIKOLWA EBY’ENJAWULO

Popular BESI Die Bonder Models Tusobola Okuyamba Source

Okubeerawo kukyuka nnyo. Tukwasaganye okukebera sitooka ya BESI die bonder eriwo kati, ensengeka n'obudde bw'okugituusa.

BESI Datacon 2200 evo Omukutu ogumanyiddwa ennyo ogwa die bonder ogw'okukozesa okupakinga kwa semiconductor.
Ekyuma Datacon 8800 Advanced die bonding solution ku nkola z’okupakinga ez’omuwendo omungi.
BESI Datacon ssaawa 2200 ez'ekiro Ekozesebwa mu mbeera ez’enjawulo ez’okufulumya die attach n’okupakinga.
BESI Datacon 8800 ekika kya fc Esaanira ku flip chip n’enkola ez’omulembe ezikwata ku kupakinga.
EKYUMA Empungu Ekozesebwa ku sipiidi ya die attach n'okukuŋŋaanya semiconductor okw'omulembe.
Enkola za BESI ezirina modulo nnyingi Enkola ezikyukakyuka ku layini z’okufulumya enzibu n’ez’okupakinga mu ngeri ya modulo.
Ebika bya LED Die Bonder Obuwagizi bw’okukwatagana kwa model ku byetaago by’okufulumya okupakinga kwa LED.
Ebikozesebwa mu kukola BESI eby’omulembe Okunoonya obuwagizi eri enkola z’okufulumya eziyimiriziddwa oba ezizibu okuzuula.
EBITUNDU N'OBUWAGIZI

Obuwagizi Tebukoma Oluvannyuma lw'okunoonya Ensibuko y'Ebyuma

Ku makolero ga semikondokita, okubeerawo kw’ebyuma okumala ebbanga eddene kikulu nnyo okusinga okugula omulundi gumu.

BESI Die Bonder Ebitundu Ebiwagira

Sipeeya mukulu nnyo ku BESI die bonders ezikozesebwa n’eza legacy. Tuyamba bakasitoma okunoonya ebitundu ebikulu okukendeeza ku bulabe bw’okuyimirira.

  • Kkamera n’ebitundu ebikwata ku kulaba
  • Omutwe gw’okusiba n’ebitundu ebikwatagana n’entambula
  • Ebitundu ebikwatagana ne vacuum ne heater
  • Ebipande eby’amasannyalaze ne modulo ezifuga
  • Ebintu ebikozesebwa n’ebitundu ebya bulijjo eby’okuddaabiriza

Okwebuuza ku by’ekikugu

Nga tetunnagula, tuyamba bakasitoma okunnyonnyola ebyetaago by’enkola n’okwewala okugula ensengeka enkyamu.

  • Okulonda model okusinziira ku nkola y’okufulumya
  • Okukebera embeera y’ekyuma ekikozesebwa
  • Ensengeka n'okukwatagana kw'enkola
  • Okupakinga ebweru w’eggwanga n’okuwagira okusindika
  • Empuliziganya okuva ewala olw’ebibuuzo eby’ekikugu
OKUMANYA OKW’OKUKOLA KU BY’OKUKOLA

BESI Die Bonder Sourcing & Integration Ebibuuzo ebibuuzibwa

Omukugu mu by’okuddamu mu yinginiya ku bikwata ku nsengeka z’omusingi gwa BESI (Datacon/Esec), okupima kwa sub-micron, n’okubeerawo kw’ebitundu ebikyusiddwa.

Biki ebitongole BESI (Datacon & Esec) die bonder configurations z'okola actively okugabira?

Tugaba, tuddaabiriza, n'okusengeka enkola ya BESI enkulu ey'obutuufu obw'amaanyi. Ku kukwatagana kwa chip eziwera, chip ya flip ey’omulembe, n’okugaba epoxy/eutectic okukyukakyuka, tusaba...BESI Datacon 2200 evo ne apm series. Ku kugumiikiriza kwa sub-micron okutuufu ennyo ne TCB (Thermo-Compression Bonding), tutereka...BESI Datacon 8800 ne 8800 fc series. Ku lw’okukwata leadframe mu ngeri ey’obwengula ey’amaanyi, tuwa...BESI Esec 2100 series ne pulatifomu za Eagle, ekoleddwa n’ebikozesebwa ebitongole eby’okulonda okukuuma ebigendererwa byo ebya OEE.

Okakasa otya obutuufu bw’okuteekebwa mu sub-micron enkola ya BESI 8800 oba 2200 erongooseddwa?

Buli musingi gwa BESI ogwasooka okubeerawo guyita mu nkola y’okukakasa yinginiya ey’ensonga eziwera. Abakugu baffe mu kupakinga bakola okupima mmotoka mu ngeri ey’ennyiriri (linear motor calibration) okujjuvu, okulaganya enkola y’okulaba okw’okukuza ennyo, n’okukebera okuddiŋŋana kw’entambula okutambula obutasalako. Nga tetunnapakinga ebweru w’eggwanga, tuddukanya live pick-and-place recipe dry runs nga tukozesa standard substrates okukakasa nti enkola eno ekuuma nnyo ebiragiro by’ekkolero eby’olubereberye, nga tuwa lipoota z’okukakasa vidiyo ezitangaavu mu bujjuvu eri ttiimu yo eya yinginiya.

Ogaba Custom Change Kits, ebikozesebwa mu pickup, ne sipeeya original ku legacy BESI models?

Yee. Okukendeeza ku budde bwa layini obutakola mu kiseera ky’okukyusa sayizi ya chip kye kintu kye tusinga okussaako essira. Tukuuma sitoowa nnyingi ez’ebintu ebikozesebwa n’ebikozesebwa mu nkyukakyuka ebikoleddwa mu ngeri ya yinginiya ebikwatagana n’enkola za BESI. Kuno kw’ogatta ‘pick-up collets’ ez’enjawulo, empiso ezifulumya, bulooka z’ebbugumu ezikoleddwa ku mutindo, ‘vacuum transducers’, ne modulo ezifuga mainboard. Tukakasa nti ne layini z’okufulumya eza BESI eziyimiriziddwa oba ez’edda zifuna obuyambi bwa ‘turnkey hardware’.

Die bonders zo eza BESI ezitegekeddwa zisobola okuwagira enkola za MEMS ez’omutindo gw’emmotoka oba ez’enjawulo?

Butereevu. Okusinziira ku nsengeka zo ez’okupakinga —ka kibeere nga kizingiramu Chip-on-Board (COB), modulo za RF ezizibu, ebyuma ebikozesebwa mu kulaba eby’emmotoka, oba sensa za MEMS enzibu —tulongoosa modulo z’okukwata n’okukola kw’ekyuma kya BESI. Tukwataganya vvaalu ezigaba, amaterekero g’okutegeera okulaba, n’ebifuga amaanyi g’okukwatagana okukwata ebitundu ebiwulikika awatali kumenya kwa situleesi oba obulema mu nsengeka.

Kiseera ki ekitera okukulembera okutuusa ebintu, era tuyinza tutya okusaba quote ey’ekikugu mu bujjuvu?

Ku BESI die bonders eziri mu sitoowa, okuteekateeka okwa bulijjo, okugezesa software, n’okugatta ebikozesebwa mu ngeri ey’enjawulo byetaaga wiiki 2 ku 4. Ebyuma byonna bisibirwa mu vacuum nga biriko ensawo eziziyiza ebyuma ebiziyiza okutambula (ESD) era nga biteekebwa mu kkeesi z’embaawo ezinywezeddwa mu nsi yonna ezifulumizibwa ebweru w’eggwanga. Okukebera obudde obutuufu n’okufuna quotation ya FOB/CIF evuganya, nsaba onyige ku link yaffe eya WhatsApp butereevu oba oweereze ebifaananyi byo ebya package n’ebiruubirirwa by’okufulumya butereevu eri ttiimu yaffe ey’abatunzi.

Lwaki abantu bangi basalawo okukola ne GeekValue?

Brand yaffe esaasaana okuva mu kibuga okudda mu kirala, era abantu abatabalika bambuuzizza nti, "GeekValue kye ki?" Kisibuka mu kwolesebwa okwangu: okutumbula obuyiiya bw’Abachina nga bakozesa tekinologiya ow’omulembe. Guno mwoyo gwa kika ogw’okulongoosa obutasalako, ogukwese mu kugoberera kwaffe okutasalako okukola buli kantu n’essanyu ery’okusukka ebisuubirwa buli lwe tutuusa. Obukugu buno kumpi obw’okwewaayo n’okwewaayo si kugumiikiriza kwokka kw’abatandisi baffe, wabula n’omusingi n’ebbugumu ly’ekibinja kyaffe. Tusuubira nti ojja kutandikira wano era otuwe omukisa okutondawo obutuukirivu. Tukolere wamu okutondawo ekyamagero ekiddako ekya "zero defect".

Ebikwata ku ddyo

Tuukirira omukugu mu by’okutunda

Tuuka ku ttiimu yaffe ey’abatunzi okunoonyereza ku nkola ezikoleddwa ku mutindo ogutuukana obulungi n’ebyetaago bya bizinensi yo n’okukola ku bibuuzo byonna by’oyinza okuba nabyo.

Okusaba Okutunda

Tugoberere

Sigala ng’okwatagana naffe okuzuula obuyiiya obusembyeyo, ebiweebwayo eby’enjawulo, n’okutegeera okujja okusitula bizinensi yo ku ddaala eddala.

Okutambulira mu Mangu

TUKUTUUKAKO

Endagiriro y’okutuukirira:

No. 18, oluguudo lw’amakolero mu Shangliao, mu kibuga Shajing, mu Disitulikiti y’e Baoan, Shenzhen, China

Ennamba y’essimu ey’okwebuuza:

+86 13823218491

Email:

smt-okutunda3@gdxinling.cn

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