Datacon 8800 CHAMEO Ekintu eky’omulembe ekiyitibwa Die Bonder

High-Precision Multi-Chip Die Bonder okusobola okupakinga kwa Semiconductor okw’omulembe

Besi Datacon 8800 CHAMEO Advanced ya mulembe oguddako nga ya mutindo gwa wagguluomukuumi w’ebintuekoleddwa okupakinga semikondokita ez’omulembe, okupakinga kwa wafer-level fan-out (WL-FOP), okugatta okw’enjawulo, n’okukuŋŋaanya 3D IC. Egatta obutuufu obw’enjawulo obw’okuteeka, okukyukakyuka kw’enkola, n’amakungula amangi ag’okufulumya ku mbeera z’okukola semikondokita ezisinga okusaba.

Lwaki Olonda Datacon 8800 CHAMEO Advanced?

• Obutuufu bw’okuteeka obw’ekika ekya waggulu ennyo

• Obusobozi bw’okukuŋŋaanya chip eziwera

• Obuwagizi bw’okupakinga mu ngeri ey’omulembe nga fan-out

• Okukwatagana kw’enkolagana ey’omugatte eyeetegefu mu biseera eby’omu maaso

• Enkwata ya substrate mu ngeri ekyukakyuka

• Dizayini y’okufulumya ebibala ebingi

• Enkola y’okukola ebintu mu bbanga eggwanvu enywevu

Ekoleddwa mu tekinologiya ow’omulembe ow’okupakinga

Datacon 8800 CHAMEO Advanced ekoleddwa mu ngeri ey’enjawulo ku:

• Okupakinga Fan-Out ku ddaala lya Wafer (WL-FOP) .– Enkola ennene eza panel ne wafer-level fan-out nga zeetaaga okuteeka die okutuufu n’okufuga amakungula.

• Okugatta IC mu ngeri ya 2.5D ne 3D– Awagira enzimba ez’enjawulo ez’okugatta n’okuyita mu silicon-via (TSV).

• Okukuŋŋaanya Module za Chip eziwera– Okukuŋŋaanya obulungi dies eziwera mu package emu.

• AI n’ebyuma bya kompyuta ebikola obulungi– Ultra-fine interconnect pitch n’obutuufu bw’okukwatagana obw’amaanyi.

• Okupakinga kwa RF ne Sensor– Alignment precision kikulu nnyo ku nkola y’ekyuma.

Tekinologiya Omukulu

• Enkola y’okukwatagana n’okulaba mu ngeri ey’obutuufu obw’amaanyi– Kkamera ya MP 4 ng’erina enkola ez’omulembe ez’okutereeza ensobi mu kiseera ekituufu.

• Okukola mu ngeri ya Dual-Robot Parallel– Emirimu gy’okulonda n’okuteeka n’okusiba mu kiseera kye kimu gitereeza ebivaamu.

• Okufuga Enkola mu Magezi– Alondoola amaanyi g’okusiba, ebbugumu, obudde, n’obutuufu bw’okuteeka.

• Tekinologiya w’okukwatagana mu ngeri ekyukakyuka– Awagira flip-chip, face-up, multi-chip, ne thermo-compression bonding.

Ebikulu ebikwata ku by’ekikugu

Emigaso eri abakola Semiconductor

• Okulongoosa mu Makungula– Ekendeeza ku nsobi mu kuteekawo olw’omutindo gw’okufulumya ogutakyukakyuka.

• Okukyukakyuka kw’enkola okw’oku ntikko– Awagira ebika bya package ebingi ku platform emu.

• Okukola ebintu ebitali bimu mu biseera eby’omu maaso– Mwetegefu okukola hybrid bonding n’okugatta omulembe oguddako.

• Okukendeeza ku bulabe bw’okufulumya ebintu– Okulondoola mu ngeri ey’amagezi kukakasa okwesigika okw’ekiseera ekiwanvu.

Ebyuma Ebisangibwawo

• Datacon 8800 CHAMEO erongooseddwa ey’omulembe

• Enkola Ezigezeseddwa Mu bujjuvu

• Ebyuma Ebyetegefu Okufulumya

• Obuwagizi bw'okussaako mu nsi yonna

• Okugaba Sipeeya

• Obuyambi bwa Yinginiya

• Obuwagizi bw’okulongoosa enkola

Datacon 8800 CHAMEO ne Die Bonder ey'ekinnansi

Ebikozesebwa Ebikwatagana

• Flip Chip Bonders ezikola ku nsonga eno

• Ebyuma Ebikwatagana (Hybrid Bonding).

• Ebyuma Ebipakiddwa Eby’omulembe

• Enkola z’okukwata Wafer

• BESI Omukwasi wa Bonder

Datacon 8800 Die Bonder Ebibuuzo ebibuuzibwa

1. Datacon 8800 CHAMEO Advanced ekozesebwa ki?

   Okusinga ekozesebwa mu mirimu egy’omulembe egy’okupakinga semikondokita omuli okupakinga okuva mu fan-out, okukuŋŋaanya chip eziwera, okugatta ebitali bimu, n’okukola 3D IC.

2. Enkola eno ewagira flip-chip bonding?

   Yee. Omukutu guno guwagira enkola zombi eza flip-chip ne face-up die bonding.

3. Obutuufu ki obw’okuteeka obuyinza okutuukibwako?

   Enkola eno egaba okutuuka ku ±3 μm obutuufu bw’okuteeka mu kitundu ku 3 Sigma.

4. Kisaanira okupakinga mu ngeri ya wafer-level fan-out?

   Yee. Ekyuma kino kyakolebwa mu ngeri ey’enjawulo okusobola okuwagira enkola z’okupakinga mu ngeri ya ‘high-precision wafer-level fan-out packaging’.

5. Omukutu gusobola okuwagira enkola z’okukwatagana ez’omugatte mu biseera eby’omu maaso?

   Omukutu gwa tekinologiya wa CHAMEO gukola ng’omusingi gw’enkulaakulana y’okukwatagana mu biseera eby’omu maaso ne tekinologiya ow’omulembe ow’okugatta.

6. Owaayo enkola za Datacon 8800 CHAMEO Advanced eziddaabiriziddwa?

   Yee. Enkola erongooseddwa era nga yeetegefu okufulumya ziyinza okubaawo okusinziira ku mbeera ya yinvensulo.