I-Datacon 8800 CHAMEO Advanced Die Bonder

I-High-Precision Multi-Chip Die Bonder ye-Advanced Semiconductor Packaging

I-Besi Datacon 8800 CHAMEO Advanced yimodeli yesizukulwana esilandelayo echanekileyo kakhuluibhondiYenzelwe ukupakishwa kwe-semiconductor okuphucukileyo, ukupakishwa kwe-fan-out kwinqanaba le-wafer (WL-FOP), ukuhlanganiswa okungafaniyo, kunye nokuhlanganiswa kwe-3D IC. Idibanisa ukuchaneka okugqwesileyo kokubekwa, ukuguquguquka kwenkqubo, kunye nemveliso ephezulu kwiindawo zokuvelisa ze-semiconductor ezifuna kakhulu.

Kutheni ukhetha iDatacon 8800 CHAMEO Advanced?

• Ukuchaneka kokubekwa okuphezulu kakhulu

• Ubuchule bokuhlanganisa ii-chip ezininzi

• Inkxaso ephambili yokupakisha i-fan-out

• Ukuhambelana kokubopha okuxutyiweyo okulungiselelwe ixesha elizayo

• Ukuphathwa kwe-substrate okuguquguqukayo

• Uyilo lwemveliso oluvelisa isivuno esiphezulu

• Ukusebenza kwemveliso okuzinzileyo kwexesha elide

Yenzelwe iiTekhnoloji zoPakisho eziPhambili

I-Datacon 8800 CHAMEO Advanced yenzelwe ngokukodwa:

• Ukupakishwa kweFan-Out kwiLevel Wafer (WL-FOP)– Iinkqubo ezinkulu zepaneli kunye ne-wafer ezifuna indawo echanekileyo yokubeka idayisi kunye nolawulo lokukhupha.

• Ukuhlanganiswa kwe-2.5D kunye ne-3D IC– Ixhasa ukuhlanganiswa okwahlukeneyo kunye noyilo lwe-through-silicon-via (TSV).

• Indibano yeModyuli yeeChip ezininzi– Ukuhlanganiswa kakuhle kwee-dies ezininzi kwiphakheji enye.

• Izixhobo zeKhompyutha ze-AI kunye ne-High-Performance– Iphimbo lokudibanisa elicolekileyo kakhulu kunye nokuchaneka okuphezulu kokulungelelanisa.

• Ukupakishwa kwe-RF kunye neSensor– Ukuchaneka kokulungelelaniswa kubalulekile ekusebenzeni kwesixhobo.

Ubuchwepheshe obuphambili

• INkqubo yoLungelelwaniso loMbono oluchanekileyo– Ikhamera ye-4 MP ene-algorithms eziphambili zokulungisa iimpazamo ngexesha langempela.

• Ukucubungula iirobhothi ezimbini ngaxeshanye– Imisebenzi yokukhetha indawo kunye nokubopha ngaxeshanye iphucula imveliso.

• Ulawulo lweNkqubo eNgqondileyo– Ijonga amandla okubopha, ubushushu, ixesha, kunye nokuchaneka kokubekwa.

• Iiteknoloji zokudibanisa eziguquguqukayo– Ixhasa i-flip-chip, i-face-up, i-multi-chip, kunye ne-thermo-compression bonding.

Iinkcukacha zobuGcisa eziPhambili

Iingenelo zabavelisi be-semiconductor

• Isivuno Esiphuculweyo– Kunciphisa iimpazamo zokubekwa ukuze imveliso ihambelane nomgangatho.

• Ukuguquguquka kweNkqubo ephezulu– Ixhasa iintlobo ezininzi zeepakeji kwiqonga elinye.

• Ukuveliswa Kwemveliso Okubonisa Ikamva– Ilungele ukuhlanganiswa kwe-hybrid kunye nokuhlanganiswa kwesizukulwana esilandelayo.

• Umngcipheko Oncitshisiweyo Wemveliso– Ukubeka iliso ngobuchule kuqinisekisa ukuthembeka kwexesha elide.

Izixhobo ezikhoyo

• I-Datacon 8800 CHAMEO ehlaziyiweyo ePhambili

• Iinkqubo eziVavanywe ngokupheleleyo

• Izixhobo Ezilungele Imveliso

• Inkxaso yoFakelo lweHlabathi

• Unikezelo lwezahlulo eziSpare

• Uncedo loBunjineli

• Inkxaso yoLungiso lweNkqubo

IDatacon 8800 CHAMEO vs iTraditional Die Bonder

Izixhobo ezinxulumene noko

• Iibhondi zeFlip Chip

• Izixhobo zokubopha ezihlanganisiweyo

• Izixhobo zokuPakisha eziPhambili

• Iinkqubo zokuphatha iiWafer

• I-BESI The Bonder

Imibuzo ebuzwa rhoqo ngeDatacon 8800 Die Bonder

1. Isetyenziselwa ntoni iDatacon 8800 CHAMEO Advanced?

   Isetyenziswa kakhulu kwizicelo eziphambili zokupakisha ze-semiconductor kuquka ukupakisha ngaphandle kwefeni, ukuhlanganisa ii-chip ezininzi, ukuhlanganiswa okungafaniyo, kunye nokuveliswa kwe-3D IC.

2. Ngaba le nkqubo iyayixhasa i-flip-chip bonding?

   Ewe. Eli qonga lixhasa zombini iinkqubo ze-flip-chip kunye ne-face-up die bonding.

3. Kukuphi ukuchaneka kokubekwa okunokufezekiswa?

   Inkqubo inika ukuchaneka kokubekwa kwendawo ukuya kuthi ga kwi-±3 μm kwi-3 Sigma.

4. Ingaba ifanelekile na ekupakisheni ifeni ephumayo kwinqanaba le-wafer?

   Ewe. Lo matshini wenzelwe ngokukodwa ukuxhasa usetyenziso lokupakisha oluphezulu lwe-wafer oluchanekileyo.

5. Ngaba iqonga lingayixhasa inkqubo yexesha elizayo yokubopha i-hybrid?

   Iqonga letekhnoloji ye-CHAMEO lisebenza njengesiseko sophuhliso lwexesha elizayo lwe-hybrid bonding kunye netekhnoloji yokudibanisa ephucukileyo.

6. Ngaba nibonelela ngeenkqubo zeDatacon 8800 CHAMEO Advanced ezihlaziyiweyo?

   Ewe. Iinkqubo ezihlaziyiweyo nezilungele imveliso zinokufumaneka ngokuxhomekeke kwimeko yesitokhwe.