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I-Flip Chip Die Bonder ene-Capacity ephezulu kakhulu yokuvelisa ngobuninzi
I-Datacon 8800 FC QUANTUM Advanced ilungele kakhuluI-Wire Bonderizicelo, ezibonelela ngesantya esiphezulu kakhulu kunye nokuchaneka kwiinkqubo zokuhlanganisa ii-flip-chip.
Kwimveliso enkulu ye-flip-chip,I-Flip Chip Bonderiqinisekisa ukuphumelela okuphezulu kunye nokusebenza kakuhle kweendleko ngelixa igcina ukuchaneka kokubekwa kwe-±5 µm.
Njengenxalenye yenkqubo yethuI-BESI The Bonderuluhlu, lo matshini udibanisa ulawulo oluphambili lwentshukumo kunye netekhnoloji ye-CRYSTAL flux ukuze kufezekiswe imveliso ezinzileyo nevelisa isivuno esiphezulu.
Kutheni Ukhetha iDatacon 8800 FC QUANTUM Advanced?
Ubungakanani bombane obufikelela kwi-10,000 UPH kwimveliso enomthamo omkhulu
Ukuchaneka kokubekwa okuphambili kushishino ±5 µm @ 3 Sigma
Inkqubo entsha ye-CRYSTAL flux yokufaka iitships ngokukhawuleza, ngokulinganayo, nangokucocekileyo
Ulawulo oluphambili lwentshukumo ngokucoca indlela ye-SMART ukuze isebenze ngesantya esiphezulu kwaye iguquguquke
Ulawulo olupheleleyo lwenkqubo oluqinisekisa isivuno esizinzileyo
Ixhasa ii-substrates ezahlukeneyo kunye nabathwali: i-BGA, i-FR4, i-ceramic, iibhodi eziguquguqukayo, imicu, iifreyimu ze-lead, njl.njl.
Izicelo eziPhambili
Izixhobo ze-elektroniki zabathengi: Iifowuni eziphathwayo, iithebhulethi, kunye nezixhobo ezinxitywayo
Iimodyuli zeMemori: iiphakheji zokugcina i-DRAM, iFlash, kunye nesizukulwana esilandelayo
Ii-Elektroniki zeeMoto: ii-ECU, ii-sensors, kunye neemodyuli ezibalulekileyo zokhuseleko
Ukupakisha iiChip eziJikelezileyo ze-High-Volume Flip
Iinkcukacha zobuGcisa eziPhambili
| Inkcazelo | Iinkcukacha |
|---|---|
| Ukuchaneka kokubekwa (X/Y) | ±5 µm @ 3 Sigma |
| Uluhlu lwamandla eBond | 200g - 5000g |
| Uluhlu lobungakanani beetships | 0.4mm - 30mm (Imo ekhawulezayo yeetships ezingaphantsi kwe-12mm) |
| I-substrate / Umthwali | I-BGA, i-FR4, i-Ceramic, iBhodi eguquguqukayo, i-Strip, i-Leadframe |
| Indawo yokuSebenza ephezulu | 13″ × 12″ |
| Inkxaso yobungakanani beWafer | 4″ ukuya kwi-12″ |
| Ubungakanani obukhulu | Ukuya kuthi ga kwi-10,000 yeetships/ngeyure |
| Ubukhulu (W×D×H) | 1600mm × 1200mm × 1940mm |
| Ubunzima | Malunga ne-2000 kg |
Iimpawu ezintsha
Inkqubo yeCRYSTAL Flux:Ukusetyenziswa ngokukhawuleza, okufanayo kunye nokuhlolwa okubonakalayo okuhlanganisiweyo ukuze kubekho ukubopha okucocekileyo nokuchanekileyo
Ulawulo oluPhambili lweNtshukumo:Ukucoca indlela ekrelekrele kunye neendlela ezilungiselelweyo kunciphisa ukungcangcazela ukuze kubekwe iitship ezigudileyo
I-X-Ray yoBuchule ephuculweyo:Ibona ngokukhawuleza ukungalungelelani emva kokubopha ukuze igcine isivuno
Uvavanyo lweMatrix BMC:Ukubeka esweni rhoqo kunye nokulinganisa ukuchaneka kokubekwa
Uthelekiso neDatacon 8800 CHAMEO Advanced
| Uphawu | 8800 FC QUANTUM Advanced | 8800 CHAMEO Advanced |
|---|---|---|
| Indawo ePhambili | Inkokeli yeMveliso eNinzi – isantya kunye nokusebenza kakuhle kweendleko | I-Advanced Packaging Pioneer - ukuguquguquka kwenkqubo |
| Ukuchaneka kokubekwa | ±5 µm @ 3 Sigma | ±5 / ±3 µm @ 3 Sigma |
| Inkxaso yeChip | I-Flip-chip kuphela (Ijonge phantsi) | I-Flip-chip kunye ne-Face-up (ukuguquguquka okuphezulu) |
| Izakhono Ezikhethekileyo | I-CRYSTAL Flux; Isantya Esigqithisileyo | I-WL-FOP kunye nokuPakisha okuPhambili |
Izixhobo ezikhoyo
Oomatshini be-QUANTUM Advanced abahlaziyiweyo
Ivavanyiwe ngokupheleleyo kwaye ikulungele ukuvelisa
Ukusasazwa Okukhawulezileyo (Imveliso Elula, Ukuhanjiswa kweeveki ezi-4)
Inkxaso yoFakelo lweHlabathi kunye noBunjineli
Unikezelo lwezahlulo eziSpare
Imibuzo ebuzwa rhoqo malunga nomatshini wokubopha isinyithi we-datacon
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Isetyenziselwa ntoni iDatacon 8800 FC QUANTUM Advanced?
I-Datacon 8800 FC QUANTUM Advanced yenzelwe ngokukodwa ukuveliswa ngobuninzi kwee-flip-chip assemblies. Ilungele ukwenziwa kwe-semiconductor ephezulu kwi-electronics zabathengi, ii-memory modules, ii-electronics zeemoto, kunye namanye amacandelo apho isantya kunye nokuchaneka kubaluleke kakhulu. Le nkqubo yenzelwe ukuba inikezele ngemveliso ephezulu ngelixa igcina ukuchaneka kokubekwa, iqinisekisa isivuno esizinzileyo kwimigca yemveliso.
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Yintoni eyona mveliso iphezulu yale die bonder?
I-QUANTUM Advanced inokufikelela kwiitships ezili-10,000 ngeyure (UPH) phantsi kweemeko ezifanelekileyo. Ubungakanani bokusebenza buxhomekeke kwizinto ezifana nobukhulu beetships, uhlobo lwe-substrate, imo yokubopha, kunye noqwalaselo lwenkqubo. Uyilo lwayo olunamandla aphezulu kunye nenkqubo entsha ye-CRYSTAL flux ivumela ukusetyenziswa kwe-flux ngokukhawuleza kunye nokuhlolwa, okufaka isandla kwisantya esimangalisayo semveliso.
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Ichaneke kangakanani indawo ebekwe kuyo?
Le nkqubo ibonelela ngokuchaneka kokubekwa kwe-±5 µm kwi-3 Sigma, nokuba ngesantya esiphezulu. Eli nqanaba lokuchaneka liqinisekisa ukubopha okuthembekileyo kwiipakethe ze-flip-chip, kunciphisa ukungalingani kunye nokuphucula isivuno iyonke. Uvavanyo lwe-Continuous Matrix BMC lujonga kwaye lulinganise indawo ukuze kugcinwe iziphumo ezihambelanayo kwi-chip nganye.
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Zeziphi iintlobo ze-substrates kunye nabathwali abanokusingatha?
I-QUANTUM Advanced ixhasa uluhlu olubanzi lwezixhobo kunye neempahla ezithwala izinto, kuquka i-BGA, i-FR4, i-ceramic, iibhodi eziguquguqukayo, imicu, kunye neefreyimu ze-lead. Ingathwala ii-wafers ukusuka kwi-4″ ukuya kwi-12″, kunye neendawo zokusebenza ukuya kuthi ga kwi-13″ × 12″, nto leyo eyenza ukuba ikwazi ukusetyenziswa kwiimfuno ezahlukeneyo zemveliso.
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Iqinisekisa njani isivuno esizinzileyo kwimveliso ekhawulezayo?
Le nkqubo isebenzisa ulawulo lwemveliso olupheleleyo kunye nokuhlolwa kwe-pseudo X-ray okuphuculweyo. Oku kuvumela abaqhubi ukuba babone ngokukhawuleza ukungalingani emva kokubopha, balungise iimpazamo ngoko nangoko, kwaye bathintele iiyunithi ezineziphene ukuba zingaqhubeki. Uvavanyo lweMatrix BMC olwakhelwe ngaphakathi luhlala lujonga ukuchaneka kokubekwa, luqinisekisa ukuba itshiphu nganye iyahlangabezana neemfuno ezifunekayo.
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Ingaba ifanelekile kwiindlela ezahlukeneyo zokuvelisa kunye nokusetyenziswa?
Ewe. I-QUANTUM Advanced ifanelekile kwimveliso yobuninzi obukhulu kodwa ikwaguquguquka ngokwaneleyo kwimveliso ephakathi. Yenzelwe ukujongana nezicelo ezahlukeneyo ze-flip-chip kwi-elektroniki yabathengi, iimodyuli zeemoto, izixhobo zememori, kunye namanye amacandelo afuna isantya kunye nokuchaneka.
