ave okutuuka ku 70% ku SMT Parts – Mu Stock & Ready to Ship

Funa Quote →
Besi Datacon 8800 FC QUANTUM Advanced Die Bonding Machine

Besi Datacon 8800 FC QUANTUM Ekyuma eky'omulembe ekikwatagana n'okufa

Besi Datacon 8800 FC QUANTUM Advanced ye automated die bonder ey’obusobozi obw’amaanyi ennyo eyakolebwa mu ngeri ey’enjawulo okukola ennyo enkuŋŋaana za flip-chip. Engineered for ultimate speed and cost-efficiency, eteekawo omutindo omupya ku semiconductor pa

Ebikwata ku ddyo

Ultra-High Capacity Flip Chip Die Bonder okukola ebintu mu bungi

Datacon 8800 FC QUANTUM Advanced nnungi nnyo ku...Ekiyungo kya Wayaokukozesa, okuwa sipiidi ey’amaanyi ennyo n’obutuufu ku nkola z’okukuŋŋaanya flip-chip.

Ku kukola flip-chip ku mutendera omunene,...Flip Chip Bonder nga bwe kiriokukakasa nti okufulumya okusingawo n’okukendeeza ku nsaasaanya ate ng’ekuuma obutuufu bw’okuteeka ±5 μm.

Ng’ekimu ku bitundu byaffe...BESI Omukwasi wa Bonderlineup, ekyuma kino kigatta tekinologiya ow’omulembe ow’okufuga entambula ne tekinologiya wa CRYSTAL flux okutuuka ku kukola okutebenkedde, okuvaamu amakungula amangi.

Besi Die Bonder Datacon 8800 FC QUANTUM advanced

Lwaki Olonda Datacon 8800 FC QUANTUM Advanced?

  • Maximum throughput okutuuka ku 10,000 UPH okukola high-volume

  • Obutuufu bw’okuteeka obukulembedde mu makolero ±5 μm @ 3 Sigma

  • Enkola ya CRYSTAL flux ey’obuyiiya ey’okuteeka chip mu bwangu, mu ngeri ya kimu, era ennyonjo

  • Okufuga entambula okw’omulembe nga kuliko okusengejja ekkubo mu ngeri ya SMART okusobola okukola obulungi ku sipiidi ey’amaanyi

  • Okufuga enkola enzijuvu okukakasa nti amakungula gatebenkedde

  • Awagira substrates ez’enjawulo n’abasitula: BGA, FR4, seramiki, ebibaawo ebikyukakyuka, emiguwa, leadframes, n’ebirala.

Ebikozesebwa Ebikulu

  • Ebyuma ebikozesebwa mu byuma bikalimagezi: Essimu ez’amaanyi, tabuleti, n’ebyuma ebyambalibwa

  • Modules z’okujjukira: DRAM, Flash, ne packages z’okutereka ez’omulembe oguddako

  • Ebyuma ebikozesebwa mu mmotoka: ECU, sensa, ne modulo ezikulu mu by’okwerinda

  • General Okupakinga Chip za Flip ez’obunene obw’amaanyi

Ebikulu ebikwata ku by’ekikugu

EbyefaananyiEbikwata ku ddyo
Obutuufu bw’okuteeka (X/Y) .±5 μm @ 3 Sigma nga bwe kiri
Bond Amaanyi Range200g - 5000g
Chip Size Range0.4mm - 30mm (Mode ey'amangu ku<12mm chips)
Substrate / EkitwalaBGA, FR4, Ceramic, Olubalaza olukyukakyuka, Strip, Leadframe
Max Ekifo eky'Okukoleramu13″ × 12″
Obuwagizi bwa Sayizi ya Wafer4′′ okutuuka ku 12′′
Obusobozi obusinga obuneneChips ezituuka ku 10,000/essaawa
Ebipimo (W×D×H) .1600mm × 1200mm × 1940mm
KigamboNga. kkiro 2000

Ebintu Ebiyiiya

  • Enkola ya CRYSTAL Flux:Okukozesa flux ey’amangu, eya kimu n’okukebera okulaba okugatta okusobola okukwatagana okuyonjo era okutuufu

  • Okufuga entambula okw’omulembe:Okusengejja ekkubo mu ngeri ya SMART n’enkola ezirongooseddwa bikendeeza ku kukankana okusobola okuteeka chip mu ngeri ennungi

  • Pseudo X-Ray eyongezeddwamu amaanyi:Ezuula mangu misalignment post-bonding okukuuma amakungula

  • Okugezesa kwa Matrix BMC:Okulondoola obutasalako n’okupima obutuufu bw’okuteekebwa

Okugeraageranya ne Datacon 8800 CHAMEO Advanced

Ekintu eky'enjawulo8800 FC QUANTUM Eky'omulembe8800 CHAMEO Okugenda mu maaso
Okuteeka Ebifo Ebikulu (Core Positioning).Mass Production Leader – sipiidi & okukendeeza ku nsimbiAdvanced Packaging Pioneer – okukyukakyuka mu nkola
Obutuufu bw’okuteeka±5 μm @ 3 Sigma nga bwe kiri±5 / ±3 μm @ 3 Sigma
Obuwagizi bwa ChipFlip-chip yokka (Face-down) .Flip-chip & Face-up (okukyukakyuka kwa waggulu)
Obusobozi obw’enjawuloCRYSTAL Flux y’okutambula kw’ebintu; Sipiidi EnsukkiriddeWL-FOP & Okupakinga okw'omulembe

Ebyuma Ebisangibwawo

  • Ebyuma bya QUANTUM eby'omulembe ebiddaabiriziddwa

  • Egezeseddwa mu bujjuvu era nga yeetegefu okufulumizibwa

  • Okuteeka mu nkola amangu (Lean Production, okutuusa wiiki 4)

  • Ensi Yonna mu Kussaawo n'Obuwagizi bwa Yinginiya

  • Okugaba Sipeeya

datacon ekyuma ekigatta ekyuma FAQ

  1. Datacon 8800 FC QUANTUM Advanced ekozesebwa ki?

    Datacon 8800 FC QUANTUM Advanced ekoleddwa mu ngeri ey’enjawulo okukola ebintu ebinene ebiyitibwa flip-chip assemblies. Kirungi nnyo okukola semikondokita ez’amaanyi mu byuma ebikozesebwa, modulo z’okujjukira, ebyuma by’emmotoka, n’ebitundu ebirala nga sipiidi n’obutuufu bikulu nnyo. Enkola eno erongooseddwa okusobola okutuusa amaanyi amangi ate nga ekuuma obutuufu bw’okuteekebwa, okukakasa nti amakungula gatebenkedde mu layini z’okufulumya.

  2. Kiki ekisinga okuyita mu die bonder eno?

    QUANTUM Advanced esobola okutuuka ku chips eziwera 10,000 buli ssaawa (UPH) mu mbeera ennungi. Okuyita mu butuufu kisinziira ku bintu nga obunene bwa chip, ekika kya substrate, bonding mode, n’ensengeka y’enkola. Dizayini yaayo ey’obusobozi obw’amaanyi n’enkola ya CRYSTAL flux ey’obuyiiya bisobozesa okukozesa n’okukebera flux mu bwangu, ekiyamba ku sipiidi ey’enjawulo ey’okufulumya.

  3. Okuteekebwa kutuufu kwenkana wa?

    Enkola eno egaba obutuufu bw’okuteeka ±5 μm ku 3 Sigma, ne ku sipiidi esingako. Omutendera guno ogw’obutuufu gukakasa okukwatagana okwesigika ku bipapula bya flip-chip, okukendeeza ku butakwatagana n’okulongoosa amakungula okutwalira awamu. Okugezesa kwa Matrix BMC okutambula obutasalako kulondoola n’okupima okuteekebwa okukuuma ebivuddemu ebikwatagana ku buli chip.

  4. Bika ki ebya substrates n’ebisitula by’esobola okukwata?

    QUANTUM Advanced ewagira ebintu bingi ebiyitibwa substrates n’ebitwala, omuli BGA, FR4, ceramic, flexible boards, strips, ne leadframes. Esobola okusuza wafers okuva ku 4′′ okutuuka ku 12′′, n’ebifo we bakolera okutuuka ku 13′′ × 12′′, ekigifuula ekola emirimu mingi ku byetaago by’okufulumya eby’enjawulo.

  5. Kikakasa kitya amakungula agatebenkevu mu kukola ebintu eby’amaanyi?

    Enkola eno ekozesa okufuga okufulumya mu nkola enzijuvu nga kugatta wamu n’okukebera okw’obulimba okwa X-ray okunywezeddwa. Kino kisobozesa abaddukanya okuzuula amangu obutakwatagana oluvannyuma lw’okukwatagana, okutereeza ensobi amangu ddala, n’okuziyiza yuniti eziriko obuzibu okugenda mu maaso. Okugezesa kwa Matrix BMC okuzimbibwamu kulondoola obutasalako obutuufu bw’okuteekebwa, okukakasa nti buli chip etuukana n’ebiragiro by’oyagala.

  6. Kisaanira ku minzaani ez’enjawulo ez’okufulumya n’okukozesebwa?

    Yee. QUANTUM Advanced nnungi nnyo okukola ebintu mu bungi mu bungi naye era ekyukakyuka ekimala okukola ebintu eby’omutindo ogwa wakati. Ekoleddwa okukola emirimu egy’enjawulo egya flip-chip mu byuma ebikozesebwa, modulo z’emmotoka, ebyuma ebijjukira, n’ebitundu ebirala ebyetaagisa sipiidi n’obutuufu.

Emiko egyasembyeyo

Lwaki abantu bangi basalawo okukola ne GeekValue?

Brand yaffe esaasaana okuva mu kibuga okudda mu kirala, era abantu abatabalika bambuuzizza nti, "GeekValue kye ki?" Kisibuka mu kwolesebwa okwangu: okutumbula obuyiiya bw’Abachina nga bakozesa tekinologiya ow’omulembe. Guno mwoyo gwa kika ogw’okulongoosa obutasalako, ogukwese mu kugoberera kwaffe okutasalako okukola buli kantu n’essanyu ery’okusukka ebisuubirwa buli lwe tutuusa. Obukugu buno kumpi obw’okwewaayo n’okwewaayo si kugumiikiriza kwokka kw’abatandisi baffe, wabula n’omusingi n’ebbugumu ly’ekibinja kyaffe. Tusuubira nti ojja kutandikira wano era otuwe omukisa okutondawo obutuukirivu. Tukolere wamu okutondawo ekyamagero ekiddako ekya "zero defect".

Ebikwata ku ddyo

Tuukirira omukugu mu by’okutunda

Tuuka ku ttiimu yaffe ey’abatunzi okunoonyereza ku nkola ezikoleddwa ku mutindo ogutuukana obulungi n’ebyetaago bya bizinensi yo n’okukola ku bibuuzo byonna by’oyinza okuba nabyo.

Okusaba Okutunda

Tugoberere

Sigala ng’okwatagana naffe okuzuula obuyiiya obusembyeyo, ebiweebwayo eby’enjawulo, n’okutegeera okujja okusitula bizinensi yo ku ddaala eddala.

kfweixin

Sikaani okugattako WeChat

Saba Quote