Ekyuma ekisiba ebifa ekya BESI Datacon 2200 EVO

BESI Datacon 2200EVO nkola ya die-bonding ekola mu bujjuvu, ekola bulungi nnyo, ekola emirimu mingi ekozesebwa mu nkola y’okupakinga eby’emabega wa semiconductor. Omulimu gwayo omukulu tegukyali ku dicing, wabula "bonding."

Emirimu gyayo emikulu mulimu:

Die Bonding (Die Attach): Elonda dies ssekinnoomu ezisaliddwamu ebitundu okuva mu fuleemu ya wafer era n’eziteeka mu butuufu ku substrate, leadframe oba die endala.

Surface Mount (SMT): Ng’oggyeeko bare dies, esobola n’okusiba ebitundu ebipakiddwa, naye guno si gwe mulimu gwayo omukulu.

Enkola Ennyingi: Tekoma ku kukola die bonding ey’ekinnansi (nga ekozesa ebisiiga nga epoxy resin) naye era n’enkola ez’enjawulo ez’omulembe ez’okupakinga.

Mu ngeri ennyangu, ye roboti ekuŋŋaanya evunaanyizibwa ku micromanipulation enzibu ennyo eya semiconductor fabs, okutuuka ku butuufu bwa micron-level.

II. Tekinologiya Omukulu, Ebintu, n'Amakulu ga "EVO".

"EVO" mu ngeri entuufu kitegeeza "Evolution," ekitegeeza nti omulembe guno ogwa platforms guwa enkulaakulana ey'amaanyi mu sipiidi, obutuufu, n'okukyukakyuka bw'ogeraageranya n'emilembe egyayita.

1. Ultra-High Precision & Okukyukakyuka

Obutuufu: Obutuufu bw’okuteeka mu ngeri entuufu butuuka ku ±15 μm @ 3σ oba okusingawo. Kino kikulu nnyo mu kuteeka chips ezigenda zeeyongera obutono nga zirina ebipimo bya ppini ebirungi.

Versatile Platform: 2200EVO ye modular platform esobola okukyusakyusa mu nkola ez’enjawulo, okuva ku kuteeka die mu ngeri ey’ekinnansi okutuuka ku nkola ezisinga obuzibu eza flip-chip, nga ekyusa emitwe egy’enjawulo egy’okuteeka n’ensengeka.

2. Tekinologiya ow’omulembe ow’okuteeka abantu mu bifo

Thermocompression Bonding (TC): Eno y’emu ku tekinologiya waayo omukulu ow’omulembe. Mu nkola y’okuteeka, ebbugumu ne puleesa biteekebwa ku chip omulundi gumu, ne bikola omukago ogwesigika ogw’amasannyalaze n’ebyuma wakati w’ebikonde bya chip ne paadi za substrate. Kino kikozesebwa nnyo mu nkola za flip-chip naddala mu kupakinga kwa density enkulu, 3D.

Laser-Assisted Bonding (LAB): Nga ekozesa layisi ng’ensibuko y’ebbugumu erisangibwa ennyo mu kitundu okusobola okubugumya, etuuka ku miwendo gya ramp egy’amangu era ekendeeza ku situleesi y’ebbugumu, ekigifuula ennungi eri chips oba ebitundu ebigonvu ennyo mu bbugumu.

Mass Reflow: Chips zisooka kuteekebwa oluvannyuma ne zisolder mu oven ya reflow.

3. Enkola ey’amaanyi ey’okulaba n’okukwatagana

Enkola ya Kamera nnyingi: Erimu kkamera etunudde waggulu ey’obulungi obw’amaanyi (okuzuula ekifo paadi we ziri ku substrate) ne kkamera etunudde wansi (eyungiddwa mu mutwe gw’okuteeka okuzuula ekifo ebikonde ku chip we biri).

Okukola ebifaananyi mu kiseera ekituufu: Nga ekozesa enkola enzibu, enkola eno ebalirira okukyama (X, Y, ne θ) wakati w’ebikonde bya chip ne substrate pads mu kiseera ekituufu era n’eliyirira nga tennateekebwa, okukakasa nti ekwatagana bulungi.

Flip Chip Alignment: Enkola yaayo ey’okulaba esobola okulaba okuyita mu die (ku bintu ebimu) n’okulaba butereevu bump array wansi, ekisumuluzo ky’okutuuka ku kuteeka flip chip mu ngeri entuufu.

4. Okukyusakyusa (Modularity) n’okusengeka (Configurability).

Abakozesa basobola okulonda bino wammanga okusinziira ku byetaago by’okufulumya:

Emitwe egy’enjawulo egy’okuteeka: Emitwe egy’okuteeka egy’enjawulo egy’obunene n’enkola ez’enjawulo (nga TC ne LAB).

Enkola y’okuliisa: Ewagira okutikka wafer-on-frame n’ebika by’enkola ez’enjawulo ez’okutambuza substrate (rails, worktables, n’ebirala).

Enkola y’okugaba (Optional): Valiva z’okugaba mu ngeri entuufu ezigatta zisobozesa okukozesa obulungi flux oba underfill ku substrates nga tezinnaba kuteekebwa.

5. Okukola n’Okwesigamizibwa

High Throughput: Okufuga entambula okulungi n’emitwe egy’okuteeka ku sipiidi ya waggulu bituuka ku cycles ez’okufulumya waggulu (UPH) ate nga zikuuma obutuufu obw’amaanyi ennyo.

Okwesigamizibwa kwa waggulu (Uptime): Ekoleddwa mu mbeera enzibu ez’okufulumya amakolero obutasalako 24/7, egaba obudde obw’amaanyi wakati w’okulemererwa (MTBF) n’obudde obutono obw’okuddaabiriza (MTTR).

III. Enkozesa eya bulijjo

BESI Datacon 2200EVO okusinga ekozesebwa mu nkola z’okupakinga ez’omulembe n’ez’omulembe:

Flip Chip: Eno ye nkola yaayo esinga okubeera eya kalasi, ekozesebwa nnyo mu kupakinga chips nga CPUs, GPUs, ne ASICs ez’omulembe.

2.5D/3D Integrated Packaging: Ekozesebwa okusiba chips ku silicon interposers oba okukola chip-on-chip stacking.

Heterogeneous Integration: Egatta chips ezirina process nodes ez’enjawulo n’emirimu (nga logic chips, memory chips, ne RF chips) mu package emu.

Sensor Packaging: Ekozesebwa okukuŋŋaanya obulungi ebintu nga CIS (image sensors) ne MEMS sensors.

Optoelectronics Packaging: Enkola nga okukuŋŋaanya layisi ne modulo z’amaaso.

IV. Embeera y’akatale n’okufunza

BESI Datacon mukulembeze mu nsi yonna mu kukola flip chip ne tekinologiya ow’omulembe owa die attach.

Obukulembeze bwa tekinologiya: BESI Datacon erina enkizo ez’amaanyi mu by’ekikugu n’omugabo gw’akatale naddala mu nkola ez’omulembe nga thermocompression bonding (TCB) ne laser-assisted bonding (LAB).

Okutunuulira eby’omulembe: Omukutu gwa 2200EVO gutunuulira enkola ez’omulembe ezeetaaga obusobozi obw’oku ntikko obw’obutuufu, obwesigwa, n’okukola, ng’evuganya ne kkampuni nga ASM Pacific Technology.

Okuvuga Obuyiiya: Ebyuma byayo kye kimu ku bikozesebwa mu kukola ebintu bingi eby’omulembe eby’okupakinga, gamba nga 2.5D/3D ICs.

Mu bufunze, BESI Datacon 2200EVO nkola ya die attach system ekola mu bujjuvu mu ngeri ey’otoma ey’okupakinga semikondokita ez’omulembe, ng’erina obutuufu obw’amaanyi ennyo n’obusobozi bw’enkola ey’omulembe naddala thermocompression bonding. Kikiikirira omulembe oguliwo kati mu tekinologiya wa die attach era nga kye kitundu ekikulu mu kukola ebintu nga processors ez’omulembe, artificial intelligence chips, ne chips z’empuliziganya ez’amaanyi.