BESI Datacon 2200 EVO kufa chomangira makina

BESI Datacon 2200EVO ndi makina okhazikika, olondola kwambiri, ophatikizika ambiri omwe amagwiritsidwa ntchito mu semiconductor back-end package. Ntchito yake yayikulu sikulinso kudulira, koma "kulumikizana."

Ntchito zake zazikulu ndi izi:

Die Bonding (Die Attach): Zosankha zomwe zimadulidwa zimafa kuchokera pa chimango chophwanyika ndikuziyika pagawo, leadframe, kapena kufa kwina.

Surface Mount (SMT): Kuphatikiza pa kufa wopanda kanthu, imathanso kumangiriza zida, koma iyi si ntchito yake yayikulu.

Mapulogalamu Angapo Njira: Sizimangochita zomangira zachikhalidwe (pogwiritsa ntchito zomatira monga epoxy resin) komanso njira zingapo zapamwamba zoyikamo.

Mwachidule, ndi loboti yophatikizira yomwe imayang'anira kuwongolera kosavuta kwa nsalu za semiconductor, kukwaniritsa kulondola kwa ma micron.

II. Core Technologies, Features, ndi Tanthauzo la "EVO"

"EVO" nthawi zambiri imayimira "Evolution," kutanthauza kuti m'badwo uno wamapulatifomu umapereka kusintha kwakukulu pa liwiro, kulondola, komanso kusinthasintha poyerekeza ndi mibadwo yam'mbuyomu.

1. Kulondola Kwambiri & Kusinthasintha

Kulondola: Kuyika bwino kumafika ±15 μm @ 3σ kapena kupitilira apo. Izi ndizofunikira pakuyika tchipisi tating'onoting'ono tokhala ndi mapini abwino kwambiri.

Pulatifomu Yosiyanasiyana: 2200EVO ndi nsanja yokhazikika yomwe imatha kusintha magwiridwe antchito osiyanasiyana, kuyambira pakuyika kufa kwachikhalidwe kupita kunjira zovuta kwambiri za flip-chip, posintha mitu ndi masinthidwe osiyanasiyana.

2. Zamakono Kuyika Technology

Thermocompression Bonding (TC): Ichi ndi chimodzi mwamakina ake apamwamba kwambiri. Panthawi yoyika, kutentha ndi kupanikizika kumagwiritsidwa ntchito panthawi imodzi pa chip, kupanga magetsi odalirika ndi opangidwa ndi makina pakati pa chipwirikiti cha chip ndi mapepala a gawo lapansi. Izi zimagwiritsidwa ntchito kwambiri mumayendedwe a flip-chip, makamaka pakuyika kwakukulu, ma 3D ma CD.

Laser-Assisted Bonding (LAB): Kugwiritsa ntchito laser ngati gwero la kutentha komwe kuli komweko komwe kumatenthetsa, kumapangitsa kuti pakhale mayendedwe othamanga komanso kumachepetsa kupsinjika kwamafuta, ndikupangitsa kuti ikhale yabwino kwa tchipisi tating'onoting'ono kwambiri kapena zigawo zikuluzikulu.

Mass Reflow: Tchipisi zimayikidwa poyamba ndikugulitsidwa mu uvuni wobwereranso.

3. Wamphamvu Masomphenya ndi Maina dongosolo

Makina Amitundu Yambiri: Okhala ndi kamera yowoneka bwino kwambiri (yowunikira malo a mapepala pagawo) ndi kamera yoyang'ana pansi (yophatikizidwa pamutu woyikapo kuti izindikire komwe kuli mabampu pa chip).

Kukonza Zithunzi Munthawi Yeniyeni: Pogwiritsa ntchito ma aligorivimu otsogola, makinawa amawerengera kupatuka (X, Y, ndi θ) pakati pa ma chip bamp ndi ma substrate pads munthawi yeniyeni ndikulipiritsa asanayike, kuwonetsetsa kulondola kwabwino.

Flip Chip Alignment: Kachitidwe kake ka masomphenya amatha kuwona kudzera mu kufa (kwa zida zina) ndikuwona mwachindunji mzere wapansi, womwe ndi wofunikira kuti mukwaniritse kuyika kwapamwamba kwambiri kwa flip chip.

4. Modularity ndi Configurability

Ogwiritsa ntchito amatha kusankha zotsatirazi potengera zomwe akufuna kupanga:

Mitu Yosiyanasiyana Yoyikira: Mitu yodzipatulira yoyika masaizi ndi njira zosiyanasiyana (monga TC ndi LAB).

Dongosolo Lakudyetsera: Imathandizira kutsitsa kwawafer-pa-frame ndi mitundu yosiyanasiyana yamayendedwe apansi panthaka (njanji, zogwirira ntchito, ndi zina).

Dongosolo Loperekera (Mwachidziwitso): Ma valve ophatikizira olondola amathandizira kugwiritsa ntchito bwino kusinthasintha kapena kutsika pansi pazigawo zisanayike.

5. Kupanga ndi Kudalirika

Kupititsa patsogolo: Kuwongolera koyenda bwino komanso mitu yoyika mothamanga kwambiri kumakwaniritsa ma cycles apamwamba (UPH) ndikusunga kulondola kwambiri.

Kudalirika Kwambiri (Uptime): Zopangidwira malo ovuta a 24 / 7 opitiliza kupanga mafakitale, amapereka nthawi yayitali pakati pa zolephera (MTBF) ndi nthawi yochepa yokonza (MTTR).

III. Ntchito Zofananira

BESI Datacon 2200EVO imagwiritsidwa ntchito makamaka pamapaketi apamwamba komanso apamwamba:

Flip Chip: Iyi ndiye pulogalamu yake yapamwamba kwambiri, yomwe imagwiritsidwa ntchito kwambiri pakuyika tchipisi monga ma CPU, ma GPU, ndi ma ASIC apamwamba kwambiri.

2.5D/3D Integrated Packaging: Amagwiritsidwa ntchito polumikizira tchipisi ku silicon interposer kapena kupanga chip-on-chip stacking.

Kuphatikiza kwa Heterogeneous: Kuphatikizira tchipisi tokhala ndi ma node osiyanasiyana ndi ntchito (monga logic chips, memory chips, ndi RF chips) mu phukusi limodzi.

Sensor Packaging: Amagwiritsidwa ntchito posonkhanitsa mwatsatanetsatane zinthu monga CIS (masensa azithunzi) ndi masensa a MEMS.

Kupaka kwa Optoelectronics: Mapulogalamu monga kusonkhana kwa ma lasers ndi ma module a kuwala.

IV. Msika ndi Chidule Chake

BESI Datacon ndi mtsogoleri wapadziko lonse lapansi mu flip chip ndiukadaulo wapamwamba wa die attach.

Utsogoleri Waukadaulo: BESI Datacon imakhala ndi maubwino aukadaulo komanso gawo la msika, makamaka m'njira zapamwamba monga thermocompression bonding (TCB) ndi laser-assisted bonding (LAB).

Kutsata Mapeto Apamwamba: Pulatifomu ya 2200EVO imayang'ana ntchito zapamwamba zomwe zimafuna kulondola kwambiri, kudalirika, ndi luso la ndondomeko, kupikisana ndi makampani monga ASM Pacific Technology.

Driving Innovation: Zipangizo zake ndizofunikira kupanga zida zamapangidwe apamwamba kwambiri, monga 2.5D/3D ICs.

Mwachidule, BESI Datacon 2200EVO ndi makina opangira makina apamwamba kwambiri a semiconductor, omwe ali ndi luso lapamwamba kwambiri komanso luso lapamwamba kwambiri, makamaka thermocompression bonding. Imayimira ukadaulo wamakono mu die attach technology ndipo ndi gawo lalikulu lazinthu zopanga monga ma processor apamwamba kwambiri, tchipisi tanzeru zopanga, ndi tchipisi tambiri zolumikizirana.