BESI ESEC 2100 hS BESI Die Bonder

Gawo la Banja la BESI Die Bonder

ESEC 2100 hS ndi ya makampani otsogola mumakampaniBESI The BonderMa portfolio azinthu, mitundu yosiyanasiyana ya ma semiconductor die attach platforms omwe amadziwika padziko lonse lapansi chifukwa cha kudalirika kwawo, mphamvu zawo, komanso kukhazikika kwa kupanga kwa nthawi yayitali.

Mayankho ena otchuka a BESI die bonding ndi awa:Datacon 8800 FC QUANTUMkuti mupange ma chip othamanga kwambiri komansoDatacon 8800 CHAMEOkuti mugwiritse ntchito bwino ma phukusi.

Bonder Yotsimikizika ya High-Speed ​​​​Die ya Mapaketi a High-Volume Semiconductor

BESI ESEC 2100 hS ndi imodzi mwa ma bond othamanga kwambiri omwe amagwiritsidwa ntchito kwambiri m'malo opangira ma semiconductor padziko lonse lapansi. Yopangidwa kuti igwiritsidwe ntchito bwino kwambiri, ikhale yokhazikika, komanso yotsika mtengo, ikadali nsanja yokondedwa ya OSATs, IDMs, ndi opanga ma semiconductor omwe amapanga ma phukusi mamiliyoni ambiri mwezi uliwonse.

Kuphatikiza liwiro lapadera, kudalirika kotsimikizika, komanso kuthekera kosinthasintha kwa ntchito, ESEC 2100 hS yakhala yankho loyezera kugwiritsa ntchito ma epoxy die attach applications pa zamagetsi zamagalimoto, ma semiconductor amphamvu, zida zamafakitale, zinthu zokumbukira, masensa, ndi zamagetsi zamagetsi.

Kaya mukukulitsa mphamvu zopanga, kusintha zida zakale, kapena kufunafuna chogwirira ntchito chokonzedwanso chotsika mtengo, ESEC 2100 hS ikadali imodzi mwa nsanja zodalirika kwambiri zopangira zomwe zilipo masiku ano.

Chifukwa Chiyani Sankhani ESEC 2100 hS?

Yatsimikiziridwa mu Kupanga Ma Semiconductor Padziko Lonse

ESEC 2100 hS yakhala ikugwiritsidwa ntchito bwino m'mafakitale osonkhanitsa zinthu za semiconductor padziko lonse lapansi kwa zaka zambiri. Kapangidwe kake ka nsanja yokhwima katsimikiziridwa kudzera mu maola mamiliyoni ambiri opangira, zomwe zimapangitsa kuti ikhale imodzi mwa ndalama zotetezeka kwambiri pantchito zopaka zinthu za semiconductor.

Kupambana Kwapadera

Popeza liwiro la kupanga limafika mpaka 18,500 UPH, ESEC 2100 hS imapereka zokolola zabwino kwambiri m'malo opangira zinthu zambiri.

Lingaliro lake latsopano la Phi-Y limachepetsa kwambiri nthawi yoyendera pakati pa ntchito zotola ndi malo, zomwe zimapangitsa kuti makina azigwiritsa ntchito bwino komanso kuti atuluke.

Mtengo Wabwino Kwambiri wa Eni ake

Kuchuluka kwa zinthu zomwe zimagwira ntchito, kusintha kwa zinthu mwachangu, kudalirika kwa nthawi yayitali, komanso njira zosinthira zinthu modular zimaphatikizana kuti zipereke imodzi mwa njira zotsika mtengo kwambiri zopangira zinthu pa unit iliyonse.

Zida Zosavuta Zosinthira ndi Chithandizo cha Uinjiniya

Chifukwa cha malo ake akuluakulu padziko lonse lapansi, zida zosinthira, zida zogwiritsira ntchito, makina owonera, mitu ya ma bond, ndi chithandizo chaukadaulo zikupezekabe mosavuta, zomwe zimathandiza opanga kuchepetsa nthawi yogwira ntchito ndikuwonjezera nthawi yogwiritsira ntchito zida.

Ntchito Zofananira

ESEC 2100 hS imathandizira mitundu yosiyanasiyana ya ma phukusi akuluakulu a semiconductor.

Zipangizo Zamagetsi Zopangira Mphamvu

• MOSFET

• IGBT

• Magawo Amagetsi

• Ma IC Oyang'anira Mphamvu

Zamagetsi Zagalimoto

• Magalimoto a MCU

• Dalaivala IC

• Masensa a Magalimoto

• Ma Module Olamulira Mphamvu

Consumer Electronics

• Zipangizo Zokumbukira

• Zigawo za RF

• Madalaivala a LED

• Ma IC Olumikizirana

Zamagetsi Zamakampani

• Zipangizo za Analogi

• Olamulira a Mafakitale

• Masensa Anzeru

• Magawo Amagetsi Amakampani

Kwa opanga omwe akupitilira njira zachikhalidwe zolumikizirana ndi die attach, mayankho athu a Flip Chip Bonder amapereka kuthekera kwapamwamba kolongedza ndi kuchuluka kwa kulumikizana kwa zinthu za semiconductor za m'badwo wotsatira.

Mizere yambiri ya semiconductor assembly imagwiritsanso ntchito makina a Wire Bonder pamodzi ndi zida zolumikizirana, zomwe zimapangitsa kuti kugwirizanitsa njira ndi kukhazikika kwa kupanga zikhale zofunika kwambiri posankha zida.

Monga gawo la BESI Die Bonder yathu yonse, ESEC 2100 hS ikadali imodzi mwa nsanja zodziwika bwino komanso zodalirika zopaka zinthu zambiri zomwe zilipo masiku ano.

Kuphatikiza Njira Yopangira Semiconductor

ESEC 2100 hS nthawi zambiri imagwiritsidwa ntchito ngati gawo la mzere wonse wa semiconductor assembly.chomangira chofewa, zipangizo nthawi zambiri zimapita ku njira zotsatizana zopakira monga kulumikiza waya, kuumbira, kuyimitsa, ndi kuyesa komaliza.

Pa ma CD achikhalidwe a semiconductor, opanga nthawi zambiri amaphatikiza ESEC 2100 hS ndi magwiridwe antchito apamwamba.Cholumikizira Wayamachitidwe opangira zinthu kuti apange mizere yokhazikika komanso yotsika mtengo yokhoza kuthana ndi zofunikira zazikulu zopangira zinthu.

Ukadaulo Wapakati

Lingaliro la Kuyenda kwa Phi-Y

ESEC 2100 hS imagwiritsa ntchito kapangidwe ka kayendedwe ka BESI ka Phi-Y.

Mosiyana ndi ma bond achikhalidwe omwe amadalira kuyenda kolunjika kokha, dongosolo la Phi-Y limaphatikiza kuyenda kozungulira ndi kolunjika kuti lichepetse kwambiri nthawi yoyenda yopanda ntchito ndikuwonjezera magwiridwe antchito opangira.

Kapangidwe Kopepuka & Kolimba Kosankha ndi Kuyika

Kapangidwe ka makinawa kopepuka koma kolimba kwambiri kamathandiza kuti makinawo akhale olimba kwambiri panthawi yogwira ntchito mwachangu.

Kapangidwe kameneka kamatsimikizira kuti malo ake amagwira ntchito bwino komanso kuti zinthu zikuyenda bwino kwambiri.

Chowongolera Choyenda Chapamwamba

Kuwongolera bwino njira yoyendetsera zinthu kumachepetsa kugwedezeka ndipo kumatsimikizira kuti malo osungira zinthu azikhala bwino ngakhale pa liwiro lalikulu.

Pulatifomu Yogwiritsira Ntchito Pansi Pansi Yokhazikika

Njira zosinthira zogwirira ntchito za substrate zimathandiza opanga kukonza makinawa kuti agwirizane ndi mitundu yosiyanasiyana ya maphukusi ndi zofunikira pakupanga.

Zofunika Kwambiri

Kuthamanga Kwambiri Kwambiri

• Mpaka 18,500 UPH

• Nthawi yozungulira ya 120 ms

• Yokonzedwa bwino kuti ipange zinthu zambiri

Kulondola Kwambiri kwa Malo

• Kulondola Kwanthawi Zonse: 20 μm @ 3 Sigma

• Njira Yolondola Kwambiri: 15 μm @ 3 Sigma

Kutha Kusintha kwa Njira

Imathandizira:

• Chogwirizira cha Epoxy Die

• Kugwirizana kwa Eutectic

• Kugwirizana kwa Thermocompression

• Reflow Soldering

Dongosolo Loona Mozama Kwambiri

Makina owonera omwe ali ndi mawonekedwe apamwamba amawongolera kulinganiza bwino kwa ma die ndi kulondola kwa malo ogwiritsira ntchito.

Gawo Logawa Zinthu Ziwiri

Ma axle awiri odziyimira pawokha amawonjezera mphamvu yogwiritsira ntchito pomwe akusungabe kusasinthasintha kwa njira.

Kuwunika Njira Pa Nthawi Yeniyeni

Ogwiritsa ntchito amatha kuyang'anira:

• Mkhalidwe wa chidebe chophikidwa

• Udindo wa Leadframe

• Mkhalidwe wa m'mphepete

• Udindo wa Hopper

• Magwiridwe antchito opanga

munthawi yeniyeni.

Mfundo Zaukadaulo

ESEC 2100 hS vs Datacon 8800 FC QUANTUM

Ubwino wa Opanga Ma Semiconductor

Wonjezerani Mphamvu Yopanga

Pezani zotsatira zabwino kwambiri popanda kuwononga kulondola kwa malo.

Chepetsani Ndalama Zopangira

Kuchepetsa mtengo wopangira pa unit iliyonse kudzera mu automation yothamanga kwambiri komanso kuwongolera bwino njira.

Kuwongolera Kugwiritsa Ntchito Zipangizo

Kusintha mwachangu ndi kasamalidwe ka maphikidwe kumawonjezera nthawi yogwira ntchito komanso kusinthasintha kwa kupanga.

Chepetsani Nthawi Yopuma

Kupezeka kwa zida zosinthira zambiri komanso kudalirika kwa nsanja kumachepetsa kusokonezeka kosayembekezereka.

Umboni Wamtsogolo Wokhudza Ndalama Zanu

Kapangidwe ka modular kamathandizira kukweza mtsogolo ndi kusintha kwa zofunikira pakupanga.

Zosankha za Zida Zomwe Zilipo

Timapereka:

• ESEC 2100 hS yokonzedwanso

• Machitidwe Okonzekera Kupanga Oyesedwa Bwino

• Chithandizo Chokhazikitsa Makina

• Thandizo Lokonza Njira

• Kupereka Zigawo

• Ntchito Zosamalira Zopewera

• Mayankho Otumizira Padziko Lonse

• Thandizo la Maphunziro a Ukadaulo

Machitidwe onse amayesedwa mokwanira, kuyesedwa, ndi kutsimikiziridwa kwa magwiridwe antchito asanatumizidwe.

Kukula kwa Mapaketi Amtsogolo

Ngakhale kuti ESEC 2100 hS idapangidwira makamaka njira zolumikizirana ndi epoxy die, opanga ambiri pamapeto pake amakula ndikugwiritsa ntchito ukadaulo wapamwamba wopaka womwe umafunikira kuchuluka kwa kulumikizana komanso mapazi ang'onoang'ono a phukusi.

Pa ntchito izi, zoperekedwaFlip Chip BonderMapulatifomu amapereka mphamvu zoyika zinthu zooneka ngati zakufa zomwe zingagwiritsidwe ntchito popangira zinthu za semiconductor zapamwamba, kuphatikiza kosiyanasiyana, komanso zinthu zamagetsi za m'badwo wotsatira.