BESI ESEC 2100 hS BESI Gupfa Bonder

Igice cy'umuryango wa BESI Die Bonder

ESEC 2100 hS ni iy'ikigo gikomeye mu ngandaBESI The Bonderibicuruzwa byayo, ubwoko butandukanye bw'ibikoresho bya semiconductor bizwi ku isi yose kubera kwizerwa kwabyo, umusaruro wabyo, no kudahungabana kw'umusaruro mu gihe kirekire.

Izindi nzira zizwi cyane zo guhuza imiyoboro ya BESI zirimoDatacon 8800 FC QUANTUMguteranya chip yihuta cyane hamwe naDatacon 8800 CHAMEOku bijyanye no gupakira ibintu mu buryo bugezweho.

Ifite ubushobozi bwo gupakira ibikoresho bya semiconductor byihuta cyane (High-Volume)

BESI ESEC 2100 hS ni imwe mu mashini zikora imiyoboro yihuta cyane zikoreshwa cyane mu gupakira ibikoresho bya semiconductor ku isi yose. Yagenewe gutanga umusaruro mwinshi, gukora neza no gutunga ibintu ku giciro gito, ikomeje kuba urubuga rukunzwe cyane n’inganda za OSAT, IDM, n’inganda zikora ibikoresho bya semiconductor zikora amapaki abarirwa muri za miriyoni buri kwezi.

Hamwe n'umuvuduko udasanzwe, ukwizerwa gukomeye, n'ubushobozi bwo gukora ibintu mu buryo bworoshye, ESEC 2100 hS yabaye igisubizo cy'icyitegererezo ku bikoresho bya epoxy die attach mu bikoresho by'ikoranabuhanga by'imodoka, semiconductors z'amashanyarazi, ibikoresho by'inganda, ibikoresho byo kwibuka, sensors, n'ibikoresho by'ikoranabuhanga bikoreshwa n'abaguzi.

Waba wongera ubushobozi bwo gukora, usimbuza ibikoresho bya kera, cyangwa ushaka icyuma gishya cyavuguruwe kandi gihendutse, ESEC 2100 hS iracyari imwe mu mbuga zikora zizewe cyane ziboneka muri iki gihe.

Kuki wahitamo ESEC 2100 hS?

Byagaragaye mu gukora ibikoresho bya semiconductors ku isi yose

ESEC 2100 hS imaze imyaka myinshi ikoreshwa mu nganda zikora ibikoresho bya semiconductor hirya no hino ku isi. Imiterere yayo ya platforme imaze igihe kinini yemejwe binyuze mu masaha abarirwa muri za miriyoni yo gukora, bituma iba imwe mu shoramari ryizewe cyane mu bikorwa byo gupakira ibikoresho bya semiconductor.

Uburyo budasanzwe bwo gukoresha

Kubera ko umuvuduko w'umusaruro ugera kuri 18.500 UPH, ESEC 2100 hS itanga umusaruro udasanzwe ku nganda zikora ibikoresho byinshi.

Igitekerezo cyayo gishya cyo kugenda cya Phi-Y kigabanya cyane igihe cyo kugenda hagati y’ibikorwa byo gutora no gushyira ahantu, bigatuma imashini zikoresha neza kandi zigatanga umusaruro mwinshi.

Igiciro cyiza cyane cyo gutunga

Gutanga umusaruro mwinshi, guhindura ibicuruzwa byihuse, kwizerwa mu gihe kirekire, hamwe n'uburyo bwo kuvugurura modular bihuriza hamwe mu gutanga kimwe mu bisubizo byo gukora bihendutse cyane mu nganda ku giciro gito kuri buri kimwe.

Ibikoresho byoroshye byo gusimbura n'ubufasha mu by'ubuhanga

Kubera ko ifite ahantu hanini ku isi hose, ibikoresho bisimbura ibindi, ibikoresho byo gukoresha, sisitemu zo kureba, imitwe y'ibikoresho, n'ubufasha bwa tekiniki biracyaboneka byoroshye, bifasha abakora ibikoresho kugabanya igihe cyo gukora no kongera igihe cyo kumara ibikoresho.

Ibisanzwe

ESEC 2100 hS ishyigikira uburyo bwinshi bwo gupakira ibikoresho bya semiconductor.

Ibikoresho bya Semiconductor by'Ingufu

• MOSFET

• IGBT

• Module z'amashanyarazi

• Imicungire y'amashanyarazi (ICs)

Ibikoresho bya elegitoroniki

• Imodoka ya MCU

• Umushoferi wa IC

• Ibikoresho byo Gupima Ibinyabiziga

• Moduli zo Kugenzura Ingufu

Ibikoresho bya elegitoroniki

• Ibikoresho byo kwibuka

• Ibice bya RF

• Abashoferi ba LED

• Ibyuma by'itumanaho

Ikoranabuhanga mu nganda

• Ibikoresho bya Analogi

• Abagenzuzi b'inganda

• Ibikoresho by'ubwenge

• Ingufu z'inganda

Ku bakora ibicuruzwa birenga inzira zisanzwe zo gufunga, ibisubizo byacu bya Flip Chip Bonder bitanga ubushobozi bwo gupakira buhanitse kandi bitanga ubucucike bwinshi bwo guhuza ibikoresho bya semiconductor byo mu gisekuru gitaha.

Imiyoboro myinshi y’ibikoresho bya semiconductor ikora kandi sisitemu za Wire Bonder hamwe n’ibikoresho bya die bonding, bigatuma imikorere ihura neza kandi ikagumana umusaruro ari ibintu by’ingenzi mu guhitamo ibikoresho.

Nk'igice cy'urutonde rwacu rwa BESI Die Bonder, ESEC 2100 hS iracyari imwe mu mbuga zikoreshwa cyane kandi zizewe zo gupakira ibintu byinshi ziboneka muri iki gihe.

Guhuza inzira zo guteranya ibikoresho bya semiconductor

ESEC 2100 hS ikunze gukoreshwa nk'igice cy'umurongo wuzuye w'ibikoresho bya semiconductor.agakoresho gafataho, ibikoresho bikunze kwimukira mu bikorwa byo gupakira bikurikiraho nko gufata insinga, kuziba, kuzipima, no kuzipima bwa nyuma.

Ku bijyanye no gupakira ibikoresho bisanzwe bya semiconductor, abakora bakunze guhuza ESEC 2100 hS n'imikorere myiza cyane.Insinga zo gufungasisitemu zo gukora imirongo ihamye kandi ihendutse y’umusaruro ishobora gukemura ibibazo by’inganda nini.

Ikoranabuhanga ry'ibanze

Igitekerezo cy'Ingendo ya Phi-Y

ESEC 2100 hS ikoresha imiterere yihariye ya BESI yo kugenda ya Phi-Y.

Bitandukanye n'imigozi isanzwe ishingiye ku migendekere ya 'linear' gusa, sisitemu ya Phi-Y ihuza imigendekere izunguruka n'iy'umurongo kugira ngo igabanye cyane igihe cyo gukora ingendo zidakora kandi irusheho kunoza umusaruro.

Imiterere yoroheje kandi ikomeye yo gutoranya no gushyira ahantu

Imiterere yoroheje ariko ikomeye cyane y’iyi mashini ituma habaho gutuza gukomeye mu gihe ikora ku muvuduko mwinshi.

Iyi miterere igenzura imikorere myiza mu gushyiramo ibintu mu buryo bunoze, ariko igakomeza gutanga umusaruro mwinshi.

Igenzura ry'Ingendo Rigezweho

Uburyo bwo kunoza uburyo bwo kugenda bugabanya guhindagura no gutuma icyuma gishyirwa neza ndetse no ku muvuduko wo gukora cyane.

Urubuga rw'ibikoresho byo gufata ibintu bito bito (Modular Substrate Handler Platform)

Uburyo bworoshye bwo gucunga substrate butuma abakora porogaramu bashobora gushyiraho sisitemu ijyanye n'ubwoko butandukanye bw'ibipaki n'ibisabwa mu gukora.

Ibintu by'ingenzi

Umuvuduko wo hejuru cyane

• Kugeza kuri 18,500 UPH

• Igihe cy'urugendo rwa 120 ms

• Yakozwe neza kugira ngo ikoreshwe mu buryo bwinshi

Ubuziranenge bwo gushyira ibintu mu mwanya wabyo

• Ubuziranenge busanzwe: 20 μm @ 3 Sigma

• Uburyo bwo Gukoresha Uburinganire Buhanitse: 15 μm @ 3 Sigma

Ubushobozi bwo Gutunganya Ibintu Byoroshye

Ibishyigikira:

• Epoxy Die Attach

• Guhuza abantu mu buryo bw'umubiri

• Guhuza Ubushyuhe n'Ubushyuhe

• Kugaragaza Kugurisha

Sisitemu yo Kureba Ifite Ubushobozi Bunini

Uburyo bwo kureba bufite ubushobozi bwo hejuru butuma habaho guhuza neza ibyuma no gushyira neza imiterere yabyo mu buryo busaba imbaraga nyinshi.

Uburyo bwo gutanga ibikoresho bibiri

Imirongo ibiri yigenga yo gutanga umusaruro yongera umusaruro mu gihe ikomeza gukora neza.

Gukurikirana Imikorere mu Gihe Nyacyo

Abakoresha bashobora gukurikirana:

• Imiterere y'umugati

• Imiterere y'umurongo uyobora

• Imiterere y'umurongo

• Imiterere ya Hopper

• Imikorere y'umusaruro

mu gihe nyacyo.

Ibisobanuro bya tekiniki

ESEC 2100 hS vs Datacon 8800 FC QUANTUM

Ibyiza ku bakora ibikoresho bya semiconductor

Ongera ubushobozi bwo gukora

Kugera ku musaruro mwinshi cyane utitaye ku buryo buboneye bwo gushyira ibintu mu mwanya wabyo.

Gabanya ikiguzi cyo gukora

Kugabanya ikiguzi cyo gukora kuri buri gikoresho binyuze mu buryo bwihuta bwo gukora no kugenzura neza ibikorwa.

Kunoza Imikoreshereze y'Ibikoresho

Guhinduranya vuba no gucunga uburyo bwo guteka byongerera igihe cyo gukora no koroshya umusaruro.

Gabanya igihe cyo kuruhuka

Kuboneka cyane kw'ibice by'inyongera no kuba urubuga rwemewe bigabanya ibibazo bitunguranye.

Ishoramari ryawe rigaragaza ibihe bizaza

Imiterere ya modular ishyigikira kuvugurura mu gihe kizaza no guhindura ibisabwa mu musaruro.

Amahitamo y'ibikoresho biboneka

Turatanga:

• ESEC 2100 hS yavuguruwe

• Sisitemu ziteguye gukora zigeragejwe neza

• Inkunga yo Gushyiramo Imashini

• Ubufasha mu kunoza imikorere

• Ibikoresho byo gutanga

• Serivisi zo kubungabunga ibidukikije

• Ibisubizo by'Ubucuruzi Mpuzamahanga

• Inkunga y'amahugurwa ya tekiniki

Sisitemu zose zigenzurwa neza, zigapimwa, kandi zigasuzumwa imikorere mbere yo koherezwa.

Kwagura Ibikoresho mu Gihe Gitaha

Nubwo ESEC 2100 hS yagenewe ahanini uburyo bwo guhuza epoxy die attach, abakora benshi amaherezo bakura mu ikoranabuhanga rigezweho ryo gupakira risaba ubucucike bwinshi bw’imiyoboro y’amashanyarazi n’aho bashyiramo ibintu bito.

Kuri izi porogaramu, byageneweFlip Chip Bonderplatforme zitanga ubushobozi bwo gushyiramo ibikoresho bya elegitoroniki mu buryo bugaragara, bukwiriye gukoreshwa mu gupakira ibikoresho bya semiconductor bigezweho, guhuza ibintu bitandukanye, ndetse no mu bikoresho by'ikoranabuhanga byo mu gisekuru gitaha.