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Module y'ibanze yo gutoranya no gushyiramo ibikoresho by'ibanze by'imashini itunganya utuntu (sorter) ni yo ishinzwe kohereza chips
Inshingano nyamukuru y'ikarita yo kugenzura ni ukwakira amabwiriza aturutse kuri mudasobwa ikora, gutegura ingendo z'imirongo myinshi (nk'imirongo ya XYZ y'umutuku n'umunwa), no gutanga ibimenyetso byo gukurura neza...
Fata neza kandi witonze utwo dupira, utwimurire aho bapimira, hanyuma utworosore hanyuma utworosore ukurikije ibisubizo by'ikizamini.
BESI die bonds iherereye ku isoko mpuzamahanga ryo hagati kugeza ku rwego rwo hejuru, kandi hamwe n'ikoranabuhanga ryayo rikomeye rya flip-chip na hybrid bonding, ifite umwanya ukomeye mu bijyanye n'ubujyanama bugezweho...
BESI die bonds iherereye ku isoko mpuzamahanga ryo hagati n'irihanitse, kandi ibicuruzwa byayo bikoreshwa cyane mu bikoresho bya AI na mudasobwa zikora neza, ari nabyo bituma iterambere ryabo ryihuse...
DISCO ni yo iyoboye ku isoko ry’imashini zitunganya imashini za semiconductor ku isi, ifite ikoranabuhanga ryo gukata, gusya no gusiga irangi. Ibikoresho byayo bishobora gutunganya ibikoresho bitandukanye hamwe na ...
DISCO ni ikigo gikomeye ku isi mu gukora imashini zigabanya uduce, cyihariye mu ikoranabuhanga ryo gukata, gusya no gusiga irangi. Uburyo bwayo bwo gukata bukoresha imigozi ibiri na laser bushyigikira ubuziranenge n'imikorere myiza...
Igice cyo gushyushya cya K&S wire bonder—kizwi kandi ku izina rya heating block—gishyirwa munsi y'icyuma gifunga.
DISCO ni ikigo gikomeye ku isi mu gukora imashini zo gukata wafer zifite isoko riri hejuru. Ibikoresho byacyo bifite ubuhanga bwo gukora neza cyane, bishyigikira gutunganya wafer nto cyane, kandi bikoresha uburyo bwihariye nka...
Ikibaho cy’ikimenyetso cya K&S ni module y’ikibaho cy’amashanyarazi kiri mu cyuma gihuza insinga; akazi kacyo ni ugutanga ibimenyetso hagati y’ikibaho cy’ubugenzuzi n’ibice bikora (nk’ibinyabiziga, umurongo ...
Imashini zo gukata DISCO zirangwa no gukoresha uburyo bwo gusya neza cyane no gusya buhoro. Uburyo bwazo bwihariye bwa TAIKO bushobora gukomeza impande za wafer kandi bukoreshwa cyane mu bubiko, ibikoresho by'amashanyarazi no mu bikoresho bigezweho...
Agakoresho ko gufunga k'icyuma gifunga insinga cya K&S ni igice cy'ingenzi cy'uburyo bwo gufunga insinga, gishyizwe ku mutwe w'icyuma gifunga cyangwa urubuga rwo gufunga.
Igikoresho cyo gufatamo imigozi cya K&S ni ikintu gishobora gukoreshwa mu buryo bwo gukoraho gishyirwa ku mpera y'ukuboko, kigakoranaho neza n'ubuso bw'icyuma gifataho icyuma cyangwa substrate.
Insinga z'umuringa zo mu bwoko bwa K&S zifite imitwe ibiri ni zo zikoreshwa mu guhuza insinga z'umuringa; zifite imiterere y'insinga ebyiri ishyigikira impinduka zihuse z'insinga cyangwa icyarimwe...
Igikoresho cyo kugaburira inkongoro kimeze nk'icyuma gishyushya ni module y'ingenzi yo kugaburira ibikoresho mu gupakira no gupima ibikoresho bya semiconductor.
Igikoresho cyo kongerera imbaraga inkongoro kigenewe abatunganya ibintu ni module y'ingenzi yo kongerera ibikoresho mu gupakira no gupima ibikoresho bya semiconductor, yagenewe by'umwihariko abatunganya ibintu bihuta cyane.
Igikoresho cyo kongerera ubushobozi bwa IC ni module y'ingenzi yo kongerera ubushobozi bwa semiconductor test.
Ni module yo kugenzura imikorere y’imashini ikoreshwa mu gupima imiterere y’imashini.
Igikoresho cyo kongerera ubushobozi urumuri cya LED ni igikoresho cyo kongerera ubushobozi urumuri cyagenewe cyane cyane amatara ya LED n'ibice bya SMD.
Module y'ibanze yo gutoranya no gushyiramo ibikoresho by'ibanze by'imashini itunganya utuntu (sorter) ni yo ishinzwe kohereza chips
Inshingano nyamukuru y'ikarita yo kugenzura ni ukwakira amabwiriza aturutse kuri mudasobwa ikora, gutegura ingendo z'imirongo myinshi (nk'imirongo ya XYZ y'umutuku n'umunwa), no gutanga ibimenyetso byo kuyobora neza imikorere y'imashini.
Fata neza kandi witonze utwo dupira, utwimurire aho bapimira, hanyuma utworosore hanyuma utworosore ukurikije ibisubizo by'ikizamini.
BESI die bonds iherereye ku isoko mpuzamahanga ryo hagati kugeza ku rwego rwo hejuru, kandi hamwe n'ikoranabuhanga ryayo rikomeye rya flip-chip na hybrid bonding, ifite umwanya ukomeye mu bijyanye no gupakira neza cyane.
BESI die bonds iherereye ku isoko mpuzamahanga ry’ikoranabuhanga riciriritse kugeza ku rwego rwo hejuru, kandi ibicuruzwa byayo bikoreshwa cyane mu bikoresho bya AI na mudasobwa zikora neza, ari nabyo bituma iterambere ryayo ryihuta.
Byose Kuva: Kinini.
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Ikirango cyacu kigenda gikwirakwira mu mujyi, kandi abantu batabarika barambajije bati: "GeekValue ni iki?" Bituruka ku cyerekezo cyoroshye: guha imbaraga udushya twabashinwa hamwe nikoranabuhanga rigezweho. Uyu ni umwuka wikimenyetso cyo gukomeza gutera imbere, byihishe mugukomeza gushakisha amakuru arambuye kandi tunezezwa no kurenza ibyateganijwe hamwe nibitangwa. Ubu bukorikori hafi yubwitange nubwitange ntabwo ari ugukomeza kwadushinze gusa, ahubwo ni ishingiro nubushyuhe bwikirango cyacu. Turizera ko uzatangirira hano ukaduha amahirwe yo gukora gutungana. Reka dufatanye gukora igitangaza gikurikira "zero inenge".
BirambuyeMenyesha inzobere mu kugurisha
Shikira itsinda ryacu ryo kugurisha kugirango ushakishe ibisubizo byabigenewe bihuye neza nubucuruzi bwawe kandi ukemure ibibazo byose waba ufite.
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