BESI ESEC 2100 hS BESI Die Bonder

Part of the BESI Die Bonder Family

The ESEC 2100 hS belongs to the industry-leading BESI Die Bonder product portfolio, a range of semiconductor die attach platforms recognized worldwide for their reliability, throughput, and long-term production stability.

Other popular BESI die bonding solutions include the Datacon 8800 FC QUANTUM for high-speed flip chip assembly and the Datacon 8800 CHAMEO for advanced packaging applications.

Proven High-Speed Die Bonder for High-Volume Semiconductor Packaging

The BESI ESEC 2100 hS is one of the most widely deployed high-speed die bonders in semiconductor packaging facilities worldwide. Designed for maximum throughput, stable operation, and low cost of ownership, it remains a preferred platform for OSATs, IDMs, and semiconductor manufacturers producing millions of packages every month.

Combining exceptional speed, proven reliability, and flexible process capability, the ESEC 2100 hS has become a benchmark solution for epoxy die attach applications across automotive electronics, power semiconductors, industrial devices, memory products, sensors, and consumer electronics.

Whether you are expanding production capacity, replacing legacy equipment, or seeking a cost-effective refurbished die bonder, the ESEC 2100 hS remains one of the most trusted production platforms available today.

Why Choose the ESEC 2100 hS?

Proven in Semiconductor Manufacturing Worldwide

The ESEC 2100 hS has been successfully deployed in semiconductor assembly plants around the world for years. Its mature platform design has been validated through millions of production hours, making it one of the safest investments for semiconductor packaging operations.

Exceptional Throughput

With production speeds reaching up to 18,500 UPH, the ESEC 2100 hS delivers outstanding productivity for high-volume manufacturing environments.

Its innovative Phi-Y motion concept significantly reduces travel time between pick and place operations, maximizing machine utilization and output.

Excellent Cost of Ownership

High throughput, rapid product changeover, long-term reliability, and modular upgrade options combine to deliver one of the industry's lowest cost-per-unit production solutions.

Easy Spare Parts and Engineering Support

Because of its large installed base worldwide, spare parts, tooling, vision systems, bond heads, and technical support remain readily available, helping manufacturers minimize downtime and extend equipment life.

Typical Applications

The ESEC 2100 hS supports a wide range of mainstream semiconductor packaging applications.

Power Semiconductor Devices

• MOSFET

• IGBT

• Power Modules

• Power Management ICs

Automotive Electronics

• Automotive MCU

• Driver IC

• Automotive Sensors

• Power Control Modules

Consumer Electronics

• Memory Devices

• RF Components

• LED Drivers

• Communication ICs

Industrial Electronics

• Analog Devices

• Industrial Controllers

• Smart Sensors

• Industrial Power Modules

For manufacturers expanding beyond conventional die attach processes, our Flip Chip Bonder solutions provide advanced packaging capability and higher interconnect density for next-generation semiconductor products.

Many semiconductor assembly lines also operate Wire Bonder systems alongside die bonding equipment, making process compatibility and production stability critical factors when selecting equipment.

As part of our complete BESI Die Bonder portfolio, the ESEC 2100 hS remains one of the most proven and reliable high-volume packaging platforms available today.

Semiconductor Assembly Process Integration

The ESEC 2100 hS is commonly deployed as part of a complete semiconductor assembly line. After die attach, devices typically move to subsequent packaging processes such as wire bonding, molding, singulation, and final testing.

For traditional semiconductor packaging, manufacturers often combine the ESEC 2100 hS with high-performance Wire Bonder systems to create stable and cost-effective production lines capable of handling large-volume manufacturing requirements.

Core Technology

Phi-Y Motion Concept

The ESEC 2100 hS utilizes BESI's proprietary Phi-Y motion architecture.

Unlike traditional die bonders relying purely on linear movement, the Phi-Y system combines rotational and linear motion to significantly reduce idle travel time and improve production efficiency.

Light & Rigid Pick-and-Place Structure

The machine's lightweight yet highly rigid pick-and-place structure enables exceptional dynamic stability during high-speed operation.

This design ensures precise placement performance while maintaining maximum throughput.

Advanced Motion Controller

Enhanced motion trajectory optimization minimizes vibration and ensures smooth die placement even at peak operating speeds.

Modular Substrate Handler Platform

Flexible substrate handling options allow manufacturers to configure the system for various package types and production requirements.

Key Features

Ultra-High Throughput

• Up to 18,500 UPH

• 120 ms cycle time

• Optimized for high-volume production

High Placement Accuracy

• Standard Accuracy: 20 μm @ 3 Sigma

• High Accuracy Mode: 15 μm @ 3 Sigma

Flexible Process Capability

Supports:

• Epoxy Die Attach

• Eutectic Bonding

• Thermocompression Bonding

• Reflow Soldering

High-Resolution Vision System

Optional high-resolution vision systems improve die alignment and placement accuracy for demanding applications.

Dual Dispensing Module

Dual independent dispensing axes increase throughput while maintaining process consistency.

Real-Time Process Monitoring

Operators can monitor:

• Wafer status

• Leadframe status

• Strip status

• Hopper status

• Production performance

in real time.

Technical Specifications

ESEC 2100 hS vs Datacon 8800 FC QUANTUM

Benefits for Semiconductor Manufacturers

Increase Production Capacity

Achieve significantly higher output without sacrificing placement accuracy.

Reduce Manufacturing Costs

Lower production cost per unit through high-speed automation and efficient process control.

Improve Equipment Utilization

Fast changeover and recipe management maximize uptime and production flexibility.

Minimize Downtime

Extensive spare parts availability and proven platform reliability reduce unexpected interruptions.

Future-Proof Your Investment

Modular architecture supports future upgrades and changing production requirements.

Available Equipment Options

We provide:

• Refurbished ESEC 2100 hS

• Fully Tested Production-Ready Systems

• Machine Installation Support

• Process Optimization Assistance

• Spare Parts Supply

• Preventive Maintenance Services

• Global Shipping Solutions

• Technical Training Support

All systems undergo complete inspection, calibration, and performance verification before shipment.

Future Packaging Expansion

While the ESEC 2100 hS is primarily designed for epoxy die attach processes, many manufacturers eventually expand into advanced packaging technologies requiring higher interconnect density and smaller package footprints.

For these applications, dedicated Flip Chip Bonder platforms provide face-down die placement capabilities suitable for advanced semiconductor packaging, heterogeneous integration, and next-generation electronic products.