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Get Quote →Source high-quality new, used and refurbished die bonder and die bonding equipment for semiconductor packaging, assembly, substrate bonding and chip manufacturing. We provide fully tested and calibrated die bonders with stable precision, high efficiency and reliable performance for semiconductor production lines worldwide.
Explore our selection of commonly requested Die Bonder machines, ideal for high-precision chip attachment, SMT line setup, capacity expansion, and cost-efficient production upgrades. Unsure which model suits your process? Share your production requirements and our experts will recommend the best-fit option.
The ESEC 2100 hS die bonder is a renowned high-speed die bonder platform from BESI.
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BESI Datacon 2200EVO is a fully automatic, ultra-high precision, multi-function chip placement system used in the semico...
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ASM die bonder AD819 is an advanced semiconductor packaging equipment used to accurately place chips on substrates and i...
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ASM AD800 is a high performance fully automatic die bonder with many advanced functions and features
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The working principle of the ASM die bonder AD50Pro mainly includes heating, rolling, control system and auxiliary equip...
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AD420XL provides high-speed, high-precision pick and place Mini LED COB solutions for large-size LCD BLUs (for local dim...
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ASMPT's SD8312 fully automatic soft solder die bonder system is an advanced device designed for 12-inch wafer proce...
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The specifications and dimensions of the ASMPT fully automatic die bonding system are as follows:Dimensions: W x D x H 1...
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The AD838l plus fully automatic disk bonding and flip chip system is a high-precision and high-efficiency die bonding e...
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Features● New generation high-capacity AD8312 series die bonders set new standards for the industry● Universal worktable...
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Features●Accuracy ± 3 µm @ 3s●Glue dispensing/jetting for die bonding●Material source traceability for enhanced quality ...
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Features●Accuracy ± 12.5 µm @ 3s●Can directly process ceramic substrates●Masterful process and module design●Independent...
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MRSI Systems Die Bonder is a product of the Mycronic Group, which focuses on providing fully automatic, high-precision...
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Besi Datacon 8800 is an advanced chip bonding machine, mainly used for 2.5D and 3D packaging technology, especially TSV ...
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ASMPT's AD838 series is a high-speed, high-precision die bonder that is widely recognized in the market.
Check Stock & QuoteA die bonder is a precision semiconductor packaging machine used to pick, align and attach semiconductor dies onto substrates, lead frames, ceramic carriers, packages or other electronic assemblies.
It is one of the key machines in semiconductor packaging, LED packaging, IC assembly and advanced electronics manufacturing. For many factories, choosing the right die bonder directly affects bonding accuracy, yield, production capacity and long-term manufacturing cost.
Modern die bonder machines are designed to achieve high-precision semiconductor die placement, stable bonding performance and consistent production quality across semiconductor packaging and electronics manufacturing applications.
High-precision die placement directly affects package quality, yield rate and production consistency.
Advanced optical alignment systems help achieve precise die positioning and bonding repeatability.
Stable bonding pressure is critical for reliable die attach and long-term device performance.
Different bonding technologies support various semiconductor packaging requirements and applications.
Accurate heating and thermal control improve bonding quality and reduce process variation.
Output speed and production efficiency are important factors in high-volume manufacturing.
Die bonders are used wherever a semiconductor die, chip or microelectronic component needs to be placed accurately and bonded reliably.
For IC assembly, die attach and package-level production.
For LED chip bonding, LED packaging and optoelectronic products.
For power semiconductor modules, automotive electronics and energy devices.
For sensors, micro-devices and precision electronic components.
For optical modules, laser devices and high-reliability components.
For RF modules, hybrid circuits and high-value electronics assembly.
Although different semiconductor packaging applications may use different processes, most die bonding workflows follow several core production stages.
Semiconductor dies are prepared and loaded into the die bonder system.
The bonding head accurately picks up the semiconductor die.
Optical systems align the die and substrate for precise placement.
Epoxy dispensing or eutectic heating prepares the bonding surface.
The die is placed onto the substrate or package with controlled accuracy.
Bonding quality and placement consistency are checked before production continues.
Suitable for high-volume semiconductor and LED production.
Flexible option for medium-volume or specialized production needs.
Used for R&D, sample production and low-volume precision assembly.
Used for advanced packaging and high-density interconnect applications.
For applications requiring high thermal and electrical performance.
Common for LED, IC and general semiconductor packaging processes.
Die bonding and wire bonding are both important semiconductor packaging processes, but they perform different functions during production.
As a professional equipment supplier, GEEKVALUE helps customers find the most suitable die bonder according to budget, production target, delivery time and technical requirements.
For new production lines, long-term capacity planning and high-reliability manufacturing projects.
For factories that need tested equipment, faster delivery and lower investment cost.
For replacement, trial production, budget-controlled projects and urgent equipment demand.
Before buying a die bonder, customers should compare the machine based on real production needs, not only the brand or price.
Check placement accuracy, repeatability and process stability.
Confirm die size range, substrate type and package compatibility.
Choose automatic, semi-automatic or manual equipment based on output.
Compare epoxy, eutectic, flip chip or other die attach processes.
New, used and refurbished equipment provide different cost advantages.
Spare parts, inspection, calibration and after-sales support are critical.
GEEKVALUE helps customers reduce equipment risk by checking machine condition, motion systems, bonding performance and core operational status before shipment.
Check external condition, structure integrity and machine cleanliness.
Verify machine startup, system response and operational stability.
Inspect axis movement, positioning accuracy and mechanical condition.
Check camera systems, optical alignment and image functionality.
Evaluate bonding head operation, force control and production capability.
Support secure packaging and worldwide semiconductor equipment delivery.
Customers choose GEEKVALUE because we help them solve real purchasing problems: equipment availability, cost control, technical risk, delivery speed and long-term operation support.
Share your production process, bonding requirement and budget range.
We help match model, condition, brand and technical specifications.
We confirm machine availability, condition, delivery time and quotation.
Equipment inspection, export packing, logistics and technical support are arranged.
A die bonder is a semiconductor packaging machine used to pick, place and bond dies onto substrates, lead frames, packages or carriers.
We supply epoxy die bonders, eutectic die bonders, flip chip bonders, automatic die bonders and refurbished die bonding equipment for semiconductor production.
Yes, we offer fully inspected, tested and calibrated refurbished die bonders with stable performance and cost-effective solutions for packaging lines.
Die bonding attaches the semiconductor die to a package or substrate, while wire bonding connects the die electrically using fine metal wires.
Yes. Refurbished die bonders are suitable for many production needs when the machine is inspected, tested and supported with parts and service.
Die bonders are widely used in semiconductor packaging, IC assembly, optoelectronics, automotive chips, consumer electronics and medical device manufacturing.
Yes, we provide safe export packing, professional logistics and worldwide delivery for all die bonder and die bonding equipment.
We offer on-site installation, machine calibration, operator training and long-term after-sales technical support for die bonding equipment.
You should compare bonding accuracy, die size, substrate type, bonding method, production volume, budget, delivery time and after-sales support.
You can contact our sales team via WhatsApp, online form or email to check real-time stock, availability and latest pricing for die bonders.
Why do so many people choose to work with GeekValue?
Our brand is spreading from city to city, and countless people have asked me, "What is GeekValue?" It stems from a simple vision: to empower Chinese innovation with cutting-edge technology. This is a brand spirit of continuous improvement, hidden in our relentless pursuit of detail and the delight of exceeding expectations with every delivery. This almost obsessive craftsmanship and dedication is not only the persistence of our founders, but also the essence and warmth of our brand. We hope you will start here and give us an opportunity to create perfection. Let us work together to create the next "zero defect" miracle.
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