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Detailed introduction:
Fully automatic die bonding and flip chip system
■Unique carrier-type material handling capability, especially suitable for 8'' fragile and scratch-prone substrates
■Zhuanli process technology, +25μm/+15um_upward accuracy can still maintain high hourly production capacity of 12K/H.
■Automatic material handling capability (optional)
■Automatic wafer loading and unloading system (optional)
■Automatic switching nozzles 4 (optional)
■FC flip chip processing capability (optional)
■Spray glue disc for pre-spraying (optional)
■1 barcode reader (optional), online (optional)
■Support reverse feeding to handle mixed core packaging products
■Linear motor driven XY double glue system, used for various silver pastes, conductive or non-conductive glues
■Rotary nozzle welding arm system replaces the rotating wafer table correction chip
