Used ASM AD830 Plus Die Bonder for Sale & Support

The used ASM AD830 Plus die bonder is a fully automatic high-speed die attach system designed to pick semiconductor dies from a wafer and bond them onto lead frames using a silver-epoxy process. The machine combines lead-frame transportation, wafer positioning, die recognition, epoxy application, die pickup, placement and optical inspection in one automated production platform.

This model may also appear in customer inquiries and equipment records as the ASM AD 830 PLUS, AD830PLUS, AD 830 Plus die bonder or ASM Pacific Technology AD830 Plus. Before purchasing a machine, the exact model, serial number, installed modules and tooling should be confirmed from the machine nameplate and physical configuration.

We support customers looking for an ASM AD830 Plus for production replacement, capacity expansion, spare-machine preparation or second-hand semiconductor equipment projects. Available units may differ in manufacturing year, software, epoxy module, wafer loader, lead-frame input system, tooling and overall condition.

ASM AD830 Plus Availability Overview

All specifications, options and included accessories must be checked against the actual machine before order confirmation. Used machines with the same model name may have different production configurations.

Why Manufacturers Source a Used ASM AD830 Plus

A used ASM AD830 Plus may be considered when a production facility already operates the same machine platform, needs additional die bonding capacity or wants to replace an unavailable machine without redesigning the complete process.

Using the same machine family can simplify several production requirements:

• Existing package files may be easier to transfer or recreate

• Operators may already understand the machine interface

• Existing collets, ejector tools and anvils may remain useful

• Maintenance teams may already stock compatible components

• Process-development time may be shorter than changing to a different platform

• Production lines may retain similar material-handling arrangements

However, the machine should not be selected only because the model name matches an existing unit. Differences in wafer loader, epoxy module, lead-frame input, software, optics and tooling can affect compatibility with the intended product.

How the AD830 Plus Production Cycle Works

The AD830 Plus is designed to receive lead frames, apply silver epoxy, pick dies from a wafer and place the dies onto programmed bonding positions.

Lead-Frame Loading

Unprocessed lead frames enter the system through a magazine input elevator or stack-loading arrangement, depending on the installed equipment configuration. The machine transfers each lead frame onto the work-holder track.

Lead-Frame Positioning

The work holder moves the lead frame through the machine. Position sensors and pattern-recognition functions help align the lead frame with the epoxy and bonding stations.

Silver-Epoxy Application

The bonding material is applied before die placement. Depending on the machine configuration, the AD830 Plus may use a dispensing needle or stamping tool to deposit silver epoxy onto the lead frame.

Wafer Positioning and Die Search

The wafer table moves the selected die to the pickup area. The wafer PR system identifies the die position and calculates the required alignment correction.

Die Pickup

An ejector pin rises beneath the die to separate it from the wafer tape. At the same time, the collet applies vacuum and picks up the die.

Die Placement

The X-Y-Z bond-head assembly transfers the picked die to the programmed bonding location. The die is placed onto the silver epoxy using the configured height, force and position parameters.

Bond Inspection

The vision system can perform inspections before and after placement. Depending on the production recipe, the machine may check lead-frame alignment, epoxy condition, missing dies, die position and die rotation.

Finished Lead-Frame Unloading

After the programmed bonding positions have been completed, the lead frame is transferred to the output side and loaded into an output magazine.

Single X-Y-Z Bond-Head Structure

The AD830 Plus uses a single bond-head assembly with controlled movement in the X, Y and Z directions. Its linear motors and linear encoders support the movement required between the wafer pickup position and the lead-frame bonding position.

The bond-head assembly also includes a voice-coil bond arm for pick and bond movement. Pick force and bonding force can be programmed according to the product and tooling setup.

The documented standard force range is 30 to 300 grams. Certain configurations may support an optional range from 300 grams to 3 kilograms.

For a used machine, the following bond-head conditions should be checked:

• Whether all axes return to their home positions correctly

• Whether the bond head moves smoothly without abnormal vibration

• Whether linear-motor or encoder alarms are present

• Whether the bond arm maintains stable pickup and bond height

• Whether vacuum response is stable

• Whether cables and pneumatic lines show damage or modification

• Whether the assembly has signs of previous collision

• Whether pick and bond force can be controlled consistently

Wafer Table, Ejector and Die Pickup System

The wafer module positions individual dies beneath the pickup collet. The wafer table provides X-Y movement and includes automatic angular correction to compensate for wafer rotation.

The documented wafer theta-correction range is ±10 degrees. The machine coordinates the wafer table, ejector pin, collet and vacuum system during die pickup.

Reliable die pickup depends on correct matching of:

• Die length and width

• Die thickness

• Wafer-tape adhesion

• Wafer expansion

• Collet dimensions

• Ejector-pin diameter and shape

• Ejector height

• Pickup height

• Vacuum level

• Airflow detection settings

A machine may complete a dry cycle successfully but still fail to pick actual dies reliably. For this reason, a production test using representative wafer material is recommended whenever possible.

Missing-Die Detection and Re-Pick Function

The standard machine functions include airflow-based missing-die detection and die re-pick capability. The system checks whether the expected vacuum or airflow condition is present after a pickup attempt.

If a die is not successfully picked, the machine can repeat the pickup operation according to the programmed settings.

Common causes of repeated missing-die alarms include:

• Contaminated or worn collet

• Incorrect collet opening

• Blocked vacuum passage

• Air leakage

• Incorrect pickup height

• Damaged or unsuitable ejector pin

• Incorrect ejector height

• Poor wafer expansion

• High die adhesion to the wafer tape

• Incorrect airflow threshold

A complete machine inspection should therefore test both the sensor response and the physical pickup process.

Silver-Epoxy Dispensing or Stamping Configuration

The AD830 Plus may be equipped with silver-epoxy dispensing or stamping modules. These modules are not identical on every machine and should be physically confirmed before purchase.

Dispensing Configuration

A dispensing system uses a syringe and needle to place a programmed quantity of silver epoxy onto the bonding position. Important settings can include dispensing pressure, needle height, delay, dispensing location and deposit sequence.

Stamping Configuration

A stamping system transfers silver epoxy from an epoxy tray to the lead frame through contact with a stamping tool. Correct tool dimensions, epoxy level and stamping height are necessary for consistent material transfer.

Dual Epoxy Stations

Some configurations include left and right epoxy-processing stations. The machine uses motor-controlled stages and programmable process positions for the two sides.

Before order confirmation, check whether the machine includes:

• Left epoxy station

• Right epoxy station

• Dispensing syringe holders

• Dispensing needles

• Stamping tools

• Epoxy trays

• Epoxy optics

• Pressure-control components

• Calibration tools

• Required software menus

Vision and Pattern-Recognition Functions

The ASM AD830 Plus uses separate optical functions for wafer alignment, die recognition, lead-frame positioning, epoxy processing and bond inspection.

The documented PR system uses 480 x 480 pixel imaging and programmable LED-array illumination. The machine can store process and vision settings within package files.

Wafer PR

Wafer PR identifies die position and supports automatic die searching. It works with the wafer table to move the selected die to the pickup position.

Work-Holder PR

The work-holder vision system recognizes lead-frame reference features. The detected position can be used to compensate for variations before epoxy application or die placement.

Epoxy Optics

Dedicated optical functions may be installed for the left and right epoxy stations. These functions assist with epoxy-position calibration and process setup.

Pre-Bond Inspection

Pre-bond inspection is performed before die placement. Depending on the recipe, it may be used to check the bonding location, lead-frame reference or epoxy condition.

Post-Bond Inspection

Post-bond inspection checks the result after die placement. It may be configured to identify missing dies, incorrect position, abnormal rotation, epoxy coverage or epoxy bridging.

Image quality, lighting stability, camera focus and recognition repeatability should be tested on a used machine. A visible camera image alone does not confirm that the PR system is accurate or stable.

Lead-Frame Handling Capability

The documented AD830 Plus material-handling range supports lead frames with the following dimensions:

Compatibility depends on more than the outside dimensions. The lead-frame layout, bond-pad arrangement, indexing pitch, support anvil, window clamp and magazine design must also match the machine setup.

Input and Output Configurations

Different AD830 Plus machines may use different material-loading arrangements.

Magazine Input Elevator

The magazine input elevator receives magazines containing unprocessed lead frames. A pusher transfers the lead frames from the selected magazine slot to the work-holder track.

Lead-Frame Stack Loader

A stack loader picks individual lead frames from a stacked supply and transfers them to the work holder. A special stack loader may be used for certain lead-frame formats.

Multi-Magazine Output Elevator

The output elevator receives completed lead frames and loads them into output magazines. Correct magazine width, height, slot pitch and loading position are necessary for reliable transfer.

Automatic Wafer Loader

Automatic wafer loading and unloading are optional functions. Machines equipped with a wafer loader may also include a wafer magazine, gripper and related setup positions.

Do not assume that an available AD830 Plus includes an automatic wafer loader only because the software contains wafer-related menus. The physical modules must be confirmed.

Standard Functions and Optional Modules

Understanding the difference between standard and optional equipment is important when comparing used ASM AD830 Plus machines.

Documented Standard Functions

• Single X-Y-Z linear-motion bond head

• Programmable pick and bond force

• Airflow-based missing-die detection

• Automatic die re-pick capability

• Lead-frame position detection

• Epoxy-position and bond-position compensation

• Automatic wafer-table angular calibration

• Dual input lead-frame detection

• Multi-magazine output elevator

• 480 x 480 pixel PR imaging

• PR preview and die search

• Programmable LED illumination

Possible Optional Modules

• Silver-epoxy dispensing assembly

• Silver-epoxy stamping assembly

• Multi-magazine input elevator

• Automatic wafer loading and unloading

• Special lead-frame stack loader

• Separator-paper detection

• Wafer expansion equipment

• Wafer mapping

• Barcode-reading functions

• Machine communication options

• SEC I/II interface

• Air ionizer

The quotation should clearly state which modules are included, missing, untested or excluded from the equipment supply.

Package Files and Production Setup

The AD830 Plus uses package files to store product and process settings. These files may include lead-frame data, wafer data, material-handling positions, dispensing settings, bonding positions and inspection parameters.

A new product setup may involve:

1. Copying an existing package file

2. Entering the lead-frame dimensions

3. Entering bond-pad layout data

4. Entering die and wafer dimensions

5. Adjusting the work-holder track width

6. Teaching magazine loading and unloading positions

7. Changing the collet and ejector tooling

8. Installing the correct anvil and window clamp

9. Calibrating the wafer and work-holder vision systems

10. Setting epoxy-process height and position

11. Teaching pickup and bonding height

12. Setting pickup and bonding force

13. Teaching pre-bond inspection

14. Teaching post-bond inspection

15. Running test bonds

16. Completing sample-quality verification

A used machine may contain package files from the previous production process. These files can be useful for machine testing but do not guarantee compatibility with a new product.

Used AD830 Plus Inspection Checklist

Before purchasing a second-hand machine, request an inspection that covers the complete system rather than only the external appearance.

Machine Identification

• Machine model

• Serial number

• Manufacturing year

• Electrical rating

• Machine configuration

• Software version

Mechanical Condition

• Bond-head movement

• Voice-coil bond-arm movement

• Wafer-table movement

• Ejector movement

• Work-holder transport

• Input and output elevator movement

• Epoxy-stage movement

• Machine covers and safety interlocks

Electrical and Control Condition

• Computer startup

• Machine software startup

• Motion-controller communication

• Motor and encoder alarms

• Sensor response

• Emergency-stop function

• Error-history review

• Backup availability

Vision-System Condition

• Camera image quality

• Lens focus

• Lighting control

• Wafer PR

• Lead-frame PR

• Epoxy-position calibration

• Pre-bond inspection

• Post-bond inspection

Production Test

• Wafer loading

• Die search

• Die pickup

• Missing-die detection

• Epoxy dispensing or stamping

• Die placement

• Bond inspection

• Lead-frame transfer

• Output magazine loading

Refurbishment and Service Scope

The service scope for an available ASM AD830 Plus depends on machine condition and customer requirements. A machine may be supplied in used condition, cleaned condition, function-tested condition or after an agreed service procedure.

Possible work may include:

• Machine cleaning

• Removal of old epoxy residue

• Inspection of vacuum tubing

• Inspection of pneumatic fittings

• Checking collet and ejector assemblies

• Checking bond-head cables

• Checking sensors and interlocks

• Testing work-holder transport

• Testing input and output elevators

• Checking camera images and lighting

• Reviewing recurring alarms

• Replacing selected damaged components

• Backing up available machine data

• Running a functional or sample-production test

Refurbishment should not be assumed unless it is clearly included in the quotation. The completed work and replaced parts should be documented.

AD830 Plus Tooling and Spare Parts

Machine suitability also depends on the availability of tooling and process-specific accessories.

Parts and tools may include:

• Collets

• Collet bodies and adapters

• Ejector pins

• Ejector holders

• Ejector caps

• Dispensing needles

• Epoxy nozzles

• Stamping tools

• Magnetic anvils

• Window clamps

• Lead-frame magazines

• Wafer rings

• Vacuum and pneumatic parts

• Sensors

• Motors and encoders

• Cameras and lighting components

• Cables and connectors

When requesting a replacement part, provide the old part label, photographs from multiple angles, connector details, installed position, machine serial number and alarm information.

Installation Conditions

The machine nameplate should be checked before connecting the electrical supply. The actual air connections, machine dimensions and required clearance should also be confirmed before factory installation.

Machine Size and Shipping Preparation

The machine dimensions and weight vary according to the installed input configuration.

Before export packing, moving assemblies should be secured to reduce the risk of transportation damage. Cameras and other sensitive components may require separate protective packing.

Recommended shipping preparation may include:

• Removing remaining silver epoxy

• Cleaning dispensing needles and epoxy tools

• Securing the bond head

• Securing the bond arm

• Securing the wafer and work-holder stages

• Protecting the ejector assembly

• Protecting cameras and optics

• Disconnecting and securing loose accessories

• Using moisture-resistant barrier material

• Adding sufficient desiccant

• Using a reinforced export wooden case

What Information Should Be Included in Your Inquiry?

To check whether an available AD830 Plus matches your application, please provide:

• Required machine model

• Preferred manufacturing year

• Required machine condition

• Die length, width and thickness

• Wafer diameter

• Wafer-map requirement

• Lead-frame drawing and dimensions

• Number of bonding positions

• Silver-epoxy type

• Dispensing or stamping requirement

• Required inspection functions

• Target production capacity

• Required input and output configuration

• Tooling requirements

• Destination country

• Installation or training requirements

Product drawings and representative sample photographs help us review machine compatibility more accurately.

ASM AD830 Plus Supply and Technical Support

We provide independent supply and technical support for used ASM semiconductor equipment. Service availability depends on the machine, project location and requested scope.

Support may include:

• Used ASM AD830 Plus machine sourcing

• Machine-photo confirmation

• Nameplate and serial-number confirmation

• Installed-module review

• Machine condition inspection

• Power-on testing

• Functional testing

• Sample-production testing

• Tooling confirmation

• Spare-parts matching

• Export packing

• International shipping coordination

• Installation assistance

• Remote technical communication

We are an independent equipment supplier and service provider. Supply and technical services should not be interpreted as official manufacturer authorization unless specifically documented.

Explore additional models and semiconductor bonding systems in our die bonder machine category.

Request a Used ASM AD830 Plus Quotation

Contact us with your required ASM AD830 Plus configuration, production application, die and lead-frame information, destination and preferred machine condition.

We will check the available machine, review the installed options and confirm which inspection, tooling, packing and support services can be included.

Frequently Asked Questions

Is the ASM AD830 Plus a die bonder?

Yes. The AD830 Plus is a fully automatic high-speed die bonding machine designed to pick dies from a wafer and attach them to lead frames using a silver-epoxy process.

Is AD830PLUS the same machine as ASM AD 830 PLUS?

AD830PLUS, ASM AD830 Plus and ASM AD 830 PLUS are commonly used name variations for the same model. Always check the machine nameplate and serial number when confirming equipment or parts.

Do you supply used ASM AD830 Plus machines?

Availability changes according to current inventory. Send your required machine configuration and destination so that available units can be checked.

What is the documented cycle time?

The operating manual specifies a nominal cycle time of 163 milliseconds under defined conditions. Actual production output depends on the package, epoxy process, inspection settings and material-handling configuration.

What die sizes can the AD830 Plus process?

The documented die-size range is 6 x 6 to 200 x 200 mil. Actual compatibility also depends on die thickness, wafer tape, collet, ejector tooling and process requirements.

What wafer size can it handle?

The documented wafer-handling capacity is up to 8 inches. The wafer frame, expander and optional automatic loader must also be compatible with the production material.

Does every AD830 Plus include automatic wafer loading?

No. Automatic wafer loading and unloading are optional. The physical wafer-loader module and related accessories must be confirmed on the available machine.

Does every machine include dispensing and stamping?

No. Silver-epoxy dispensing or stamping assemblies are configuration-dependent. Check the installed modules, tools and software before purchasing.

Can the machine inspect die placement?

The AD830 Plus supports pre-bond and post-bond inspection functions. The actual inspection capability depends on the installed optics, cameras, lighting, software and production recipe.

What should be tested before purchasing a used machine?

The inspection should cover machine startup, axis movement, bond-head operation, wafer table, ejector, vacuum, epoxy modules, vision functions, lead-frame handling, alarms and a representative production cycle.

Can you provide AD830 Plus tooling and spare parts?

Tooling and parts can be checked according to availability. Provide the old part number, photographs, connector details, installed position and machine information for matching.

How is the machine packed for international shipment?

Moving modules should be secured, sensitive optics should be protected and the machine should be packed with moisture-resistant materials, desiccant and a reinforced export wooden case.

How much does a used ASM AD830 Plus cost?

The price depends on the manufacturing year, condition, installed modules, included tooling, testing scope, refurbishment work, packaging and destination. A quotation should be based on a specific machine and documented supply list.

What information do you need for a quotation?

Please provide the die dimensions, wafer size, lead-frame drawing, silver-epoxy process, required machine configuration, target output and destination country.