I-ASM AD830 Plus Die Bonder esetyenzisiweyo iyathengiswa kwaye ixhaswa

Iwasebenzisa ASM AD830 Plus die bonderyinkqubo yokuncamathisela idayi ekhawulezayo ngokuzenzekelayo eyenzelwe ukukhetha iidayi ze-semiconductor kwi-wafer kwaye izibophe kwiifreyimu ze-lead kusetyenziswa inkqubo yesilivere-epoxy. Lo matshini udibanisa ukuthuthwa kwefreyimu ye-lead, ukubeka i-wafer kwindawo yayo, ukuqatshelwa kwedayi, ukusetyenziswa kwe-epoxy, i-die pickup, indawo kunye nokuhlolwa kwe-optical kwiqonga elinye lemveliso elizenzekelayo.

Le modeli ingabonakala nakwimibuzo yabathengi nakwiirekhodi zezixhobo njengeI-ASM AD 830 PLUS, AD830PLUS, AD 830 Kunye nebhondiokanyeI-ASM Pacific Technology AD830 PlusNgaphambi kokuba uthenge umatshini, imodeli echanekileyo, inombolo yeserial, iimodyuli ezifakiweyo kunye nezixhobo kufuneka ziqinisekiswe kwi-nameplate yomatshini kunye noqwalaselo olubonakalayo.

Sixhasa abathengi abafuna i-ASM AD830 Plus yokutshintsha imveliso, ukwandisa umthamo, ukulungiselela oomatshini abangasetyenziswanga okanye iiprojekthi zezixhobo ze-semiconductor ezisetyenzisiweyo. Iiyunithi ezikhoyo zinokwahluka ngonyaka wokwenziwa, isoftware, i-epoxy module, i-wafer loader, inkqubo yokufaka i-lead-frame, izixhobo kunye nemeko iyonke.

Isishwankathelo sokuFumaneka kwe-ASM AD830 Plus

Zonke iinkcukacha, ukhetho kunye nezixhobo ezifakiweyo kufuneka zijongwe ngokuchasene nomatshini wokwenyani ngaphambi kokuqinisekiswa kweodolo. Oomatshini abasetyenzisiweyo abanegama elifanayo lomzekelo banokuba neendlela ezahlukeneyo zokuvelisa.

Kutheni Abavelisi Befumana I-ASM AD830 Plus Esetyenzisiweyo

I-ASM AD830 Plus esetyenzisiweyo ingaqwalaselwa xa indawo yokuvelisa sele isebenzisa iqonga elifanayo lomatshini, idinga amandla ongezelelweyo okubopha idayethi okanye ifuna ukutshintsha umatshini ongafumanekiyo ngaphandle koyilo olutsha lwenkqubo epheleleyo.

Ukusebenzisa usapho olunye lomatshini kunokwenza lula iimfuno ezininzi zemveliso:

• Iifayile zephakheji ezikhoyo zinokuba lula ukuzidlulisela okanye ukuziphinda-phinda

• Abaqhubi basenokuba sele beyiqonda indlela esebenza ngayo i-machine interface

• Iicollets ezikhoyo, izixhobo ze-ejector kunye nee-anvils zisenokuhlala ziluncedo

• Amaqela okulungisa asenokuba sele egcine izinto ezihambelanayo

• Ixesha lophuhliso lwenkqubo linokuba lifutshane kunokutshintshela kwiqonga elahlukileyo

• Imigca yemveliso ingagcina amalungiselelo afanayo okuphatha izinto

Nangona kunjalo, umatshini akufuneki ukhethwe kuphela kuba igama lomzekelo lihambelana neyunithi ekhoyo. Umahluko kwi-wafer loader, i-epoxy module, i-lead-frame input, isoftware, i-optics kunye ne-tooling inokuchaphazela ukuhambelana nemveliso ekujoliswe kuyo.

Indlela uMjikelo weMveliso ye-AD830 Plus osebenza ngayo

I-AD830 Plus yenzelwe ukwamkela iifreyimu ze-lead, ukufaka i-epoxy yesilivere, ukukhetha iidayi ezivela kwi-wafer kunye nokubeka iidayi kwiindawo zokubopha ezicwangcisiweyo.

Ukulayisha iSakhelo seNkokeli

Iifreyimu zentsimbi ezingasetyenzwanga zingena kwinkqubo nge-lifti yokufaka imagazini okanye ilungiselelo lokufaka i-stack-loading, kuxhomekeke kulwakhiwo lwezixhobo ezifakiweyo. Umatshini udlulisela ifreyimu nganye yentsimbi kwi-track ye-workholder.

Indawo yokubeka isakhelo se-Lead

Isibambi somsebenzi sihambisa isakhelo se-lead kumatshini. Iisensa zesikhundla kunye nemisebenzi yokuqaphela iipateni zinceda ukulungelelanisa isakhelo se-lead kunye ne-epoxy kunye nezikhululo zokubopha.

Isicelo seSilver-Epoxy

Izinto zokubopha zisetyenziswa ngaphambi kokufakwa kwedayi. Ngokuxhomekeke kulwakhiwo lomatshini, i-AD830 Plus ingasebenzisa inaliti yokukhupha okanye isixhobo sokunyathela ukufaka i-epoxy yesilivere kwisakhelo se-lead.

Ukukhangela indawo yeWafer kunye neDie

Itafile ye-wafer ihambisa idayisi ekhethiweyo kwindawo yokuthathwa. Inkqubo ye-wafer PR ichonga indawo yedayi ize ibale ukulungiswa kokulungelelaniswa okufunekayo.

I-Pickup

Iphini ye-ejector iphakama ngaphantsi kwedayi ukuze iyahlule kwi-wafer tape. Kwangaxeshanye, i-collet ifaka i-vacuum ize ithathe idayisi.

Ukubekwa kweDie

I-XYZ bond-head assembly idlulisela i-picked die kwindawo ye-programmed bonding. I-die ibekwa kwi-silver epoxy kusetyenziswa iiparameter zokuphakama, amandla kunye nendawo ezicwangcisiweyo.

Ukuhlolwa kweBond

Inkqubo yokubona ingenza uhlolo ngaphambi nasemva kokubekwa. Ngokuxhomekeke kwindlela yokuvelisa, umatshini unokujonga ulungelelwaniso lwefreyimu yelead, imeko ye-epoxy, iidayi ezingekhoyo, indawo yedayi kunye nokujikeleza kwedayi.

Ukukhululwa kwesakhelo seLead esigqityiweyo

Emva kokuba izikhundla zokubopha ezicwangcisiweyo zigqityiwe, isakhelo se-lead sidluliselwa kwicala lesiphumo kwaye silayishwe kwimagazini yesiphumo.

Ulwakhiwo lwe-Single XYZ Bond-Head

I-AD830 Plus isebenzisa i-bond-head assembly enye enentshukumo elawulwayo kwiindlela ze-X, Y kunye ne-Z. Iimoto zayo ezithe ngqo kunye nee-linear encoders zixhasa intshukumo efunekayo phakathi kwendawo yokuthatha i-wafer kunye nendawo yokuthatha i-lead-frame bonding.

I-bond-head assembly ikwaquka nengalo ye-voice-coil bond arm yokuhambisa i-pick kunye ne-bond movement. I-Pick force kunye ne-bonding force zinokucwangciswa ngokwemveliso kunye nokuseta izixhobo.

Uluhlu oluqhelekileyo lwamandla olubhaliweyo luphakathi kwama-30 ukuya kuma-300 grams. Ezinye iindlela zokumisela zinokuxhasa uluhlu olunokukhethwa ukusuka kuma-300 grams ukuya kuma-3 kilograms.

Kwimatshini osetyenzisiweyo, le miqathango ilandelayo ye-bond-head kufuneka ijongwe:

• Ingaba zonke ii-axes zibuyela kwiindawo zazo zasekhaya ngokuchanekileyo na

• Nokuba intloko yebhondi ihamba kakuhle ngaphandle kokungcangcazela okungaqhelekanga

• Nokuba kukho ii-alamu ze-linear-motor okanye ze-encoder

• Ingaba ingalo yebhondi igcina ukuphakama okuzinzileyo kunye nokuphakama kwebhondi

• Ingaba impendulo ye-vacuum izinzile

• Nokuba iintambo kunye nemigca ye-pneumatic zibonisa umonakalo okanye utshintsho

• Ingaba indibano ineempawu zokungqubana kwangaphambili

• Ingaba amandla e-pick kunye ne-bond anokulawulwa rhoqo

Itafile yeWafer, iEjector kunye neDie Pickup System

Imodyuli ye-wafer ibeka umntu ngamnye phantsi kwe-pickup collet. Itafile ye-wafer inika intshukumo ye-XY kwaye ibandakanya ukulungiswa kwe-angular ngokuzenzekelayo ukubuyisela ukujikeleza kwe-wafer.

Uluhlu lokulungiswa kwe-wafer olubhaliweyo yi-±10 degrees. Umatshini ulungelelanisa itafile ye-wafer, i-ejector pin, i-collet kunye ne-vacuum system ngexesha lokuthathwa kwedayi.

Ukuchola iidayi ezinokuthenjwa kuxhomekeke ekufanisweni ngokuchanekileyo kwezi zinto zilandelayo:

• Ubude kunye nobubanzi bedayi

• Ubukhulu bedayi

• Ukunamathela kwi-wafer-tape

• Ukwandiswa kwewafer

• Ubukhulu beCollet

• Ububanzi kunye nemilo ye-ejector-pin

• Ukuphakama kwe-ejector

• Ukuphakama kwelori

• Inqanaba le-vacuum

• Izicwangciso zokufumanisa ukuhamba komoya

Umatshini usenokugqiba umjikelo owomileyo ngempumelelo kodwa angaphumeleli ukukhetha iidayi zokwenyani ngokuthembekileyo. Ngenxa yesi sizathu, uvavanyo lokuvelisa kusetyenziswa izinto ezimele i-wafer luyacetyiswa nanini na xa kunokwenzeka.

Ukufunyanwa Kokufa Okulahlekileyo kunye Nomsebenzi Wokukhetha Kwakhona

Imisebenzi eqhelekileyo yomatshini ibandakanya ukubonwa komoya ongekhoyo kunye nokukwazi ukukhetha kwakhona i-die. Inkqubo ijonga ukuba imeko ye-vacuum okanye ukuhamba komoya ikwimeko elindelekileyo emva kokuzama ukuyithatha.

Ukuba idayisi ayikhethwanga ngempumelelo, umatshini unokuphinda umsebenzi wokuthathwa ngokwezicwangciso ezicwangcisiweyo.

Izizathu eziqhelekileyo zokusoloko ulahlekile ziquka:

• Ikhola engcolileyo okanye egugileyo

• Ukuvulwa kwekholethi okungalunganga

• Ipaseji ye-vacuum evaliweyo

• Ukuvuza komoya

• Ubude bokuthathwa obungalunganga

• Iphini yokuphuma eyonakeleyo okanye engafanelekanga

• Ukuphakama kwe-ejector okungachanekanga

• Ukwandiswa kwewafer okungalunganga

• Ukunamathela okuphezulu kwi-wafer tape

• Umda wokuhamba komoya ongalunganga

Ukuhlolwa okupheleleyo komatshini kufuneka kuvavanye zombini impendulo yesenzi kunye nenkqubo yokuthathwa ngokoqobo.

Ulungiselelo lweSilivere-Epoxy Dispensing okanye Stamping

I-AD830 Plus inokuba neemodyuli ze-silver-epoxy dispensing okanye stamping. Ezi modyuli azifani kuzo zonke iimatshini kwaye kufuneka ziqinisekiswe ngokwasemzimbeni ngaphambi kokuba zithengwe.

Uqwalaselo lokuhambisa

Inkqubo yokukhupha amanzi isebenzisa isirinji kunye nenaliti ukubeka ubungakanani obucwangcisiweyo be-epoxy yesilivere kwindawo yokubopha. Izinto ezibalulekileyo zingabandakanya uxinzelelo lokukhupha amanzi, ukuphakama kwenaliti, ukulibaziseka, indawo yokukhupha amanzi kunye nolandelelwano lokufaka amanzi.

Uqwalaselo lokunyathela

Inkqubo yokustampa idlulisela i-epoxy yesilivere ukusuka kwitreyi ye-epoxy ukuya kwisakhelo se-lead ngokudibana nesixhobo sokustampa. Ubungakanani obuchanekileyo besixhobo, inqanaba le-epoxy kunye nokuphakama kokustampa kuyafuneka ukuze kudluliselwe izinto rhoqo.

Izikhululo ze-Epoxy ezimbini

Ezinye izinto ezicwangcisiweyo ziquka izitishi zokucubungula i-epoxy ekhohlo nasekunene. Umatshini usebenzisa izigaba ezilawulwa yimoto kunye neendawo zenkqubo ezinokucwangciswa kumacala omabini.

Ngaphambi kokuqinisekiswa kweodolo, jonga ukuba umatshini uquka na:

• Isitishi se-epoxy sasekhohlo

• Isitishi se-epoxy sasekunene

• Izibambi zesirinji zokukhupha

• Iinaliti zokukhupha

• Izixhobo zokunyathela

• Iitreyi ze-Epoxy

• I-Epoxy optics

• Izinto ezilawula uxinzelelo

• Izixhobo zokulinganisa

• Iimenyu zesoftware ezifunekayo

Imisebenzi yoKubona kunye nokuQaphela iiPateni

I-ASM AD830 Plus isebenzisa imisebenzi eyahlukeneyo ye-optical yokulungelelanisa i-wafer, ukuqaphela i-die, ukubeka i-lead-frame positioning, ukucubungula i-epoxy kunye nokuhlolwa kwebhondi.

Inkqubo ye-PR ebhaliweyo isebenzisa imifanekiso ye-pixel ezingama-480 x 480 kunye nokukhanya kwe-LED okucwangcisiweyo. Umatshini unokugcina useto lwenkqubo kunye nolwembono ngaphakathi kweefayile zephakheji.

I-PR yeWafer

I-Wafer PR ichonga indawo yedayi kwaye ixhasa ukukhangela idayisi ngokuzenzekelayo. Isebenza netafile yedayi ukuhambisa idayisi ekhethiweyo iye kwindawo yokuyithatha.

I-PR yoMnini-msebenzi

Inkqubo yokubona ye-work-holder iyaziqonda iimpawu zesalathiso se-lead-frame. Indawo efunyenweyo ingasetyenziselwa ukuhlawula utshintsho ngaphambi kokusetyenziswa kwe-epoxy okanye ukufakwa kwe-die.

I-Epoxy Optics

Imisebenzi ye-optical enikezelweyo ingafakelwa kwizikhululo ze-epoxy ezisekhohlo nasekunene. Le misebenzi inceda ekulinganisweni kwe-epoxy-position kunye nokuseta inkqubo.

Uhlolo lwangaphambi kwebhondi

Ukuhlolwa kwangaphambili kwebhondi kwenziwa ngaphambi kokubekwa kwedayi. Ngokuxhomekeke kwiresiphi, ingasetyenziselwa ukujonga indawo yebhondi, isalathiso sefreyimu yelead okanye imeko ye-epoxy.

Uhlolo lwe-Post-Bond

Ukuhlolwa emva kwebhondi kujonga iziphumo emva kokubekwa kwedayi. Ingalungiselelwa ukuchonga iidayi ezilahlekileyo, indawo engalunganga, ukujikeleza okungaqhelekanga, ukugqunywa kwe-epoxy okanye i-epoxy bridging.

Umgangatho womfanekiso, ukuzinza kokukhanya, ukugxila kwekhamera kunye nokuqondwa kwakhona kufanele kuvavanywe kumatshini osetyenzisiweyo. Umfanekiso wekhamera ebonakalayo wodwa awuqinisekisi ukuba inkqubo ye-PR ichanekile okanye izinzile.

Ubuchule bokuphatha isakhelo se-Lead

Uluhlu olubhaliweyo lwe-AD830 Plus lokuphatha izinto luxhasa izakhelo ze-lead ezinemilinganiselo elandelayo:

Ukuhambelana kuxhomekeke kwizinto ezingaphezulu kunezo zangaphandle. Uyilo lwefreyimu yelead, ulungiselelo lwe-bond-pad, i-indexing pitch, i-support anvil, i-window clamp kunye noyilo lwemagazini nazo kufuneka zihambelane nolungiselelo lomatshini.

Uqwalaselo lokufaka kunye nokuphuma

Oomatshini abahlukeneyo be-AD830 Plus banokusebenzisa amalungiselelo ahlukeneyo okulayisha izinto.

I-Lifti yokufaka iMagazini

Ilifti yokufaka imagazini ifumana iimagazini ezineefreyimu zelothe ezingacutshungulwanga. Isityhali sidlulisela iifreyimu zelothe ukusuka kwindawo ekhethiweyo yemagazini ukuya kwindawo yokusebenzela.

Isilayidi seStack seLead-Frame

Isixhobo sokulayisha i-stack sikhetha iifreyimu ze-lead nganye kwisixhobo esihlanganisiweyo size sizidlulisele kwi-workholder. Isixhobo sokulayisha i-stack esikhethekileyo singasetyenziswa kwiifomathi ezithile ze-lead-frame.

I-elevator yeziphumo ezininzi

Ilifti ephumayo ifumana iifreyimu ze-lead ezigqityiweyo kwaye izifake kwiimagazini eziphumayo. Ububanzi obuchanekileyo bemagazini, ukuphakama, indawo yokubeka kunye nendawo yokulayisha ziyafuneka ukuze kudluliselwe ngokuthembekileyo.

Isilayishi seWafer esizenzekelayo

Ukulayisha nokukhupha i-wafer ngokuzenzekelayo yimisebenzi engazikhetheliyo. Oomatshini abaxhotyiswe nge-wafer loader banokuthi baquke i-wafer magazine, i-gripper kunye neendawo zokuseta ezinxulumene noko.

Musa ukucinga ukuba i-AD830 Plus ekhoyo iquka i-wafer loader ezenzekelayo kuphela kuba isoftware ineemenyu ezinxulumene ne-wafer. Iimodyuli ezibonakalayo kufuneka ziqinisekiswe.

Imisebenzi Eqhelekileyo kunye neeModyuli Ezinganyanzelekanga

Kubalulekile ukuqonda umahluko phakathi kwezixhobo eziqhelekileyo nezo zinganyanzelekanga xa kuthelekiswa oomatshini abasetyenzisiweyo be-ASM AD830 Plus.

Imisebenzi eQhelekileyo ebhaliweyo

• Intloko yebhondi ye-XYZ enye ejikelezayo

• Amandla okukhetha kunye nokubopha anokucwangciswa

• Ukufunyanwa kokulahleka kwee-dies okusekelwe ekuhambeni komoya

• Ubuchule bokukhetha kwakhona ukufa ngokuzenzekelayo

• Ukufunyanwa kwendawo yesakhelo se-lead

• Imbuyekezo yesikhundla se-epoxy kunye nesikhundla sebhondi

• Ukulinganiswa kwe-angle yetafile ye-wafer ngokuzenzekelayo

• Ukufunyanwa kwesakhelo se-lead-frame yokufaka kabini

• Ilifti yemveliso yeemagazini ezininzi

• Umfanekiso we-PR we-480 x 480 pixels

• Imboniso ye-PR kunye nokukhangela ngokufa

• Ukukhanya kwe-LED okucwangcisiweyo

Iimodyuli ezinokubakho zokuzikhethela

• Indibano yokusasaza iSilver-epoxy

• Indibano yokunyathela yesilivere-epoxy

• Ilifti yokufaka iimagazini ezininzi

• Ukulayisha nokukhulula i-wafer ngokuzenzekelayo

• Isilayishi esikhethekileyo sesakhelo se-lead

• Ukufunyanwa kwephepha lokwahlulahlula

• Izixhobo zokwandisa i-wafer

• Imephu ye-wafer

• Imisebenzi yokufunda i-Barcode

• Iinketho zonxibelelwano loomatshini

• Ujongano lwe-SEC I/II

• I-ionizer yamanzi

Ikhowuteshini mayichaze ngokucacileyo ukuba zeziphi iimodyuli ezifakiweyo, ezingekhoyo, ezingavavanywanga okanye ezingafakwanga kubonelelo lwezixhobo.

Iifayile zePakethe kunye noSeto lweMveliso

I-AD830 Plus isebenzisa iifayile zephakheji ukugcina useto lwemveliso kunye nokucubungula. Ezi fayile zinokubandakanya idatha yesakhelo se-lead, idatha ye-wafer, iindawo zokuphatha izinto, useto lokuhambisa, iindawo zokubopha kunye neeparamitha zokuhlola.

Ukuseta imveliso entsha kunokubandakanya:

1. Ukukopa ifayile yephakheji ekhoyo

2. Ukufaka ubungakanani befreyimu yelead

3. Ukufaka idatha yoyilo lwe-bond-pad

4. Ukufaka ubungakanani bedayi kunye ne-wafer

5. Ukulungisa ububanzi bomgca womsebenzi

6. Izikhundla zokufundisa ukulayisha nokukhulula iimagazini

7. Ukutshintsha isixhobo se-collet kunye ne-ejector

8. Ukufakela i-anvil kunye ne-closet yefestile echanekileyo

9. Ukulinganisa i-wafer kunye neenkqubo zokubona zomsebenzi

10. Ukuseta ubude kunye nendawo yenkqubo ye-epoxy

11. Ukufundisa ukuphakama kunye nokubopha ubude

12. Ukuseta amandla okuthatha kunye nokubopha

13. Uvavanyo lwangaphambi kwebhondi yokufundisa

14. Uvavanyo lwe-post-bond

15. Ukusebenzisa iibhondi zovavanyo

16. Ukugqibezela ukuqinisekiswa komgangatho wesampuli

Umatshini osetyenzisiweyo unokuba neefayile zephakheji zenkqubo yokuvelisa yangaphambili. Ezi fayile zinokuba luncedo kuvavanyo lomatshini kodwa aziqinisekisi ukuhambelana nemveliso entsha.

Uluhlu lokuhlola olusetyenzisiweyo lwe-AD830 Plus

Ngaphambi kokuba uthenge umatshini osetyenzisiweyo, cela uhlolo olugubungela yonke inkqubo endaweni yokubona nje kuphela.

Ukuchongwa koomatshini

• Imodeli yomatshini

• Inombolo yesiriyeli

• Unyaka wokuvelisa

• Uvavanyo lombane

• Uqwalaselo lomatshini

• Inguqulelo yesoftware

Imeko Yoomatshini

• Intshukumo ye-Bond-head

• Intshukumo yengalo yokubopha-i-voice-coil

• Intshukumo yetafile ye-wafer

• Intshukumo ye-Ejector

• Uthutho lwabasebenzi

• Intshukumo yelifti yokufaka kunye neyokukhupha

• Intshukumo yesigaba se-epoxy

• Izigqubuthelo zoomatshini kunye neziqhoboshi zokhuseleko

Imeko yoMbane noLawulo

• Ukuqalisa ikhompyutha

• Ukuqalisa isoftware yomatshini

• Unxibelelwano lolawulo lwentshukumo

• Iialamu zemoto kunye neze-encoder

• Impendulo yenzwa

• Umsebenzi wokumisa ngexesha likaxakeka

• Uhlolo lwembali yeempazamo

• Ukufumaneka kwekopi

Imeko yeNkqubo yoMbono

• Umgangatho womfanekiso wekhamera

• Ukugxila kwelensi

• Ulawulo lokukhanyisa

• I-PR yeWafer

• I-PR yesakhelo se-lead

• Ukulinganiswa kwendawo ye-epoxy

• Ukuhlolwa kwangaphambili kwebhondi

• Ukuhlolwa kwebhondi emva kokuhlawula

Uvavanyo lweMveliso

• Ukulayishwa kwewafer

• Ukukhangela ngokufa

• Ilori yokuthatha impahla

• Ukufunyanwa kokungabikho kokufa

• Ukukhupha okanye ukustampa i-epoxy

• Ukubekwa kwedayi

• Ukuhlolwa kwebhondi

• Ukudluliselwa kwesakhelo se-lead

• Imagazini ephumayo iyalayishwa

Ukuhlaziywa kunye nobubanzi beNkonzo

Ubungakanani benkonzo ye-ASM AD830 Plus ekhoyo buxhomekeke kwimeko yomatshini kunye neemfuno zabathengi. Umatshini ungabonelelwa kwimeko esetyenzisiweyo, kwimeko ecocekileyo, kwimeko evavanyiweyo yokusebenza okanye emva kwenkqubo yenkonzo evunyelweneyo.

Umsebenzi onokwenzeka ungabandakanya:

• Ukucoca oomatshini

• Ukususwa kwentsalela ye-epoxy endala

• Ukuhlolwa kweetyhubhu ze-vacuum

• Ukuhlolwa kwezinto ezifakelwa umoya

• Ukujonga iindibano ze-collet kunye ne-ejector

• Ukujonga iintambo ze-bond-head

• Ukujonga ii-sensors kunye nee-interlocks

• Ukuvavanya ukuthuthwa kwabasebenzi

• Ukuvavanya iilifti ezifakwayo neziphumayo

• Ukujonga imifanekiso yekhamera kunye nokukhanya

• Ukuphonononga ii-alamu eziphindaphindayo

• Ukutshintsha izinto ezonakeleyo ezikhethiweyo

• Ukugcina idatha yomatshini ekhoyo

• Ukuqhuba uvavanyo olusebenzayo okanye oluvelisa isampuli

Ukuhlaziywa kwempahla akufuneki kuthathwe ngaphandle kokuba kucacisiwe kwisicatshulwa. Umsebenzi ogqityiweyo kunye neendawo ezitshintshiweyo kufuneka zibhalwe phantsi.

Izixhobo ze-AD830 Plus kunye neenxalenye zeSpare

Ukufaneleka komatshini kuxhomekeke ekufumanekeni kwezixhobo kunye nezixhobo ezithile zenkqubo.

Iinxalenye kunye nezixhobo zingabandakanya:

• imigibe

• Imizimba yeekholethi kunye neeadaptha

• Izikhonkwane ze-ejector

• Izibambi ze-Ejector

• Iikhaphu ze-ejector

• Iinaliti zokukhupha

• Ii-epoxy nozzles

• Izixhobo zokunyathela

• Ii-anvil zemagnethi

• Iikliphu zefestile

• Iimagazini ezikwisakhelo senkokeli

• Amaringi e-wafer

• Izixhobo zomoya kunye nezomoya

• Izinzwa

• Iimoto kunye neekhowudi

• Iikhamera kunye nezixhobo zokukhanyisa

• Iintambo kunye nezihlanganisi

Xa ucela indawo entsha, nika ilebheli yenxalenye endala, iifoto ezivela kwii-engile ezahlukeneyo, iinkcukacha zesixhumi, indawo efakiweyo, inombolo yothotho lomatshini kunye nolwazi lwe-alamu.

Iimeko zoFakelo

Ipleyiti yegama lomatshini kufuneka ihlolwe ngaphambi kokudibanisa umbane. Uqhagamshelo lomoya, ubukhulu bomatshini kunye nokususwa okufunekayo kufuneka kuqinisekiswe ngaphambi kokufakwa kwefektri.

Ubungakanani boMatshini kunye noLungiselelo lokuThunyelwa

Ubukhulu kunye nobunzima bomatshini buyahluka ngokwendlela yokufaka efakiweyo.

Ngaphambi kokuba kupakishwe impahla ngaphandle, kufuneka kufakwe izixhobo ezithuthwayo ukuze kuncitshiswe umngcipheko wokonakala kwezothutho. Iikhamera kunye nezinye izinto ezinobuthathaka zinokufuna ukupakisha okwahlukileyo kokukhusela.

Ukulungiselela ukuthunyelwa okucetyiswayo kungabandakanya:

• Ukususa i-epoxy yesilivere eseleyo

• Ukucoca iinaliti zokukhupha kunye nezixhobo ze-epoxy

• Ukukhusela intloko yebhondi

• Ukukhusela ingalo yebhondi

• Ukukhusela i-wafer kunye nezigaba zomsebenzi

• Ukukhusela indibano ye-ejector

• Ukukhusela iikhamera kunye ne-optics

• Ukuqhawula nokubopha izixhobo ezikhululekileyo

• Ukusebenzisa izinto ezithintela ukufuma

• Ukongeza i-desiccant eyaneleyo

• Ukusebenzisa ityesi yomthi eqinisiweyo yokuthumela ngaphandle

Loluphi ulwazi olufanele lufakwe kwiNgcebiso yakho?

Ukujonga ukuba i-AD830 Plus ekhoyo iyahambelana nesicelo sakho, nceda unikezele:

• Imodeli yomatshini efunekayo

• Unyaka wokuvelisa okhethwayo

• Imeko yomatshini efunekayo

• Ubude bedayi, ububanzi kunye nobukhulu

• Ububanzi be-wafer

• Imfuneko yemephu ye-wafer

• Umzobo kunye nobukhulu befreyimu yelead

• Inani lezikhundla zokubopha

• Uhlobo lwesilivere-epoxy

• Imfuneko yokukhupha okanye yokustampa

• Imisebenzi yokuhlola efunekayo

• Umthamo wemveliso ekujoliswe kuwo

• Uqwalaselo lokufaka kunye nemveliso olufunekayo

• Iimfuno zezixhobo

• Ilizwe ekuyiwa kulo

• Iimfuneko zokufakelwa okanye zoqeqesho

Imizobo yemveliso kunye neefoto zesampuli ezimeleyo zisinceda sihlolisise ukuhambelana komatshini ngokuchanekileyo.

Ubonelelo kunye neNkxaso yoBugcisa ye-ASM AD830 Plus

Sinikezela ngokubonelela ngokuzimeleyo kunye nenkxaso yobugcisa kwizixhobo ze-semiconductor ze-ASM ezisetyenzisiweyo. Ukufumaneka kwenkonzo kuxhomekeke kumatshini, indawo yeprojekthi kunye nobubanzi obuceliweyo.

Inkxaso ingabandakanya:

• Umatshini osetyenzisiweyo we-ASM AD830 Plus

• Ukuqinisekiswa kwefoto yomatshini

• Ipleyiti yegama kunye nokuqinisekiswa kwenombolo yeserial

• Uhlolo lwemodyuli efakiweyo

• Ukuhlolwa kwemeko yomatshini

• Uvavanyo lokuvula amandla

• Uvavanyo olusebenzayo

• Uvavanyo lwemveliso yesampulu

• Ukuqinisekiswa kwezixhobo

• Ukuhambelana kweendawo zokugcina izinto

• Ukupakisha ngaphandle

• Ukulungelelaniswa kokuthunyelwa kwempahla kwamanye amazwe

• Uncedo lokufakelwa

• Unxibelelwano lobuchwephesha olukude

Singumboneleli wezixhobo ozimeleyo kunye nomboneleli weenkonzo. Iinkonzo zokubonelela ngeenkonzo kunye nezobuchwephesha akufuneki zitolikwe njengemvume esemthethweni yomenzi ngaphandle kokuba zibhalwe ngokucacileyo.

Hlola ezinye iimodeli kunye neenkqubo zokubopha ze-semiconductor kwi-intanethi yethuumatshini we-bonderudidi.

Cela iKoteshini ye-ASM AD830 Plus esetyenzisiweyo

Qhagamshelana nathi nge-ASM AD830 Plus oyidingayo, usetyenziso lwemveliso, ulwazi lwe-die kunye ne-lead-frame, indawo oya kuyo kunye nemeko yomatshini owuthandayo.

Siza kujonga umatshini okhoyo, sihlole iindlela ezifakiweyo size siqinisekise ukuba zeziphi iinkonzo zokuhlola, izixhobo, ukupakisha kunye nenkxaso ezinokufakwa.

Imibuzo ebuzwa qho

Ngaba i-ASM AD830 Plus yi-die bond?

Ewe. I-AD830 Plus ngumatshini wokubopha iidayi ozenzekelayo osebenza ngesantya esiphezulu owenzelwe ukukhetha iidayi kwi-wafer kwaye uzincamathisele kwifreyimu ze-lead usebenzisa inkqubo yesilivere-epoxy.

Ingaba i-AD830PLUS ngumatshini ofanayo nowe-ASM AD 830 PLUS?

I-AD830PLUS, i-ASM AD830 Plus kunye ne-ASM AD 830 PLUS ziindlela ezisetyenziswa rhoqo zokwahluka kwamagama kwimodeli efanayo. Soloko ujonga ipleyiti yegama lomatshini kunye nenombolo yochungechunge xa ​​uqinisekisa izixhobo okanye iindawo.

Ngaba nibonelela ngoomatshini be-ASM AD830 Plus abasetyenzisiweyo?

Ukufumaneka kuyatshintsha ngokwezinto ezikhoyo. Thumela ulwakhiwo lomatshini wakho olufunekayo kunye nendawo oya kuyo ukuze iiyunithi ezikhoyo zihlolwe.

Lithini ixesha lomjikelo obhaliweyo?

Incwadi yokusebenza ichaza ixesha lomjikelo oqhelekileyo we-163 milliseconds phantsi kweemeko ezichaziweyo. Imveliso yokwenyani ixhomekeke kwiphakheji, inkqubo ye-epoxy, useto lokuhlola kunye noqwalaselo lokuphathwa kwezinto.

Zeziphi iisayizi zedayi ezinokwenziwa yi-AD830 Plus?

Uluhlu lobungakanani bedayi olubhaliweyo luphakathi kwe-6 x 6 ukuya kwi-200 x 200 mil. Ukuhambelana okwenyani kuxhomekeke kubukhulu bedayi, iteyiphu ye-wafer, i-collet, izixhobo ze-ejector kunye neemfuno zenkqubo.

Ingaba ingakanani i-wafer enokuyiphatha?

Umthamo wokuphatha i-wafer ebhaliweyo ufikelela kwi-intshi ezi-8. Isakhelo se-wafer, i-expander kunye ne-automatic loader engazikhetheliyo nazo kufuneka zihambelane nezinto zokuvelisa.

Ngaba yonke i-AD830 Plus ibandakanya ukulayisha i-wafer ngokuzenzekelayo?

Hayi. Ukulayisha nokukhupha i-wafer ngokuzenzekelayo akuxhomekekanga kwimfuneko. Imodyuli yokulayisha i-wafer kunye nezinye izixhobo ezinxulumene nayo kufuneka ziqinisekiswe kumatshini okhoyo.

Ngaba yonke imashini ibandakanya ukukhupha nokufaka isitampu?

Hayi. Iindibano zeSilver-epoxy dispensing okanye stamping zixhomekeke kwisimo. Jonga iimodyuli ezifakiweyo, izixhobo kunye nesoftware phambi kokuba uthenge.

Ngaba umatshini unokuhlola indawo yokubeka idayisi?

I-AD830 Plus ixhasa imisebenzi yokuhlolwa kwe-pre-bond kunye ne-post-bond. Amandla okwenyani okuhlola axhomekeke kwi-optics efakiweyo, iikhamera, izibane, isoftware kunye neresiphi yokuvelisa.

Yintoni ekufuneka ivavanywe ngaphambi kokuba kuthengwe umatshini osetyenzisiweyo?

Uhlolo lufanele lugubungele ukuqalisa komatshini, ukuhamba kwe-axis, ukusebenza kwe-bond-head, itafile ye-wafer, i-ejector, i-vacuum, iimodyuli ze-epoxy, imisebenzi yombono, ukuphathwa kwefreyimu ye-lead, ii-alamu kunye nomjikelo wemveliso omeleyo.

Ngaba ungabonelela ngezixhobo ze-AD830 Plus kunye nezixhobo ezingasetyenziswanga?

Izixhobo kunye nezixhobo zingajongwa ngokwendlela ezifumaneka ngayo. Nika inombolo yenxalenye endala, iifoto, iinkcukacha zesixhumi, indawo efakiweyo kunye nolwazi lomatshini ukuze kuhambelane.

Umatshini upakishwa njani ukuze uthunyelwe kwamanye amazwe?

Iimodyuli ezishukumayo mazikhuseleke, ii-optics ezibuthathaka mazikhuselwe kwaye umatshini kufuneka upakishwe ngezinto ezimelana nokufuma, i-desiccant kunye nebhokisi yokhuni eqinisiweyo yokuthumela ngaphandle.

Ixabisa malini i-ASM AD830 Plus esetyenzisiweyo?

Ixabiso lixhomekeke kunyaka wokwenziwa, imeko, iimodyuli ezifakiweyo, izixhobo ezifakiweyo, ububanzi bovavanyo, umsebenzi wokuhlaziya, ukupakishwa kunye nendawo ekuyiwa kuyo. Ixabiso kufuneka lisekelwe kumatshini othile kunye noluhlu lwezinto ezibonelelwayo ezibhaliweyo.

Loluphi ulwazi olufunekayo kwikowuteshini?

Nceda unikezele ngemilinganiselo yedayi, ubungakanani be-wafer, umzobo wefreyimu yelead, inkqubo yesilivere-epoxy, uqwalaselo lomatshini olufunekayo, imveliso ekujoliswe kuyo kunye nelizwe ekuyiwa kulo.