i-ave ukuya kuthi ga kwi-70% kuMacandelo e-SMT - KwiSitokhwe & Ukulungele ukuThunyelwa
Fumana iQuote →Izixhobo zokufaka i-electroplating ezinokuthenjwa zokufaka i-wafer bumping, iileya zokusasaza ngokutsha, i-copper plating, i-nickel plating, i-gold plating, i-MEMS, i-compound semiconductor, kunye nemveliso yokupakisha ephucukileyo.
Esi sixhobo senzelwe ukucutshungulwa okumanzi okulawulwayo apho ubukhulu bentsimbi, ukunamathela, umgangatho womphezulu, kunye nokuphindaphinda kwenkqubo kubalulekile kwiziphumo zokugqibela zemveliso.
Le nkqubo ibeka iileya zesinyithi kwii-wafers, ii-substrates, okanye ii-microstructures ngokusebenzisa i-electrochemical plating. Ixhasa iinkqubo apho kufuneka khona ubukhulu obulawulwayo, imeko yomphezulu ococekileyo, kunye nokubekwa okuzinzileyo.
Umgangatho wokubeka iplati uxhomekeke kwikhemikhali yokuhlamba, ukuhluzwa, ubushushu, ukusasazwa kwamandla, ukudibana kwe-wafer, kunye nokhuseleko lokuphatha. Inkqubo efanelekileyo inceda ukugcina iimeko zenkqubo ezizinzileyo ngexesha lokuveliswa.
Sinikezela ngezixhobo ezikhoyo ezixhomekeke kubungakanani be-wafer yakho, isinyithi sokugquma, usetyenziso lwenkqubo, amandla okuvelisa, ixesha lokuhambisa, kunye nemeko yomatshini owuthandayo.
Hlola izixhobo ezikhoyo zokupakisha ezikumgangatho we-wafer, i-copper plating, i-nickel plating, i-gold plating, i-MEMS, i-compound semiconductor, kunye nezicelo zokupakisha eziphambili.
I-ACM Research's ULTRA ECP app-p yinkqubo yokuplata ethe tyaba ekumgangatho wepaneli.
Jonga isitokhwe kunye nexabiso
Inkqubo ye-Applied Materials' Raider® Edge ECD sisixhobo se-electrochemical deposition (ECD) esisetyenziswa kwi-semiconductor manufacturing...
Jonga isitokhwe kunye nexabiso
I-Nokota™ ECD yezixhobo ezisetyenzisiweyo yinkqubo yokufaka iikhemikhali ze-electrochemical enemveliso ephezulu eyenzelwe ngokukodwa...
Jonga isitokhwe kunye nexabisoKwimveliso yenqanaba le-wafer, umgangatho we-electroplating uchaphazela ngokuthe ngqo ukupakishwa okusezantsi, ukusebenza kombane, iziphumo zovavanyo, kunye nemveliso ephumayo.
Inkqubo ethembekileyo inceda ekunciphiseni iziphumo zokuplata ezingazinzanga kwaye ixhasa imveliso ecocekileyo nephindaphindwayo.
Le nkqubo idibanisa ukulungiswa kwe-wafer, iimeko zokuhlamba ezilawulwayo, ukufakwa kombane, ukuhlamba, ukomisa, kunye nokulungela ukuhlolwa.
I-wafer iyacocwa, ibekwe iipateni, ityalwe imbewu, kwaye ilungiswe ngaphambi kokuba ingene kwinyathelo lokufaka ipleyiti.
I-wafer ifakwa kwiseli yenkqubo enoyilo olufanelekileyo lokucinezela, uqhagamshelwano, kunye nolawulo.
Ikhemistri, ukujikeleza kwegazi, ukuhluza, izongezo, kunye nobushushu zilawulwa ukuze kuqinisekiswe uzinzo lwenkqubo.
Umsinga wombane uqhuba ukufakwa kwee-ion zesinyithi ngokweresiphi efunekayo kunye nenjongo yenkqubo.
Emva kokugquma, ii-wafers ziyahlanjwa, zomiswe, zize zilungiselelwe ukuhlolwa okanye inyathelo elilandelayo lokuvelisa.
Iinkqubo ze-electroplating ze-semiconductor zisetyenziswa kwiinkqubo ezininzi zemveliso ezimalunga ne-wafer kunye nezokupakisha.
Isetyenziselwa ukwenza amaqhuma e-solder, iintsika zobhedu, izithintelo ze-nickel, kunye nezakhiwo ezinxulumene noko ze-flip chip kunye ne-wafer-level packaging.
Ixhasa iinkqubo zokwabiwa kwakhona kobhedu kwiipakethe zokukhupha ifeni, ukuhanjiswa kwe-wafer kwinqanaba le-wafer, kunye nezakhiwo zokudibanisa ezinoxinano oluphezulu.
Isetyenziselwa ukwakha izakhiwo ezincinci zesinyithi, iimpawu zesensor, iileya zoqhagamshelwano, ii-actuators, kunye nezinye izakhiwo ezisebenzayo zezixhobo ze-MEMS.
Ixhasa iinkqubo zokugquma ezenziwe ngesinyithi kunye nokupakisha ezinxulumene nokupakisha izixhobo zeGaN, GaAs, SiC, kunye nezixhobo ze-semiconductor zamandla.
Inkqubo ye-electroplating ye-semiconductor kufuneka ixhase umgangatho wokubekwa olawulwayo, ukuphathwa kwe-wafer ekhuselekileyo, kunye neemeko zenkqubo yokumanzi ezizinzileyo.
Inceda ukugcina ukubekwa okufanayo kwiindawo ze-wafer nakwiindawo ezineepateni.
Ulawulo lwamandla oluzinzileyo luxhasa ukuplatwa okuphindaphindwayo kwiipateni ezahlukeneyo ze-wafer kunye neeleya zesinyithi.
Ukuhluza kunye nokujikeleza kwegazi kunceda ekunciphiseni amasuntswana, imingxunya, amaqhuqhuva, kunye nemiphezulu yeplati erhabaxa.
Ulawulo lobushushu bebhafu lunceda ukugcina izinga lokubeka ipleyiti, indlela yokongeza, kunye nokuhambelana kwenkqubo.
Ukulayisha, ukubamba, kunye nokuhambisa ngendlela efanelekileyo kunceda ekunciphiseni umonakalo we-wafer kunye nomngcipheko wokungcola.
Ixhasa iintsimbi ezahlukeneyo zokuplata, ubungakanani be-wafer, iimfuno zemveliso, kunye namanqanaba okwenziwa ngokuzenzekelayo.
Ulawulo olungcono lwezixhobo lunceda ekuphuculeni ukuhambelana kweplati kwaye luxhasa imveliso ethambileyo esezantsi.
Ukuthenga izixhobo ze-semiconductor kufuna okungaphezulu kwexabiso eliqingqiweyo. Udinga ukhetho olufanelekileyo lomatshini, unxibelelwano olucacileyo, ukujonga imeko yezixhobo, inkxaso yokuhanjiswa, kunye nokusebenza kakuhle kokufumana izixhobo.
Sinceda abathengi bafumane izixhobo ezifanelekileyo ngokusekelwe kwiimfuno zokwenyani zemveliso, uhlahlo-lwabiwo mali, kunye nexesha elibekiweyo.
Jonga isitokhwe kunye nexabisoSinceda ekujongeni iinkqubo ze-electroplating ze-semiconductor ezintsha, ezisetyenzisiweyo, nezihlaziyiweyo ezikhoyo ngokweemfuno zeprojekthi yakho.
Sifanisa izixhobo ngokobungakanani be-wafer, isinyithi sokugquma, ithagethi yobukhulu, umthamo wemveliso, kunye nokusetyenziswa kwenkqubo.
Oomatshini abafumanekayo banokujongwa ngaphambi kokuba bathunyelwe ukunceda ukunciphisa umngcipheko wokuthenga.
Siphendula ngokukhawuleza kwimibuzo yoomatshini kwaye sikuncede ujonge izixhobo ezifanelekileyo ngokufanelekileyo.
Sixhasa ukupakisha, uxwebhu lokuthumela ngaphandle, kunye nokuthunyelwa kwamanye amazwe kubathengi bamanye amazwe.
Izixhobo ezinxulumene nokucutshungulwa kwe-wafer, ukupakishwa, ukubopha, ukuhlolwa, kunye neenkqubo zokumanzi nazo zinokufunyanwa kunye.
Inkqubo efanelekileyo yokufakelwa i-electroplating ixhomekeke kubungakanani be-wafer yakho, isinyithi sokufakelwa, injongo yenkqubo, injongo efanayo, iimfuno zeekhemikhali, inqanaba lokusebenza ngokuzenzekelayo, kunye nomthamo wemveliso.
Sithumelele iinkcukacha zakho zenkqubo, kwaye siya kukunceda ukujonga iindlela ezifanelekileyo zezixhobo.
Jonga isitokhwe kunye nexabisoZizixhobo zenkqubo yokumanzisa ezisetyenziselwa ukufaka iileya zesinyithi ezilawulwayo kwiiwafers, iisubstrates, okanye izakhiwo ezincinci ngokusebenzisa i-electrochemical plating.
Ingasetyenziselwa ukugquma i-wafer, iileya zokusasazwa ngokutsha, i-copper plating, i-nickel plating, i-gold plating, i-MEMS, izixhobo ze-compound semiconductor, kunye nokupakisha okuphucukileyo.
Iintsimbi zokuplata eziqhelekileyo ziquka ubhedu, i-nickel, igolide, i-tin, izinto zokunyibilikisa, kunye nezinye iintsimbi ezikhethekileyo kuxhomekeke kwiimfuno zenkqubo.
Nceda unikeze ubungakanani be-wafer, isinyithi sokugquma, ubukhulu bento ekujoliswe kuyo, indlela esetyenziswa ngayo inkqubo, umthamo ofunekayo, imeko yomatshini owuthandayo, kunye neemfuno zesakhiwo ukuba ziyafumaneka.
Ewe. Singakunceda ukujonga iindlela ezikhoyo zezixhobo ezitsha, ezisetyenzisiweyo, nezihlaziyiweyo ngokusekelwe kuhlahlo-lwabiwo mali lwakho kunye nexesha leprojekthi.
Ewe. Singakunceda ukuphonononga iimfuno ezisisiseko ezifana nobukhulu be-wafer, uhlobo lwesinyithi, usetyenziso, inqanaba lokusebenza ngokuzenzekelayo, kunye nemeko yesixhobo ngaphambi kokuba sicebise iindlela zokukhetha.
Ewe. Sixhasa ukupakisha, uxwebhu lokuthumela ngaphandle, kunye nokuthunyelwa kwamanye amazwe kubathengi bezixhobo baphesheya.
Ixabiso lixhomekeke kulungiselelo lwenkqubo, ubungakanani be-wafer, amandla enkqubo, inqanaba lokuzenzekela, imeko yomatshini, uphawu, kunye nokufumaneka kwayo.
Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?
Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukusungulwa kweTshayina ngetekhnoloji ye-cutting-edge. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".
IinkcukachaQhagamshelana nengcali yokuthengisa
Finyelela kwiqela lethu lezentengiso ukuze ujonge izisombululo ezilungiselelweyo ezihlangabezana ngokugqibeleleyo neemfuno zeshishini lakho kwaye ulungise nayiphi na imibuzo onokuba unayo.
© Onke Amalungelo Agciniwe. Inkxaso yobuGcisa:TiaoQingCMS
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