Izixhobo zethu zokudibanisa iintambo zenzelwe ukuchaneka, isantya, kunye nokuguquguquka, ukuvumela abavelisi ukuba baphucule imveliso ngelixa begcina imigangatho ephezulu yomgangatho. Nokuba uvelisa i-electronics yabathengi, izinto zemoto, okanye izinzwa zamashishini, izixhobo zethu ziqinisekisa ukusebenza okuphezulu kunye nokuthembeka.
I-ASM die bonder AD819 sisixhobo sokupakisha se-semiconductor ephucukileyo esetyenziselwa ukubeka ngokuchanekileyo iitshiphusi kwii-substrates kwaye sisixhobo esiphambili kwinkqubo yebhondi yokufa.
I-ASM AD800 lumsebenzi ophezulu oluzenzekelayo ngokupheleleyo oluzenzekelayo olunemisebenzi emininzi ephucukileyo kunye neempawu
Umgaqo osebenzayo we-ASM die bonder AD50Pro ikakhulu ubandakanya ukufudumeza, ukuqengqeleka, inkqubo yokulawula kunye nezixhobo ezincedisayo.
I-AD420XL ibonelela ngesantya esiphezulu, ukuchaneka okuphezulu kunye nokubeka izisombululo ze-Mini ze-LED COB zobukhulu obukhulu be-LCD BLUs (ye-dimming yendawo) kunye ne-ultra-fine pitch displays ye-LED, enobuchule obuncinci bokuphatha i-chip, ...
I-SD8312 ye-ASMPT's SD8312 ezenzekelayo ezenzekelayo ngokupheleleyo inkqubo ye-solder die bonder sisixhobo esiphucukileyo esenzelwe ukusetyenzwa kwe-wafer ye-intshi eyi-12, enobuchule obuphezulu bokwenza isakhelo kunye nebhondi ekhokelela ekufeni...
Iinkcazo kunye nemilinganiselo ye-ASMPT yenkqubo yokudibanisa ukufa ngokuzenzekelayo zezi zilandelayo: Imilinganiselo: W x D x H 1,970 x 1,350 x 2,190 mm
I-AD838l kunye ne-disk bonding ezenzekelayo ngokupheleleyo kunye ne-flip chip system sisixhobo se-bonding ephezulu esichanekileyo kwaye sisebenza ngokufanelekileyo, sisetyenziselwa imveliso ezenzekelayo yokupakishwa kwe-semiconductor...
Iimpawu ● Isizukulwana esitsha somthamo ophezulu we-AD8312 uthotho lwe-die bonders lumisela imigangatho emitsha kushishino ● uyilo olusetyenzwa ngokubanzi, olulungele ukusetyenzwa kwezakhelo zelothe ezinoxinano oluphezulu ● Ifumaneka kwiindawo ezininzi...
Iimpawu●Ukuchaneka ± 3 µm @ 3s●Ukukhupha iglu/ijetting ukwenzela ukuba kudityaniswe idie ●Imvelaphi yezinto ezilandelekayo zolawulo oluphuculweyo lomgangatho ● Uyilo lwentloko ethengiswayo enelungelo elilodwa lomenzi wechiza ● Ukuya kuthi ga ku-8” x 8” Ukuphathwa kwesubstrate ● Iinketho ●...
Iimpawu●Uchaneka ± 12.5 µm @ 3s●Iyakwazi ukusetyenzwa ngokuthe ngqo ii-substrates ze-ceramic●Inkqubo egqwesileyo kunye noyilo lwemodyuli●Ulawulo oluzimeleyo lokubuyiswa kwekristale kunye neenkqubo zecrystal bonding ●Ixhotyiswe nge-IQC syst...
I-MRSI Systems Die Bonder yimveliso yeQela le-Mycronic, eligxile ekuboneleleni ngokuzenzekela ngokupheleleyo, ukuchaneka okuphezulu, iinkqubo eziguquguqukayo zokufa, ezisetyenziswa ngokubanzi kwi-optoelectroni...
I-Besi Datacon 8800 ngumatshini ophucukileyo we-chip bonding, osetyenziswa ikakhulu kwi-2.5D kunye ne-3D yeteknoloji yokupakisha, ngakumbi i-TSV (Nge-Silicon Via) izicelo.
Abaxhasi bethu bonke baphuma kwiinkampani ezinkulu ezichaziweyo ngokubanzi.
Amanqaku oBuchule be-SMT
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Die Bonding Equipment FAQ
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I-Fuji smt mounter isetyenziswa kakhulu kumbane
Nangona nezixhobo eziqhubekileyo ezifuna ukugcina nokukhuthala okuqhelekileyo ukuqinisekisa ukusebenza kwexesha elide
KwiNkqubo yenkqubo yezenzo zeelektroniki, izixhobo zeSMT
KwiNkqubo yenkqubo yezenzo zeelektroniki, ukhetha umatshini okunene we SMT
Qhagamshelana nengcali yokuthengisa
Finyelela kwiqela lethu lezentengiso ukuze ujonge izisombululo ezilungiselelweyo ezihlangabezana ngokugqibeleleyo neemfuno zeshishini lakho kwaye ulungise nayiphi na imibuzo onokuba unayo.
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