Semiconductor equipment
Fully automatic ASMPT die bonding system AD832i

I-ASMPT ezenzekelayo ngokupheleleyo inkqubo yokudibanisa i-AD832i

Iinkcazo kunye nemilinganiselo ye-ASMPT yenkqubo yokudibanisa ukufa ngokuzenzekelayo zezi zilandelayo: Imilinganiselo: W x D x H 1,970 x 1,350 x 2,190 mm

Ilizwe:Isetyenzisiwe Ikhona: yiba Iwaranti: ubonelelo
Iinkcukacha

Inkqubo ezenzekelayo ye-ASMPT die bonder ye-AD832I yi-digital ye-speed high-speed yesilivere yokucola i-die bonder eyenzelwe izixhobo ezincinci kwaye ikwazi ukuphatha iintlobo ngeentlobo zezixhobo ezifana ne-QFN, SOT, SOIC, SOP, njl. :

AD832i

I-Ultra-micro micro dispensing capability: Iyakwazi ukuphatha ama-wafers amancinci, alungele ukuphatha isakhelo esikhokelayo.

Uyilo lwentloko ye-welding ye-patent: Uyilo lwentloko ye-welding ye-patent iphucula ukuzinza kunye nokusebenza kakuhle kwe-welding.

Inkqubo yokulahla iglue kabini: Ixhotyiswe ngenkqubo yokulahla iglue kabini, inokulawula ngcono ubungakanani kunye nokuchaneka kweglue esetyenzisiweyo.

Amanani omzobo exesha langempela: Inkqubo yamva nje ye-IQC ibonelela ngeenkcukacha-manani zexesha lokwenyani kubasebenzisi ukujonga nokulungelelanisa inkqubo yokuvelisa.

Ezi mpawu zenza i-AD832i iqhube kakuhle kwi-8-intshi (200 mm) inkqubo yokufa kwebhondi, ngokukodwa ifanelekileyo kwiindawo zokuvelisa ezifuna ukusebenza kakuhle kunye nokuchaneka okuphezulu.

Ngaba ukulungele ukonyusa ishishini lakho ngeGeekvalue?

Yandisa ubuchule kunye namava eGeekvalue ukunyusa uphawu lwakho luye kwinqanaba elilandelayo.

Qhagamshelana nengcali yokuthengisa

Finyelela kwiqela lethu lezentengiso ukuze ujonge izisombululo ezilungiselelweyo ezihlangabezana ngokugqibeleleyo neemfuno zeshishini lakho kwaye ulungise nayiphi na imibuzo onokuba unayo.

Isicelo sokuthengisa

Silandele

Hlala uqhagamshelene nathi ukuze ufumane izinto ezintsha zamva nje, izibonelelo ezikhethekileyo, kunye nokuqonda okuya kuphakamisa ishishini lakho ukuya kwinqanaba elilandelayo.

kfweixin

Skena ukongeza i-WeChat

Cela iQuote