Semiconductor equipment
Fully automatic ASMPT die bonding system AD832i

Enkola ya ASMPT die bonding eya otomatiki mu bujjuvu AD832i

Ebipimo n’ebipimo by’enkola ya ASMPT fully automatic die bonding system bye bino wammanga:Ebipimo: W x D x H 1,970 x 1,350 x 2,190 mm

State:Ekozesebwa In stock:have supply
Ebikwata ku ddyo

Enkola ya ASMPT die bonder eya fully automatic AD832I ye fully automatic high-speed silver paste die bonder ekoleddwa ku byuma ebitono era nga esobola okukwata ebika by’ebyuma eby’enjawulo nga QFN, SOT, SOIC, SOP, n’ebirala.Erina ebintu ebikulu bino wammanga :

AD832i

Obusobozi bw’okugaba ultra-micro: Esobola okukwata wafers entono ennyo, esaanira okukwata fuleemu y’omusulo eya density enkulu.

Dizayini y’omutwe gw’okuweta eriko patent: Dizayini y’omutwe gw’okuweta eriko patent erongoosa obutebenkevu n’obulungi bw’okuweta.

Enkola ya dual glue drop system: Nga eriko enkola ya dual glue drop system, esobola bulungi okufuga obungi n’obutuufu bwa glue ekozesebwa.

Ebibalo eby’ebifaananyi mu kiseera ekituufu: Enkola ya IQC eyasembyeyo egaba ebibalo eby’ebifaananyi mu kiseera ekituufu abakozesa okulondoola n’okutereeza enkola y’okufulumya.

Ebintu bino bifuula AD832i okukola obulungi mu nkola ya die bond eya yinsi 8 (mm 200), naddala esaanira embeera z’okufulumya ezeetaaga obulungi obw’amaanyi n’obutuufu obw’amaanyi.

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