BESI ESEC 2100 hS BESI Omusipi gw’okufa

Ekitundu ku Famire ya BESI Die Bonder

ESEC 2100 hS ya kkampuni ekulembedde mu makoleroBESI Omukwasi wa Bonderproduct portfolio, ekika kya semiconductor die attach platforms ezimanyiddwa mu nsi yonna olw’obwesigwa bwazo, throughput, n’okutebenkera kw’okufulumya okumala ebbanga eddene.

Ebirala ebimanyiddwa ennyo mu BESI die bonding solutions mulimu...Datacon 8800 FC EKITUNDU EKYOKUYIGAku sipiidi ya flip chip okukuŋŋaanya n’oku...Datacon 8800 CHAMEOku nkola z’okupakinga ez’omulembe.

Proven High-Speed ​​Die Bonder for okupakinga kwa Semiconductor okw’obunene obw’amaanyi

BESI ESEC 2100 hS y’emu ku nnyonyi ezisinga okukozesebwa ennyo mu bifo ebipakiddwamu semikondokita mu nsi yonna. Ekoleddwa okusobola okukola obulungi, okukola okutebenkevu, n’okusaasaanya ssente entono mu bwannannyini, esigala nga ye nkola esinga okwagalibwa aba OSATs, IDMs, n’abakola semiconductor abakola obukadde n’obukadde bwa packages buli mwezi.

Nga egatta sipiidi ey’enjawulo, obwesigwa obukakasibwa, n’obusobozi bw’enkola obukyukakyuka, ESEC 2100 hS efuuse eky’okugonjoola eky’omutindo gw’okukozesa epoxy die attach mu byuma by’emmotoka, semiconductor z’amaanyi, ebyuma by’amakolero, ebintu ebijjukiza, sensa, n’ebyuma ebikozesebwa.

Oba ogaziya ku busobozi bw’okufulumya, okukyusa ebyuma eby’edda, oba ng’onoonya die bonder erongooseddwa etali ya ssente nnyingi, ESEC 2100 hS esigala nga y’emu ku nkola ezisinga okwesigika ez’okufulumya eziriwo ennaku zino.

Lwaki Olonda ESEC 2100 hS?

Ekakasiddwa mu Semiconductor Manufacturing Mu Nsi Yonna

ESEC 2100 hS emaze emyaka ng’ekozesebwa bulungi mu bifo ebikuŋŋaanya semikondokita okwetoloola ensi yonna. Dizayini yaayo eya pulatifomu enkuze ekakasiddwa okuyita mu bukadde n’obukadde bw’essaawa z’okufulumya, ekigifudde emu ku nsimbi ezisinga obukuumi mu mirimu gy’okupakinga semikondokita.

Okuyita mu nkola ey’enjawulo

Nga emisinde gy’okufulumya gituuka ku 18,500 UPH, ESEC 2100 hS etuwa ebivaamu eby’enjawulo eri embeera z’amakolero ez’amaanyi.

Endowooza yaayo ey’entambula ya Phi-Y ey’obuyiiya ekendeeza nnyo ku budde bw’okutambula wakati w’emirimu gy’okulonda n’okuteeka, okutumbula enkozesa y’ebyuma n’okufulumya.

Ensimbi Ennungi ennyo ey'Obwannannyini

Ebikozesebwa ebingi, okukyusakyusa amangu ebintu, okwesigamizibwa okw’ekiseera ekiwanvu, n’enkola z’okulongoosa mu modulo zigatta wamu okutuusa ekimu ku bikozesebwa mu kukola ebintu ebisinga obutono mu makolero ku buli yuniti.

Sipeeya Ennyangu n'Obuwagizi bwa Yinginiya

Olw’okuba omusingi gwayo omunene oguteekeddwa mu nsi yonna, sipeeya, ebikozesebwa, enkola y’okulaba, emitwe gya bond, n’obuyambi obw’ekikugu bisigala nga bifunibwa mangu, ekiyamba abakola okukendeeza ku biseera by’okuyimirira n’okwongera ku bulamu bw’ebyuma.

Enkozesa eya bulijjo

ESEC 2100 hS ewagira enkola nnyingi ez’okupakinga semikondokita enkulu.

Ebyuma bya Semiconductor Amaanyi

• MOSFET

• IGBT

• Module z’Amaanyi

• ICs z’okuddukanya amaanyi

Ebyuma ebikozesebwa mu mmotoka

• MCU y'emmotoka

• Ddereeva IC

• Sensulo z’emmotoka

• Modules ezifuga amaanyi

Ebyuma ebikozesebwa mu byuma bikalimagezi

• Ebyuma Ebijjukira

• Ebitundu bya RF

• Abavuzi ba LED

• IC z’empuliziganya

Ebyuma ebikozesebwa mu makolero

• Ebyuma bya Analog

• Abafuga amakolero

• Sensulo ezigezigezi

• Module z’amaanyi g’amakolero

Ku bakola ebintu abagaziya okusukka enkola eza bulijjo ez’okuyunga ku die, ebigonjoola byaffe ebya Flip Chip Bonder biwa obusobozi obw’omulembe obw’okupakinga n’okuyunga density ey’oku ntikko eri ebintu bya semiconductor eby’omulembe oguddako.

Layini nnyingi ezikuŋŋaanya semikondokita nazo zikola enkola za Wire Bonder ku mabbali g’ebyuma ebisiba die, ekifuula okukwatagana kw’enkola n’okutebenkera kw’okufulumya ebintu ebikulu nga balonda ebyuma.

Ng’ekimu ku bitundu byaffe ebijjuvu ebya BESI Die Bonder, ESEC 2100 hS ekyali emu ku nkola ezisinga okukakasibwa era eyeesigika ez’okupakinga ebintu mu bungi obw’amaanyi eziriwo ennaku zino.

Okugatta enkola y’okukuŋŋaanya semiconductor

ESEC 2100 hS etera okuteekebwa mu nkola ng’ekitundu ku layini y’okukuŋŋaanya semikondokita enzijuvu. Oluvannyumaokufa attach, ebyuma bitera okugenda mu nkola z’okupakinga eziddirira nga okusiba waya, okubumba, okusengejja, n’okugezesa okusembayo.

Ku kupakinga kwa semiconductor okw’ekinnansi, abakola batera okugatta ESEC 2100 hS n’omutindo ogwa wagguluEkiyungo kya Wayaenkola okutondawo layini z’okufulumya ezitebenkedde era ezitasaasaanya ssente nnyingi ezisobola okukola ku byetaago by’okukola ebintu ebinene.

Tekinologiya Omukulu

Endowooza y’Entambula ya Phi-Y

ESEC 2100 hS ekozesa enzimba ya BESI ey’obwannannyini eya Phi-Y motion architecture.

Okwawukanako ne die bonders ez’ennono ezisinziira ku ntambula ya linear yokka, enkola ya Phi-Y egatta entambula ey’enzitowerera n’ey’ennyiriri okukendeeza ennyo ku budde bw’okutambula nga tolina ky’okola n’okulongoosa obulungi bw’okufulumya.

Enzimba ya Pick-and-Place etangaala & Enkalu

Ensengeka y’ekyuma kino etali nnyangu naye nga nkalu nnyo mu kulonda n’okuteeka esobozesa okutebenkera okw’enjawulo okw’amaanyi mu kiseera ky’okukola ku sipiidi ey’amaanyi.

Dizayini eno ekakasa omulimu omutuufu ogw’okuteeka ate ng’ekuuma obusobozi obusingako.

Omufuzi w’entambula ey’omulembe

Enhanced motion trajectory optimization ekendeeza ku vibration era ekakasa smooth die placement ne ku peak operating speeds.

Enkola y’okukwata substrate mu ngeri ya modulo

Enkola ezikyukakyuka ez’okukwata substrate zisobozesa abakola okutegeka enkola eno ku bika by’ebipapula eby’enjawulo n’ebyetaago by’okufulumya.

Ebikulu Ebirimu

Okuyita mu nkola ya Ultra-High

• Okutuuka ku 18,500 UPH

• 120 ms obudde bw’enzirukanya

• Erongooseddwa okusobola okufulumya mu bungi obw’amaanyi

Obutuufu bw’okuteekebwa waggulu

• Obutuufu obw’omutindo: 20 μm @ 3 Sigma

• Omutindo gw’obutuufu obw’amaanyi: 15 μm @ 3 Sigma

Obusobozi bw’Enkola Ekyukakyuka

Ebiwagira:

• Epoxy Die Okugattako

• Okukwatagana mu ngeri ey’ekika kya Eutectic

• Okunyweza ebbugumu (thermocompression Bonding).

• Okusoda mu kuddamu okukulukuta

Enkola y’okulaba ey’obulungi obw’amaanyi

Enkola z’okulaba ez’obulungi obw’amaanyi ezisobola okwesalirawo zilongoosa okukwataganya die n’okuteeka obutuufu ku nkola ezisaba.

Module y’okugaba ebintu emirundi ebiri

Dual independent dispensing axes zongera throughput nga zikuuma enkola consistency.

Okulondoola Enkola mu kiseera ekituufu

Abaddukanya emirimu basobola okulondoola:

• Embeera ya wafer

• Embeera ya leadframe

• Embeera ya Strip

• Embeera ya Hopper

• Enkola y’okufulumya ebintu

mu kiseera ekituufu.

Ebikwata ku by’ekikugu

ESEC 2100 hS ne Datacon 8800 FC QUANTUM, omupiira gwa 2100 hS

Emigaso eri abakola Semiconductor

Okwongera ku busobozi bw’okufulumya ebintu

Okutuuka ku bifulumizibwa eby’oku ntikko ennyo nga tosaddaaka butuufu bw’okuteeka.

Okukendeeza ku ssente ezisaasaanyizibwa mu kukola ebintu

Okukendeeza ku ssente z’okufulumya buli yuniti nga tuyita mu kukola otoma ku sipiidi n’okufuga enkola ennungi.

Okulongoosa Enkozesa y’Ebyuma

Okukyusa amangu n’okuddukanya enkola y’emmere biyamba obudde bw’okukola n’okukyukakyuka mu kukola.

Kikendeeze ku budde bw’okuyimirira

Sipeeya omungi okubeerawo n’obwesigwa bwa pulatifomu obukakasibwa bikendeeza ku kutaataaganyizibwa okutasuubirwa.

Future-Proof Ensimbi Yo

Enzimba ya modulo ewagira okulongoosa mu biseera eby’omu maaso n’okukyusa ebyetaago by’okufulumya.

Ebyuma Ebisangibwawo

Tuwaayo:

• Eddaabiriziddwa ESEC 2100 hS

• Enkola Ezeetegefu Okukola Ebigezeseddwa Mu bujjuvu

• Obuwagizi bw'okussaawo ebyuma

• Obuyambi mu kulongoosa enkola

• Okugaba Sipeeya

• Empeereza y’okuddaabiriza okuziyiza

• Enkola y'okusindika eby'amaguzi mu nsi yonna

• Obuwagizi mu kutendeka eby’ekikugu

Enkola zonna zikeberebwa mu bujjuvu, okupima, n’okukakasa omulimu nga tezinnasindikibwa.

Okugaziya Ebipakiddwa mu biseera eby’omu maaso

Wadde nga ESEC 2100 hS okusinga ekoleddwa ku nkola za epoxy die attach processes, abakola bangi okukkakkana nga bagaziye mu tekinologiya ow’omulembe ow’okupakinga nga yeetaaga interconnect density eya waggulu n’ebigere ebitono eby’okupakinga.

Ku nkola zino, eziweereddwayoFlip Chip Bonder nga bwe kiriplatforms ziwa obusobozi bw’okuteeka die face-down obusaanira okupakinga semiconductor okw’omulembe, okugatta heterogeneous, n’ebintu eby’amasannyalaze eby’omulembe oguddako.