BESI ESEC 2100 hS BESI Die Bonder

Inxalenye yoSapho lwe-BESI Die Bonder

I-ESEC 2100 hS yeyenkampani ekhokelayo kushishinoI-BESI The Bonderipotifoliyo yemveliso, uluhlu lweeplatifomu ze-semiconductor die attach ezaziwa kwihlabathi liphela ngokuthembeka kwazo, ukuveliswa kwazo, kunye nokuzinza kwemveliso yexesha elide.

Ezinye izisombululo ze-BESI die bonding ezidumileyo ziqukaI-Datacon 8800 FC QUANTUMukuhlanganisa iitshiphusi ezikhawulezayo kunyeI-Datacon 8800 CHAMEOkwizicelo zokupakisha eziphambili.

I-High-Speed ​​​​Die Bonder eqinisekisiweyo yokuPakisha i-High-Volume Semiconductor

I-BESI ESEC 2100 hS yenye yezona bondi ze-die ezikhawulezayo ezisetyenziswa kakhulu kwiindawo zokupakisha ze-semiconductor kwihlabathi liphela. Yenzelwe ukusetyenziswa okuphezulu, ukusebenza okuzinzileyo, kunye neendleko eziphantsi zobunini, ihlala iqonga elithandwayo kwii-OSAT, ii-IDM, kunye nabavelisi be-semiconductor abavelisa izigidi zeepakeji inyanga nenyanga.

Ukudibanisa isantya esibalaseleyo, ukuthembeka okuqinisekisiweyo, kunye nokukwazi ukusebenza ngokuguquguqukayo, i-ESEC 2100 hS ibe sisisombululo esifanelekileyo kwizicelo ze-epoxy die attach kuzo zonke izixhobo ze-elektroniki zeemoto, ii-power semiconductors, izixhobo zoshishino, iimveliso zememori, ii-sensors, kunye ne-consumer electronics.

Nokuba wandisa amandla okuvelisa, utshintsha izixhobo ezindala, okanye ufuna i-die bonder ehlaziyiweyo nengabizi kakhulu, i-ESEC 2100 hS iseyeyona platifomu yemveliso ethembekileyo ekhoyo namhlanje.

Kutheni ukhetha i-ESEC 2100 hS?

Ingqinwe kwiMveliso yeSemiconductor kwihlabathi liphela

I-ESEC 2100 hS isasazwe ngempumelelo kwizityalo zokuhlanganisa ii-semiconductor kwihlabathi liphela kangangeminyaka. Uyilo lwayo lweqonga elivuthiweyo luye lwaqinisekiswa ngezigidi zeeyure zemveliso, nto leyo eyenza ukuba ibe lolona tyalo-mali lukhuselekileyo kwimisebenzi yokupakisha ii-semiconductor.

Umphumo obalaseleyo

Njengoko isantya semveliso sifikelela kwi-18,500 UPH, i-ESEC 2100 hS inika imveliso ebalaseleyo kwiindawo zokwenza izinto ezinomthamo omkhulu.

Ingcamango yayo entsha yentshukumo yePhi-Y inciphisa kakhulu ixesha lokuhamba phakathi kokusebenza kokukhetha nokubeka, nto leyo eyenza ukuba ukusetyenziswa komatshini kunye nemveliso kube bhetele.

Ixabiso Elihle Kakhulu Lobunini

Ukuveliswa okuphezulu, utshintsho olukhawulezayo lwemveliso, ukuthembeka kwexesha elide, kunye neendlela zokuphucula ezihlanganisiweyo zidibanisa ukubonelela ngesisombululo semveliso esingabizi kakhulu kushishino ngeyunithi nganye.

Inkxaso yeCandelo eliSetyenzisiweyo kunye noBunjineli

Ngenxa yesiseko sayo esikhulu esifakelweyo kwihlabathi liphela, iinxalenye ezingasetyenziswayo, izixhobo zokusebenza, iinkqubo zokubona, iintloko zeebhondi, kunye nenkxaso yobugcisa zihlala zifumaneka ngokulula, zinceda abavelisi ukunciphisa ixesha lokungasebenzi kwaye bandise ubomi bezixhobo.

Usetyenziso oluqhelekileyo

I-ESEC 2100 hS ixhasa uluhlu olubanzi lwezicelo eziphambili zokupakisha ze-semiconductor.

Izixhobo ze-Power Semiconductor

• I-MOSFET

• I-IGBT

• Iimodyuli zamandla

• Ii-IC zoLawulo lwaMandla

I-Automotive Electronics

• I-MCU yeeMoto

• Umqhubi we-IC

• Izinzwa zeeMoto

• Iimodyuli zoLawulo lwaMandla

I-Electronics yabathengi

• Izixhobo zeMemori

• Izixhobo zeRF

• Abaqhubi be-LED

• Ii-IC zoNxibelelwano

Izixhobo zombane zoshishino

• Izixhobo ze-Analog

• Abalawuli bezeMizi-mveliso

• Izinzwa ezikrelekrele

• Iimodyuli zamandla emizi-mveliso

Kubavelisi abanda ngaphaya kweenkqubo ze-die attach eziqhelekileyo, izisombululo zethu ze-Flip Chip Bonder zibonelela ngobuchule obuphezulu bokupakisha kunye noxinano oluphezulu lokudibanisa iimveliso ze-semiconductor zesizukulwana esilandelayo.

Iintambo ezininzi ze-semiconductor assembly zikwasebenzisa iinkqubo ze-Wire Bonder kunye nezixhobo ze-die bonding, nto leyo eyenza ukuhambelana kwenkqubo kunye nokuzinza kwemveliso kube zizinto ezibalulekileyo xa kukhethwa izixhobo.

Njengenxalenye yepotifoliyo yethu epheleleyo ye-BESI Die Bonder, i-ESEC 2100 hS iseyeyona platifomu yokupakisha eqinisekisiweyo nethembekileyo ekhoyo namhlanje.

Ukuhlanganiswa kweNkqubo yeNdibano yeSemiconductor

I-ESEC 2100 hS idla ngokusetyenziswa njengenxalenye yomgca opheleleyo wendibano ye-semiconductor.i-die attach, izixhobo zihlala zitshintshela kwiinkqubo zokupakisha ezilandelayo ezifana nokubopha ucingo, ukubumba, ukubumba, kunye novavanyo lokugqibela.

Kwiphakheji ye-semiconductor yendabuko, abavelisi badla ngokudibanisa i-ESEC 2100 hS kunye nokusebenza okuphezulu.I-Wire Bonderiinkqubo zokwenza imigca yemveliso ezinzileyo nengabizi kakhulu ekwaziyo ukujongana neemfuno zokuvelisa ezinkulu.

Ubuchwepheshe obuphambili

Ingcamango yeNtsingiselo yePhi-Y

I-ESEC 2100 hS isebenzisa uyilo lwentshukumo lwe-Phi-Y oluyi-BESI.

Ngokungafaniyo nee-die bonds zemveli ezixhomekeke kuphela kwintshukumo ethe tye, inkqubo yePhi-Y idibanisa intshukumo ejikelezayo nethe tye ukunciphisa kakhulu ixesha lokuhamba ngaphandle kwemisebenzi kunye nokuphucula ukusebenza kakuhle kwemveliso.

Ulwakhiwo lweSithuba sokuKhetha nokuHlala esiKhanyayo nesiQiqileyo

Ulwakhiwo lomatshini olukhaphukhaphu kodwa oluqinileyo luvumela uzinzo oluguquguqukayo olungaqhelekanga ngexesha lokusebenza ngesantya esiphezulu.

Olu yilo luqinisekisa ukusebenza ngokuchanekileyo kokubekwa ngelixa lugcina umbane ophezulu.

Umlawuli weNtshukumo oPhambili

Ukuphuculwa kwendlela yokuhamba kunciphisa ukungcangcazela kwaye kuqinisekisa ukubekwa kakuhle kwe-die nokuba kukwisantya esiphezulu sokusebenza.

Iqonga loMphathi weSixhobo seModular Substrate

Iindlela zokuphatha i-substrate eziguquguqukayo zivumela abavelisi ukuba bamisele inkqubo kwiintlobo ezahlukeneyo zeepakeji kunye neemfuno zemveliso.

Ezona mpawu

Ukuphuma okuphezulu kakhulu

• Ukuya kuthi ga kwi-18,500 UPH

• Ixesha lomjikelo we-120 ms

• Yenzelwe imveliso enomthamo omkhulu

Ukuchaneka kokubekwa okuphezulu

• Ukuchaneka Okuqhelekileyo: 20 μm @ 3 Sigma

• Imo yokuChaneka okuphezulu: 15 μm @ 3 Sigma

Ubuchule beNkqubo eguquguqukayo

Ixhasa:

• I-Epoxy Die Attachment

• Ukubopha nge-Eutectic

• Ukubopha kweThermocompression

• I-Soldering kwakhona

Inkqubo yoMbono oNgqinisisayo

Iinkqubo zokubona ezikumgangatho ophezulu ezikhethwayo ziphucula ulungelelwaniso lwedayi kunye nokuchaneka kokubekwa kwezicelo ezifuna amandla.

Imodyuli yokukhupha kabini

Ii-axes ezimbini ezizimeleyo zokusasaza ziyandisa i-output ngelixa zigcina ukuhambelana kwenkqubo.

Ukubeka iliso kwinkqubo ngexesha langempela

Abaqhubi banokujonga:

• Imeko ye-wafer

• Isimo se-Leadframe

• Isimo se-Strip

• Isimo seHopper

• Ukusebenza kwemveliso

ngexesha langempela.

IiNgcaciso zobuGcisa

I-ESEC 2100 hS vs iDatacon 8800 FC QUANTUM

Iingenelo zabavelisi be-semiconductor

Yandisa Amandla Emveliso

Fumana imveliso ephezulu kakhulu ngaphandle kokunciphisa ukuchaneka kokubekwa.

Nciphisa iindleko zokuvelisa

Iindleko zemveliso eziphantsi ngeyunithi nganye ngokusebenzisa i-automation ekhawulezayo kunye nolawulo lwenkqubo olusebenzayo.

Phucula Ukusetyenziswa Kwezixhobo

Utshintsho olukhawulezileyo kunye nolawulo lweresiphi kwandisa ixesha lokusebenza kunye nokuguquguquka kwemveliso.

Nciphisa Ixesha Lokungasebenzi

Ukufumaneka okukhulu kwezixhobo ezingasetyenziswayo kunye nokuthembeka kweqonga okuqinisekisiweyo kunciphisa ukuphazamiseka okungalindelekanga.

Ubungqina Bekamva Lotyalo-mali Lwakho

Uyilo lweModular luxhasa ukuphuculwa kwexesha elizayo kunye neemfuno zemveliso ezitshintshayo.

Izixhobo ezikhoyo

Sibonelela:

• I-ESEC 2100 hS ehlaziyiweyo

• Iinkqubo eziLungele imveliso ezivavanyiweyo ngokupheleleyo

• Inkxaso yoFakelo loMatshini

• Uncedo lokuphucula inkqubo

• Unikezelo lwezahlulo eziSpare

• Iinkonzo zoLondolozo loThintelo

• Izisombululo zoThumelo lweHlabathi

• Inkxaso yoQeqesho loBugcisa

Zonke iinkqubo ziyahlolwa ngokupheleleyo, zilinganiswe, kwaye ziqinisekiswe ukusebenza kwazo ngaphambi kokuba zithunyelwe.

Ukwandiswa Kwezinto Zokupakisha Kwixesha Elizayo

Nangona i-ESEC 2100 hS yenzelwe ikakhulu iinkqubo ze-epoxy die attach, abavelisi abaninzi ekugqibeleni bandisa ubuchwepheshe obuphambili bokupakisha obufuna uxinano oluphezulu kunye neenyawo ezincinci zeepakeji.

Kwezi zicelo, zinikezelweI-Flip Chip BonderAmaqonga abonelela ngezakhono zokubeka iidayi ezijonge phantsi ezifanelekileyo kwiipakethe ze-semiconductor eziphambili, ukuhlanganiswa okungafaniyo, kunye neemveliso ze-elektroniki zesizukulwana esilandelayo.