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UKUBONELELA IZIXHOBO ZE-SEMICONDUCTOR ZE-GEEKVALUE

Isarha yokusika

Oomatshini bokusika ii-dicing abatsha, abasetyenzisiweyo nabahlaziyiweyo bokusika ii-wafer ze-semiconductor, ukupakishwa kwe-IC, imveliso ye-LED, izixhobo ze-MEMS, izixhobo zamandla kunye nokuveliswa kwezinto ze-elektroniki eziphambili.

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Intsha / Isetyenzisiwe / Ihlaziyiwe Ukuthenga izinto ngendlela eguquguqukayo kwiibhajethi ezahlukeneyo
Ibanga leSemiconductor Yesiqwenga se-wafer, i-IC, i-LED kunye ne-MEMS
Ukuhanjiswa kweHlabathi Ukupakisha ngaphandle kunye nokuthunyelwa ngokukhawuleza
Dicing Saw Machine Supplier
300+ Iimashini zeSemiconductor kunye neenxalenye ezikhoyo
40+ Amazwe Akhonzwa Kwihlabathi Lonke
10+ Amava okufumana izixhobo zeminyaka
24H Ixabiso elikhawulezayo kunye nokuhlolwa kwesitokhwe
Oomatshini Bokusika Iidayi Abadumileyo

Umthengisi woMbane woMbane wokuDaya iiDicing kwiMveliso yeSemiconductor

Hlola uluhlu lwethu lweemashini zethu zeDicing Saw ezichanekileyo kakhulu ezenzelwe ukunyibilikisa i-wafer, ukupakishwa kwe-semiconductor, kunye neenkqubo zokuvelisa ze-IC eziphambili. Wonke umatshini uvavanywa ngokupheleleyo ukuqinisekisa ukuchaneka okuzinzileyo kokusika, ukusebenza kakuhle kwemveliso, kunye nokusebenza okuthembekileyo kwexesha elide. Sinikezela ngeenkqubo ezintsha zeDicing Saw, ezihlaziyiweyo, nezisele zikho ngokuthunyelwa kwehlabathi, inkxaso yobugcisa, uncedo lokufakelwa, kunye nezisombululo ezingabizi kakhulu kwimigca yemveliso ye-semiconductor kwihlabathi liphela.

Wafer Dicing Process
Ukunqunqa iWafer Ukusika ngokuchanekileyo kokupakisha kwe-semiconductor
YINTONI I-DICING SAW?

Izixhobo Zokusika I-Wafer Echanekileyo Yokwenza I-Semiconductor

Isarha yokusika sisixhobo sokusika esichanekileyo esisetyenziselwa ukwahlula ii-wafers ze-semiconductor zibe ziidayi okanye iitships ezahlukeneyo. Sisebenzisa i-spindle ekhawulezayo kunye ne-diamond blade ukusika i-silicon, i-sapphire, iglasi, i-ceramic kunye nezixhobo ze-semiconductor ezihlanganisiweyo.

Kwiphakheji ye-semiconductor, inkqubo yokusika ichaphazela ngokuthe ngqo umgangatho we-die edge, isivuno, ukuthembeka kwe-chip kunye nokusebenza kwe-assembly esezantsi. Ukukhetha isarha yokusika efanelekileyo akupheleli nje kwixabiso lomatshini, kodwa kukwamalunga nokuchaneka kokusika, uzinzo lwe-spindle, ukuhambelana kweeblade, ulawulo lokupholisa kunye nenkxaso yenkonzo yexesha elide.

Ukuchaneka kokusika okuphezulu Indawo ezinzileyo kunye nolawulo oluchanekileyo lwe-kerf yokusika i-wafer.
Ukusebenza okuphantsi kokutshipha Iphucula umgangatho we-die edge kwaye inciphisa ukulahleka kwezinto.
Inkxaso yezinto ezininzi Ifanelekile kwi-silicon, i-sapphire, iglasi, i-ceramic kunye ne-compound substrates.
Iinketho Zokulungela Imveliso Izixhobo ezintsha, ezisetyenzisiweyo nezihlaziyiweyo ezilungele iimfuno ezahlukeneyo zemveliso.
Iteknoloji ye-Dicing Saw

Izinto eziphambili zeNkqubo ezichaphazela ukuSika koMgangatho

Kwi-wafer dicing, ukusebenza kokwenyani kuxhomekeke kwimeko epheleleyo yenkqubo: i-blade, i-spindle, ukupholisa, ukulungelelaniswa, isoftware kunye nozinzo lomatshini.

Dicing Saw Blade Selection Ukukhetha iiBlade

Uhlobo lweblade yedayimani, ubungakanani bomhlaba, ubukhulu beblade kunye nezinto zokubopha zichaphazela ngokuthe ngqo ububanzi be-kerf, ukuqhekeka komphetho kunye nesantya sokusika.

Dicing Saw Spindle Control Uzinzo lweSpindle

Imeko ye-spindle ekhawulezayo ibalulekile ekusikeni okuzinzileyo, ukungcangcazela okuphantsi kunye nomgangatho we-die edge ohambelanayo.

Dicing Saw Alignment Accuracy Ukuchaneka kokulungelelaniswa

Ukulungelelaniswa kombono kunye nokuchaneka kwesigaba kunceda ekunciphiseni ukuphambuka kokusika kunye nokugcina ubungakanani bedayi buhambelana.

Dicing Saw Cooling System Inkqubo yokupholisa

Ukuhamba kwamanzi kunye nokulawula ukupholisa kunceda ekunciphiseni ubushushu, ukususa inkunkuma kunye nokuthintela ukuqhekeka okuncinci ngexesha lokusika.

Dicing Tape And Frame Ukuhambelana kweTape kunye neSakhelo

Ukufakelwa kwe-wafer ngokufanelekileyo, ukunamathela kwi-tape kunye nokuphathwa kwefreyimu kubalulekile ekusikeni okuzinzileyo kunye nokuphathwa emva kokusikwa.

Dicing Saw Inspection Ukuhlolwa koMgangatho wokusika

Ububanzi be-kerf, ukuqhekeka, ukuqhekeka, i-die shift kunye nemeko yomphetho kufuneka zihlolwe ngaphambi kokuba zenziwe ngobuninzi.

INKQUBO YOKUDIBA

Indlela iWafer Dicing esebenza ngayo

Indlela ecacileyo yokusebenza yokusika inceda abathengi baqonde iimfuno zomatshini, iingozi zokucubungula kunye nokulungiselela imveliso ngaphambi kokuthenga.

Wafer Loading 01

I-Wafer Iyalayisha

Faka i-wafer, iteyiphu kunye nefreyimu kwinkqubo yesarha yokusika.

Dicing Blade Setup 02

Ukuseta iBlade

Khetha i-blade efanelekileyo ngokwezinto ezenziwe ngazo kunye nobukhulu bazo.

Vision Alignment 03

Ulungelelwaniso lombono

Lungelelanisa izitalato zokusika kunye nendlela yokusika ngokuchanekileyo.

Wafer Cutting 04

Ukusika ngokuchanekileyo

Sika i-wafer ibe ziidayi ngesantya esilawulwayo kunye nokupholisa.

Dicing Quality Inspection 05

Ukuhlolwa

Jonga ububanzi be-kerf, i-edge chipping kunye nokuqina kwe-wafer.

IZICELO

Apho kusetyenziswa khona oomatshini bokusika iidayi

Oomatshini bokusika iidayi basetyenziswa kakhulu ekupakisheni ii-semiconductor kunye nokwenza ii-elektroniki ezichanekileyo.

I-Wafer Dicing yeSemiconductor Ukusikwa kwe-silicon wafer yokupakisha i-IC kunye nokwenza iitships.
Ukusika iiChip ze-LED I-Sapphire kunye ne-LED wafer dicing kwimigca yemveliso ye-LED.
Izixhobo zeMEMS Ukusikwa ngokuchanekileyo kwezinzwa, izixhobo ezincinci kunye neemodyuli eziphambili.
Izixhobo zamandla Ukusika ii-semiconductor zamandla, izixhobo ze-elektroniki zeemoto kunye neemodyuli.
Iiglasi kunye neeSeramikhi Kwizixhobo ze-elektroniki, iimodyuli kunye nokusika okukhethekileyo kwe-substrate.
I-Optoelectronics Isetyenziswa kwizixhobo ze-optical, i-photonics kunye ne-precision microelectronics.
Umgca we-R&D kunye noPhathi Oomatshini abaguquguqukayo beelebhu, ubunjineli kunye nemveliso encinci.
Imveliso enkulu Iisarha zokusika ezizenzekelayo zokwenza imveliso ezinzileyo enomthamo ophezulu.
ISIKHOKELO SOMTHENGI

Indlela Yokukhetha Isarha Esichanekileyo Sokusika

Ngaphambi kokuba bathenge isarha yokusika, abathengi kufuneka bathelekise imeko yomatshini, ubungakanani be-wafer, ukuchaneka kokusika, imeko ye-spindle, inkxaso yeblade kunye nokukwazi kwayo ukwenza inkonzo.

Dicing Saw Wafer Size Ubungakanani beWafer

Qinisekisa ukuba umatshini uyayixhasa na ububanzi be-wafer yakho, ubungakanani befreyimu kunye nobukhulu bemveliso.

Dicing Saw Cutting Precision Ukusika ngokuchanekileyo

Vavanya ukuchaneka kokubeka indawo, ukuphindaphindwa kwayo, ububanzi be-kerf kunye nokukwazi ukutshixa okuphantsi.

Automatic Dicing Saw Inqanaba lokuZenzekelayo

Khetha isarha yokusika ezenzekelayo, ezenzekelayo okanye esetyenziswa ngesandla ngokusekelwe kwimveliso kunye nohlahlo lwabiwo-mali.

Dicing Saw Material Compatibility Ukuhambelana kwezinto

Ii-substrates ezahlukeneyo zifuna iiblade ezahlukeneyo, useto lokupholisa kunye nobuchule bokusebenza komatshini.

Used Dicing Saw Condition Imeko yoMshini

Kwiimatshini ezisetyenzisiweyo nezihlaziyiweyo, i-spindle, i-stage, inkqubo yokubona kunye nesoftware kufuneka zijongwe ngononophelo.

Dicing Saw Parts And Service Iinxalenye kunye neNkonzo

Izixhobo ezingasetyenziswayo ezinokuthenjwa, iiblade, inkxaso yobugcisa kunye nokupakishwa kwamanye amazwe kunciphisa umngcipheko wokuthenga ixesha elide.

IINDLELA ZOKUBONELELA

Izisombululo zeSaw Dicing ezitsha, ezisetyenzisiweyo nezihlaziyiweyo

I-GEEKVALUE inceda abathengi ukuba bathelekise imeko yezixhobo, ixesha lokuhanjiswa kwazo, uhlahlo lwabiwo-mali kunye nokufaneleka kwazo kwezobuchwepheshe ngaphambi kokuba zithengwe.

Ucwangciso lweMigca emitsha / yeMveliso

  • Ifanelekile ukuseta ifektri entsha okanye ucwangciso lomthamo wexesha elide
  • Uqwalaselo oluzinzileyo kunye nokuhambelana kwenkqubo entsha
  • Ukhetho olungcono xa ixesha lokuhambisa kunye nohlahlo-lwabiwo mali luguquguquka
  • Icetyiswa kwimveliso enomthamo omkhulu kunye nomjikelo omde

Isetyenzisiwe / Ihlaziyiweyo / Itshintshwa ngokukhawuleza

  • Ukhetho olungabizi kakhulu lokwandisa umthamo
  • Ukuhanjiswa ngokukhawuleza xa oomatshini befumaneka esitokhweni
  • Ukhetho olufanelekileyo kwinkxaso yomgca wexesha elidlulileyo okanye kwimveliso yovavanyo
  • Ukuhlolwa, ukuvavanywa kunye nokuthunyelwa kwamanye amazwe kubaluleke kakhulu
Dicing Saw Inspection And Testing
IMIGANGATHO YOHLOLO

Indlela Esinciphisa Ngayo Umngcipheko Ngaphambi Kokuthunyelwa

Kwizixhobo ze-semiconductor ezisetyenzisiweyo nezihlaziyiweyo, ukuhlolwa yeyona nto ibalulekileyo ekunciphiseni umngcipheko wokuthenga. Sinceda abathengi bajonge imeko yomatshini, izinto eziphambili kunye nokulungiselela ukuthumela ngaphandle ngaphambi kokuba uthunyelwe.

Uhlolo olubonakalayo

Jonga umphandle, igumbi, iqonga, iintambo, iiphaneli kunye nokugqibelela komatshini.

Uvavanyo lwe-Power-On

Qinisekisa ukuqaliswa kwenkqubo, isibonisi, ujongano lolawulo kunye nempendulo esisiseko yomatshini.

Ukujonga iSpindle

Hlola imeko ye-spindle, umngcipheko wokungcangcazela, ukujikeleza kunye nozinzo lokusika.

Ukuhlolwa kweNkqubo yoMsindo

Hlola intshukumo ye-axis, intshukumo yesigaba, ulungelelwaniso kunye nemeko yoomatshini.

Ukuhlolwa kweSoftware

Qinisekisa ukusebenza kwesoftware, ukuseta iresiphi kunye nemisebenzi yokulawula inkqubo.

Ukupakisha ngaphandle

Sebenzisa ukupakisha okukhuselekileyo xa uthumela izixhobo ze-semiconductor kumazwe ngamazwe.

FAQ

Imibuzo ebuzwa rhoqo malunga nomatshini wokusika iidayi

Imibuzo eqhelekileyo ebuzwa ngabathengi ngaphambi kokuba bathenge umatshini wokusika isarha.

Yintoni isarha yokudaya?

Isarha yokusika sisixhobo sokusika ii-wafers ze-semiconductor zibe zii-dies okanye ii-chips ezahlukeneyo kusetyenziswa i-spindle ekhawulezayo kunye ne-diamond blade.

Isetyenziselwa ntoni isarha yokusika?

Iisarha zokusika zisetyenziselwa ukugalela i-wafer, ukusika i-wafer, ukugalela i-wafer, ukukrola kunye nokwahlula ii-wafers ze-semiconductor ekupakisheni nasekuveliseni.

Zeziphi iintlobo zeesarha zokusila ozibonelelayo?

Sibonelela ngeesarha zokusila ezizenzekelayo, ii-wafer cutters ezenziwe ngesandla, oomatshini bokusila abachanekileyo kunye nezixhobo zesarha zokusila ezilungisiweyo.

Ingaba nibonelela ngeesarha zokusila ezilungisiweyo?

Ewe, sinikezela ngeesarha zokudaya ezihlaziyiweyo ngokupheleleyo, ezivavanyiweyo nezilungisiweyo, ezichanekileyo ngokuchaneka kokusika okuzinzileyo kunye nokusebenza okungabizi kakhulu.

Zeziphi iiblade ezisetyenziswa kwiisarha zokusika?

Iisarha zokusika zisebenzisa iiblade zedayimani ezinobunzima obuphezulu, iiblade zeresin, iiblade zesinyithi kunye neeblade ezifakwe ngombane kwizinto ezahlukeneyo zewafer.

Zeziphi izinto ezinokusikwa yisarha yokusika?

Iisarha zokusika zinokusika ii-wafers ze-silicon, i-ceramic, iglasi, i-sapphire, i-quartz, i-PCB, i-ferrite kunye nezinye izixhobo ze-semiconductor kunye neze-elektroniki.

Yintoni i-wafer singulation?

Ukusika i-wafer yinkqubo yokusika i-wafer ecociweyo ibe ziitships ezahlukeneyo okanye ii-dies kusetyenziswa umatshini wesarha yokusika.

Ngaba ninikezela ngeenkonzo zokuthumela iisarha zokusikwa kwihlabathi liphela?

Ewe, sinikezela ngokupakisha okuchwephesha kwamanye amazwe, uthutho lwamazwe ngamazwe kunye nokuhanjiswa kwihlabathi liphela kuzo zonke iimashini zokusika isarha kunye neewafer.

Ngaba nibonelela ngenkxaso yokufakelwa kunye neyobugcisa?

Sinikezela ngokufakela kwindawo, ukulinganisa i-spindle, ukulungiswa kweeblade, uqeqesho kunye nenkxaso yexesha elide emva kokuthengisa kwezixhobo zesarha yokusika.

Ungayijonga njani isitokhwe kwaye ufumane ikowuteshini?

Nxibelelana neqela lethu lokuthengisa ngeWhatsApp, ifomu okanye i-imeyile ukuze ujonge isitokhwe ngexesha langempela, ukufumaneka kunye namaxabiso amva nje oomatshini bokusika isarha.

Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?

Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukusungulwa kweTshayina ngetekhnoloji ye-cutting-edge. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".

Iinkcukacha

Qhagamshelana nengcali yokuthengisa

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Isicelo sokuthengisa

Silandele

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Ukukhangela ngokukhawuleza

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