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xhI-ASM Laser Cutting Machine LS100-2 ngumatshini we-laser dicing olungiselelwe ngokukodwa iimfuno zokusika ezichanekileyo, ezilungele ukuveliswa kweMini / Micro LED chips. Isixhobo sinezi mpawu zilandelayo kunye neenzuzo:
Ukusika okuchanekileyo okuphezulu: Ukuchaneka kobunzulu be-LS100-2 ngu-σ≤1um, ukuchaneka kwendawo yokusika i-XY ngu-σ≤0.7um, kunye nobubanzi bendlela yokusika ≤14um. Ezi parameters ziqinisekisa ukuchaneka okuphezulu kwe-chip cutting.
Imveliso esebenzayo: Esi sixhobo sinokusika malunga ne-10 yezigidi zeetshiphusi ngeyure, siphucula kakhulu ukusebenza kakuhle kwemveliso.
Itekhnoloji yelungelo elilodwa lomenzi: I-LS100-2 ithatha inani letekhnoloji ezinelungelo elilodwa lomenzi wokuphucula ngakumbi ukuzinza kunye nokuthembeka kokusika.
Ububanzi besicelo: Ifanelekile kwi-4 "kunye ne-6" ii-wafers, ubukhulu be-wafer butshintsha ngaphantsi kwe-15um, ubukhulu bebhentshi yokusebenzela yi-168mm, i-260mm kunye ne-290 °, enokuthi ihlangabezane neemfuno zokusika zobukhulu obuhlukeneyo kunye nobukhulu.
Ukongeza, umatshini wokudayela we-laser we-LS100-2 ubaluleke kakhulu kwi-Mini / Micro LED chip yokuvelisa. Kuba iichips ezincinci/ezincinci ze-LED zifuna ukuchaneka okuphezulu kakhulu, kunzima kwisixhobo esiqhelekileyo ukuqinisekisa isivuno kunye nemveliso ngaxeshanye. I-LS100-2 isombulula le ngxaki ngokuchaneka kwayo okuphezulu kunye nokusebenza okuphezulu, ukuhlangabezana nemfuno yoshishino yemveliso kunye nemveliso.
