Iindaba zeSemiconductor

Qonda izinto ezibangela amaxabiso oomatshini bokubopha idayi kuquka inkqubo, ukuchaneka, ukuzenzekela, imeko, izixhobo, isoftware, uvavanyo kunye nobubanzi bokuhanjiswa.

Khetha umatshini wokubopha ngedayi ngokuthelekisa iinkqubo ze-epoxy, eutectic, solder ethambileyo kunye nesilivere, ukuhamba kwezinto, ukufudumeza, amandla kunye neemfuno zemveliso.

Thelekisa iibhondi zebhola, i-wedge enocingo olucolekileyo kunye neebhondi zentambo enzima ngezinto zocingo, i-package geometry, i-current, iprofayili yeluphu, imida yobushushu kunye neemfuno zemveliso.

Vavanya i-wire bonder esetyenzisiweyo ngokwendlela echanekileyo ebekwe ngayo, inkqubo yokubopha, ubungqina bokuhlolwa, i-FAT esekelwe kwisicelo, iziphumo zovavanyo lwe-bond kunye nobubanzi bokuhanjiswa.

Vavanya i-ASM SIPLACE CA4 okanye i-CA4 V2 esetyenzisiweyo ngokwendlela ebekwe ngayo intloko yayo, izikhundla ze-SWS kunye nezothutho, i-conveyor, isoftware, izixhobo kunye nokulingana komgca.

Vavanya i-ASM SIPLACE CA2 esetyenzisiweyo ngokwesimo sayo esifakiweyo, iirekhodi zomatshini, ubungqina be-FAT obusekelwe kwisicelo kunye nobubanzi bokugqibela bokuhanjiswa.

Funda indlela i-MRSI-605 AP edibanise ngayo iindlela ezizinzileyo, ukuphathwa kwezixhobo ezininzi, ulawulo lwamandla kunye nombono wokuhlanganiswa kwezixhobo eziphambili zexesha elidlulileyo.

Funda indlela ifomathi yedayi, ukuhamba kwe-substrate, indlela yokubopha, izixhobo, ulungelelwaniso, isoftware kunye nomthamo wemveliso ezichaphazela ngayo izigqibo zoqwalaselo lwe-MRSI-705.

Funda ukuba yintoni i-MRSI-705 5-micron die bonder, indlela esebenza ngayo intshukumo yayo, ulawulo lwamandla kunye neenkqubo zokubona, kunye nesizathu sokuba amandla enkqubo axhomekeke kuqwalaselo.

Funda indlela i-ASM AMICRA AFC Plus exhasa ngayo i-precision die kunye ne-flip-chip bonding, indlela esebenza ngayo inkqubo yayo kunye nesizathu sokuba amandla eprojekthi axhomekeke kulungiselelo olufakiweyo.

Funda indlela yokuvavanya i-ASM AMICRA AFC Plus esetyenzisiweyo ngokuhlaziya ubume bomatshini wayo, uqwalaselo olufakiweyo, izixhobo, isoftware, imeko, ubungqina be-FAT kunye nobubanzi bokuhanjiswa.

Hlola ulwazi oluqinisekisiweyo lweqonga le-ASMPT FT2026, kuquka i-turret yayo ye-nozzle engama-26, indlela yephakheji, iindawo zovavanyo, ukuphathwa kwemidiya kunye nokuhlolwa koomatshini abasetyenzisiweyo.

Hlola iinkcukacha ze-ASMPT FT2018 eziqinisekisiweyo, uluhlu lweephakheji, iindawo zovavanyo, imisebenzi yombono kunye ne-tape-and-reel, kunye nokuhlolwa okubalulekileyo komatshini osetyenzisiweyo.

Thelekisa oomatshini be-ASMPT MS100, MS100 Plus kunye ne-MS100 Plus II ngokwesimo, izixhobo, isoftware, imeko kunye nobungqina bokusebenza—hayi igama lomzekelo lodwa.

Vavanya i-ASMPT MS100 Plus esetyenzisiweyo ngokujonga ukuphathwa kwe-wafer, izixhobo zokuthathwa, umbono, isoftware, indlela yokukhupha, ubungqina be-FAT kunye nobubanzi bokuhanjiswa.

Funda ukuba i-ASMPT MS100 wafer mapping die sorter yenza ntoni, indlela eyahlukileyo ngayo i-die sorting kuvavanyo lombane kunye nento ekufuneka uyiqinisekise ngaphambi kokuba uthenge umatshini osetyenzisiweyo.

Funda ngeenkqubo ezili-10 zokujonga ukulungela imveliso yeebhondi zentambo ze-K&S IConn PLUS, kuquka i-wire feed, i-capillary, i-FAB, i-looping, i-vision, i-workholder kunye ne-recipe validation.

Thelekisa ii-bond ze-K&S IConn PLUS kunye ne-IConn wire bonders ngaphambi kokuba uzithenge. Jonga umahluko phakathi kwentloko yebhondi, i-capillary, i-wire feed, umsebenzi, umbono, isoftware kunye ne-FAT.

Funda indlela yokuqinisekisa ucingo lobhedu, izixhobo ze-capillary, i-FAB, i-looping, umbono kunye neemeko zobushushu ukuze udlulisele imveliso kwiibhondi zentambo ze-ASM AERO.

Uceba ukuthenga i-ASM AERO wire bonder esetyenzisiweyo? Hlola iitshekhi ezili-12 zee-bond heads, i-wire feed, izixhobo ze-capillary, umbono, isoftware, ukuhlaziywa kunye ne-FAT.