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Ukukhetha umatshini wokubopha idayi kuqala ngenkqubo yokuncamathisela efunekayo kwimveliso. I-Epoxy, i-eutectic solder, i-soft solder kunye ne-silver sintering zonke zinokuchazwa njenge-die bonding, kodwa azifuni inkqubo efanayo yokuhambisa izinto, intloko yedayi, indlela yokufudumeza, umoya, ulawulo lwamandla okanye izixhobo ezisezantsi.
Ngoko ke, umatshini onokukhetha nokubeka idayisi ngokuchanekileyo awunakukwazi ngokuzenzekelayo ukugqiba inkqubo yokudibanisa idayisi efunekayo. Umva wedayi, ukugqitywa kwe-substrate, indlela yobushushu, uqhagamshelo lombane, imfuneko yomgca webhondi kunye nomthamo wemveliso kufuneka kuqwalaselwe ngaphambi kokuba kuthelekiswe iimodeli zomatshini ngamnye.
Umsebenzi wokukhetha ngokusebenzayo kukunxibelelanisa imfuneko yemveliso nezinto zokubopha, ulandelelwano lwenkqubo kunye noqwalaselo lomatshini olufakiweyo.
Qala ngesiphumo esifunekayo sokuncamathisela ukufa
Indlela yokubopha kufuneka ilandele umsebenzi wokuhlanganiswa kokugqibela. Iphakheji yesensa ebiza kancinci, imodyuli yeSiC enamandla aphezulu kunye nendibano yelaser echanekileyo zonke zinokufuna indawo yokubeka idayi, kodwa iimfuno zazo zobushushu, zombane kunye nezoomatshini zinokukhokelela kwiindlela ezahlukeneyo zezixhobo.
| Imfuneko yeMveliso | Imibuzo Ekufuneka Ichazwe | Kutheni Itshintsha Ukukhetha Umatshini |
|---|---|---|
| Indlela yobushushu | Ubushushu obungakanani obumele bufuduke ukusuka kwidayi buye kwi-substrate okanye kwi-heat spreader? | Ukusebenza kobushushu obufunekayo kuchaphazela ukuba i-epoxy, i-solder, i-eutectic okanye izinto ezisinki zifanelekile na. |
| Uqhagamshelo lombane | Ngaba umaleko webhondi kufuneka uqhube umsinga, uhlale wahlulwe ngombane okanye unike inkxaso yoomatshini kuphela? | Izixhobo eziqhuba umbane kunye nezingezizo eziqhuba umbane zifuna izicwangciso ezahlukeneyo zokuhambisa, ukulungisa kunye nezicwangciso zokufaneleka. |
| Izinto zokufa kunye ne-substrate | Zithini i-die backside metallization, i-substrate finish kunye neemeko zomphezulu? | Ujongano lwezinto luchaphazela ukumanzisa, ukunamathela, ukusasazwa, ulawulo lwe-oxidation kunye nobushushu benkqubo. |
| Ulawulo lwe-bond-line | Bubuphi ubukhulu, ukufana kunye nokuthambekela okuqhelekileyo okwamkelekileyo? | Ukukhupha, ukunyathela, ukuseta kwangaphambili, ukulawula amandla kunye nezixhobo kufuneka kuvelise umaleko webhondi ofunekayo. |
| Imfuneko engasebenziyo | Uyilo lobushushu nolokuthembeka lunokunyamezela kangakanani ukuvaleka kwento? | Ukulungiswa kwezinto, ukukhuhla, umoya ojikeleze umhlaba, ukuhla kwamanzi kwakhona kunye nokulungiswa kwe-vacuum ezantsi komjelo kunokuba yinto ebalulekileyo. |
| Uvakalelo lwephakheji | Zingakanani amandla, ubushushu kunye nentshukumo yoomatshini ezinokumelana ne-die kunye ne-substrate? | Izinto ezibhityileyo, ezibuthathaka kunye nezakhiwo ezibuthathaka zinokufuna ukulandwa okukhethekileyo, inkxaso kunye nolawulo lwamandla. |
| Imodeli yemveliso | Ingaba le projekthi yi-R&D, yimveliso exutywe kakhulu okanye yimveliso enomthamo omkhulu? | Ukwenziwa kwezinto ngokuzenzekelayo okufunekayo, ukutshintsha izixhobo, ukuphathwa kwezinto kunye nemveliso kunokubaluleka njengenkqubo yokubopha. |
Ezi mfuno kufuneka zichazwe ngaphambi kokuba umthengi abuze ukuba ingaba i-die bonder ethile “iyakwazi na uku-epoxy” okanye “iyakwazi uku-sintering.” Igama lenkqubo elifanayo lisenokufuna iimodyuli ezahlukeneyo zomatshini kwiipakeji ezahlukeneyo.
Indlela Iinkqubo Eziphambili Zokubopha I-Die
| Inkqubo yokubopha | Indlela Eyenziwa Ngayo Ibhondi | Iimfuno eziqhelekileyo zoomatshini | Inkxalabo yoKhetho oluPhambili |
|---|---|---|---|
| Ukubopha nge-epoxy die | Kufakwa iglu ehambisa umbane okanye engahambisani nombane, idayi ibekwe ize loo nto inyangwe. | Ukukhupha, ukuphosa, ukunyathela okanye ukudipha; ulawulo lwamandla okubeka; ulawulo lwentambo yokubopha; isicwangciso sokuphilisa | Umthamo wezinto ezibonakalayo, ukopha kwegazi, ukuthambekela kokufa, imeko yokuphiliswa kunye nokuqina komgca webhondi |
| I-Eutectic die bonding | I-alloy echaziweyo okanye i-preform iyafudunyezwa ngokusebenzisa uluhlu lwayo lokubopha ukuze kwenziwe i-metallic joint. | Ubushushu nokupholisa okulawulwayo, ulawulo lomoya, ukuphathwa kwangaphambili kunye nokukhuhla okukhethwayo | Iprofayili yobushushu, i-oxidation, ukumanzisa, ukuvaleka kunye nokuhamba komoya ngexesha lokubopha |
| Ukubopha okuthambileyo kwe-solder die | I-solder isetyenziswa kwaye iphinda ijikelezwe ukuze kudalwe uqhagamshelo oluqhuba ubushushu kunye nombane. | Ukulungiswa okanye ukusasazwa kwe-solder, iindawo zenkqubo ezishushu, ulawulo lwe-atmosphere kunye nokuphathwa kwe-leadframe ephezulu | Ubukhulu be-solder, ukumanzisa, ukuvalela, ukuxinana kunye nokuphindaphinda kwemveliso |
| Ukusila isilivere | Amasuntswana esilivere enza unxibelelwano oluxineneyo ngenkqubo yokusila esekwe kwi-diffusion endaweni yokulungisa okanye ukujika kwe-solder. | Ukuphathwa kwe-Cola okanye ifilimu, ulawulo oluchanekileyo lwe-bond-line, inqanaba lobushushu, amandla alawulwayo apho kufanelekileyo kunye nokusila okusezantsi | Ukulungiswa kwezinto, ubukhulu be-bond-line, uzinzo lwe-tacking, indlela yoxinzelelo kunye neemeko zokugqibela ze-sintering |
Le theyibhile ichonga indlela ephambili yesixhobo. Ayichazi indlela yokupheka inkqubo eqhelekileyo. Uqwalaselo oluchanekileyo luxhomekeke kwizixhobo ezikhethiweyo, idayisi, isiseko, indlela yokuvelisa kunye neemfuno zokufaneleka.
I-Epoxy Die Bonding Ibeka Ulawulo Lwezinto Ezisetyenziswayo Nokuphilisa
I-Epoxy isetyenziswa kakhulu kuba inokuxhasa iifomathi ezininzi zeepakeji kwaye inokufakwa ngeendlela ezahlukeneyo. I-epoxy eqhubayo inokubonelela ngonxibelelwano lombane kunye nobushushu, ngelixa izinto ezingezizo eziqhubayo zinokubonelela ngokudibanisa oomatshini okanye ukwahlulwa kombane.
I-die bonder ingasebenzisa i-epoxy ngokusebenzisa:
Ukusasazwa koxinzelelo lwexesha
Ukukhupha i-Auger
Ukukhupha iiJet
Ukudluliselwa kwephini okanye isitampu
Ukuntywila
Izinto zokuncamathelisa ezifakwe kwangaphambili
Indlela echanekileyo ixhomekeke kwi-viscosity yezinto, umxholo we-filler, ubungakanani bediphozithi, ipateni, i-geometry yepakeji kunye nesantya sokuvelisa. I-dispenser esebenza nge-epoxy enye akufuneki ithathwe njengelawula yonke ifomyula egcwalisiweyo okanye engazaliswanga.
Imisebenzi ebalulekileyo yoMshini we-Epoxy
Umthamo wokusasaza okanye wokunyathela ozinzileyo
Ulawulo lobushushu bezinto kunye nobomi bembiza apho kuyimfuneko
Ukubekwa ngokuchanekileyo kwedayi ngaphambi kokuba izinto zihambe okanye zinyangwe
Amandla okubekwa acwangcisiweyo kunye nokuphakama kwebhondi
Ubukhulu bomgca webhondi kunye nolawulo lokuthambekela kwedayi
Ukuhlolwa kombono we-pre-bond kunye ne-post-bond
Ukudluliselwa okuthembekileyo kwinkqubo yokunyanga efunekayo
Ukubekwa kwe-epoxy kudla ngokusebenzisa amaqondo obushushu aphantsi kuneendlela zokunyibilikisa zesinyithi, kodwa ukuhlanganiswa okupheleleyo kusaxhomekeke kwiprofayili yokulungiswa echaziweyo. Ukubekwa ngempumelelo akubonisi ukuba ilungu lokugqibela elilungisiweyo liya kuhlangabezana neemfuno zobushushu, zombane okanye zokuthembeka.
Umzekelo wangoku weqonga le-epoxy elikhawulezayo, iI-BESI ESEC 2100 hS die bonderingajongwa njengesixhobo esinye. Ukufaneleka kwayo kwenyani kusaxhomekeke kulungiselelo lomatshini olunikezelwayo kunye nephakheji ekujoliswe kuyo.
Ukubopha i-Eutectic Die kufuna ubushushu obulawulwayo kunye neemeko zomphezulu
I-Eutectic die bonding idala i-metallic attachment ngokufudumeza i-alloy okanye i-preform ngemeko ye-bonding echaziweyo. Le nkqubo idla ngokuqwalaselwa apho imveliso ifuna ukudluliselwa kobushushu obuqinileyo, ukuhanjiswa kombane, ukuchaneka okuphezulu kokubekwa okanye i-metallic joint elawulwayo.
Umatshini kunye nezixhobo kungafuneka zixhase:
I-solder ebekwe kwangaphambili okanye ukuphathwa okwahlukileyo kwangaphambili
Ukufudumeza nokupholisa okukhawulezayo nokuphindaphindwayo
Umoya ongasebenziyo okanye onciphayo olawulwayo apho kuyimfuneko
Intshukumo yokukhuhla okanye yokufa ecwangcisiweyo
Amandla ebhondi achanekileyo kunye nokuphakama kwebhondi
Izixhobo ezihlala zizinzile kubushushu benkqubo
Ukulungelelaniswa kombono ngaphambi kokuba umphezulu ufiphale
Ukukhuhla kunokunceda ukuphazamisa iifilimu zomphezulu, ukuphucula ukumanzisa nokunciphisa igesi evalelekileyo kwiinkqubo ezifanelekileyo. Akufanele kuthathwe njengemfuneko eqhelekileyo okanye indawo yokulungiswa komphezulu ngokuchanekileyo kunye nolawulo lobushushu.
Inkqubo ye-eutectic kufuneka iqwalasele nendlela idayi eziphatha ngayo ngelixa i-alloy inyibilikisiwe. Inkxaso engalunganga, ukuhamba kakhulu okanye iprofayili yobushushu engafanelekanga inokuchaphazela ukulungelelaniswa, ubukhulu be-bond-line kunye nokwakheka kwe-void.
I-Soft Solder Die Bonding inxulumene kakhulu neMveliso yamandla
I-Soft solder die bonding idla ngokuvavanywa kwi-power semiconductor kunye ne-high-volume leadframe applications ezifuna indlela yobushushu eqhubayo phakathi kwe-die kunye ne-carrier yayo.
Nangona zombini iinkqubo ze-eutectic kunye ne-soft solder zisebenzisa izinto zesinyithi kunye nobushushu, akufuneki ziphathwe njengezifanayo. Uhlobo lwe-solder, indlela yokunyibilika, indlela yokukhupha, umoya, uthutho lwe-leadframe kunye nolandelelwano lwemveliso zinokwahluka kakhulu.
Iindawo zezixhobo zeSoft Solder ekufuneka ziqinisekiswe
Indlela yokuhambisa izinto nge-solder-wire, paste, preform okanye enye indlela yokuhambisa izinto
Ukulungelelaniswa kokulungiselela ukusasazwa okanye ukunyibilikiswa kwe-solder
Intloko yebhondi efudumeleyo, inqanaba okanye indawo yenkqubo
Ilungiselelo lolawulo lwegesi kunye ne-oxidation
Ukuthathwa kunye nokubekwa kwedayi ngelixa i-solder isaqhubeka
Ukuphathwa kwefreyimu yentsimbi, umcu okanye imodyuli yamandla
Ukubona ngeliso lenkqubo kunye nokubeka esweni iziphene
Ukupholisa nokudlulisa emva kokubopha
Izixhobo ze-solder ezithambileyo ezinomthamo ophezulu zihlala zisetyenziselwa ngakumbi kune-bonder ye-R&D eguquguqukayo. Umthengi otshintsha umatshini wemveliso okhoyo kufuneka athelekise indlela epheleleyo yezinto kunye nendlela yefreyimu ye-leadframe, kungekuphela nje ukuchaneka kokubekwa kunye nemveliso ephezulu.
Ukucocwa kwesilivere kufuna indlela epheleleyo yokucocwa nokucocwa
Ukusila isilivere kusetyenziswa kakhulu apho izixhobo zamandla zifuna ukusebenza okuphezulu kobushushu kunye nokusebenza ixesha elide phantsi kweemeko zobushushu ezifuna amandla. Le nto ayibangeli ijoyinti yayo yokugqibela ngokusebenzisa ukunyibilika kwe-epoxy eqhelekileyo okanye ukunyibilika kwe-solder.
Ngokuxhomekeke kwizixhobo ezikhethiweyo kunye nenkqubo yemveliso, indlela ingabandakanya:
Ukusebenzisa intlama yesilivere, ifilimu okanye enye into yokusila kwisiseko okanye kwidayi
Ukukhetha nokubeka idayisi ngokuchanekileyo
Ukulawula ubukhulu bokuqala bomgca webhondi
Ukubeka idayisi ukuze ihlale izinzile ngexesha lokuthuthwa
Ukudlulisela indibano kwinkqubo yokucutha uxinzelelo okanye inkqubo yokucutha engenaxinzelelo
Ukusebenzisa indibaniselwano efunekayo yobushushu, amandla, umoya kunye nexesha
Ezinye iinkqubo zisebenzisa i-tacking enamandla aphezulu okanye i-sintering encediswa luxinzelelo, ngelixa ezinye zisebenzisa izixhobo ezingenaxinzelelo. I-die bonder ekhethiweyo kufuneka ihambelane nendlela yokwenyani yezinto kunokuba ihambelane negama eliqhelekileyo elithi "silver sintering."
Izinto ezibalulekileyo ekufuneka uziqwalasele xa usebenzisa izixhobo ziquka:
Ukuhambisa iipayiti, ukunyathela ifilimu okanye ukuphatha ifilimu yokudlulisa
Ukuthathwa kunye nenkxaso encinci
Intloko yebhondi efudumeleyo kunye nokukwazi kweqonga
Amandla ebhondi anokucwangciswa
Ubukhulu bomgca webhondi kunye nolawulo lokuthambekela kwedayi
Ukutshintsha kwesixhobo ngokuzenzekelayo kwiidayi ezahlukeneyo kunye neemveliso
Ukudluliselwa okuzinzileyo kwi-press yokugqibela yokutshiza okanye kwi-oven
I-die bonder ingenza izigaba zokubeka kunye nokubopha ngaphandle kokugqiba i-sintered joint yokugqibela. Umgca wemveliso opheleleyo kufuneka uhlolwe, kungekuphela nje umatshini wokukhetha nokubeka.
Ukuhamba kwezinto ezibonakalayo kunokubaluleka njengendlela yokubopha
Emva kokuba kuchaziwe indlela yenkqubo, qinisekisa indlela idayisi, izinto zokubopha kunye ne-substrate ezingena ngayo kumatshini.
| Indawo yezixhobo | Iifomathi zokufaka ezinokwenzeka | Isiphumo soMatshini |
|---|---|---|
| Igalelo ledayi | Isakhelo sewafer, ipakethi yewaffle, iGel-Pak, itreyi, iteyiphu kunye nereyile okanye idayisi ekhululekileyo | Utshintsho lweemfuno ze-ejector, isixhobo sokuthatha, umbono, i-feeder kunye notshintsho oluzenzekelayo. |
| Izinto zokubopha | I-Epoxy, intlama yokudibanisa, ucingo, i-preform, intlama yesilivere, ifilimu okanye umaleko osetyenzisiweyo kwangaphambili | Isixhobo sokutshintsha isixhobo sokuhambisa, isixhobo sokunyathela, iyunithi yokudipha, iheater kunye nenkqubo yokulawula izinto. |
| I-substrate | Ifreyimu yentsimbi, i-DBC, i-AMB, iseramikhi, i-PCB, umthwali, iphakheji okanye i-submount nganye nganye | Utshintsha umsebenzi, ukukhomba, ukubopha, ukufudumeza kunye nokuzisebenzela kwemveliso. |
| Utshintsho lwemveliso | Imveliso enye, umxube ophezulu, iidayi ezininzi okanye izixhobo zenkqubo ezininzi | Isenokufuna isixhobo esizenzekelayo, i-ejector, i-wafer kunye nokutshintshwa kweresiphi. |
Iqonga elineenkqubo ezininzi linokuxhasa iindlela ezahlukeneyo zokubopha, kodwa kuphela xa kufakelwa izixhobo zokuhambisa, izifudumezi, iintloko, izixhobo, ulawulo lwemozulu kunye neendlela zesoftware.
IBESI Datacon 2200 EVO kufa umatshini bondingibonisa indlela ukuphathwa kwe-wafer, ukutshintsha izixhobo, ukusasaza kunye neenkqubo ezishushu okanye ezibandayo ezinokudibaniswa ngayo kwiqonga eliguquguqukayo. Uqwalaselo lomatshini onikezelwayo lusafuna ukuqinisekiswa ngokwahlukeneyo.
Ulandelelwano loKhetho loMatshini oQokelelweyo wokuDie Bonding
Chaza ijoyinti yokugqibela.Misela iimfuno zobushushu, zombane, zoomatshini kunye nezokuthembeka.
Qinisekisa i-interfaces yezinto ezibonakalayo.Chonga i-die lateral metallization, ukugqitywa kwe-substrate kunye nemeko yomphezulu.
Khetha inkqubo yokubopha.Thelekisa i-epoxy, i-eutectic, i-solder ethambileyo kunye ne-sintering ngokuchasene nejoyinti efunekayo.
Chaza indlela izinto eziboniswa ngayo.Bhala phantsi indlela idayisi, izinto zokubopha kunye ne-substrate ezingena ngayo kumatshini.
Chonga iimodyuli zenkqubo.Qinisekisa iimfuno zokuhambisa, ukustampa, ukuphathwa kwangaphambili, ukufudumeza, umoya ongqongileyo, ukukhuhla, amandla kunye neemfuno zokupholisa.
Misela imfuneko yokubeka.Chaza ukuchaneka, i-theta, ukuphakama kwebhondi, i-die tilt kunye nokuhlolwa kwe-post-bond.
Hlola ukwenziwa kwezinto ngokuzenzekelayo.Misela iimfuno zemveliso, utshintsho, ukulandeleka kunye neemfuno zomphathi.
Jonga umatshini ochanekileyo.Thelekisa uqwalaselo olufakiweyo, isoftware, izixhobo kunye nezixhobo kunye nesicwangciso senkqubo.
Sebenzisa izinto ezimeleyo.Qinisekisa ukuba izinto ezisetyenzisiweyo kunye nolandelelwano lokubopha luphelele phantsi kweemeko zovavanyo ezivunyiweyo.
Qinisekisa i-joint yokugqibela.Qinisekisa iziphumo zobushushu, zombane, zoomatshini kunye nezokuthembeka ngenkqubo yemveliso efanelekileyo.
Olu landelelwano lulona sigqibo siphambili sokukhetha umatshini. Indlela yokubopha imisela ukuba zeziphi izixhobo ezifunekayo, ngelixa imveliso echanekileyo imisela ukuba ezo zixhobo zanele na.
Xa i-Multi-Process Die Bonder inentsingiselo
Umatshini wokubopha iidayi oguquguqukayo unokuba luncedo xa umzi-mveliso usebenzisa iimveliso ezixutywe kakhulu, uphuhlisa inkqubo okanye ufuna iindlela ezininzi zokubopha ngaphakathi kweqonga elinye.
Ubuchule beenkqubo ezininzi buluncedo kakhulu xa:
Iintloko nezixhobo ezifakiweyo zigubungela uluhlu olufunekayo lwe-die.
Umatshini unokutshintsha phakathi kweefomathi zokufaka izinto ezifunekayo.
Iimodyuli zokukhupha, zokunyathela, zokufudumeza kunye nomoya ziyafumaneka.
Isoftware kunye neeresiphi zixhasa utshintsho olulawulwayo lwenkqubo.
Isiphumo esilindelekileyo sihlala sisebenza emva kotshintsho.
Ukulungiswa nokugcinwa kwezinto kungalawulwa kwiinkqubo ezahlukeneyo.
Umatshini ozinikeleyo ovelisa umthamo omkhulu unokufaneleka ngakumbi xa usapho olunye lwemveliso lulawula imveliso kwaye lufuna ukuphathwa okukhethekileyo kwefreyimu yentsimbi, ulawulo oluthambileyo lwe-solder okanye ukulungiswa kokusila ngamandla amakhulu.
Imibuzo ebuzwa rhoqo malunga nokukhethwa komatshini wokubopha iidayi
Ngaba umatshini omnye wokubopha iidayi ungenza iinkqubo ze-epoxy kunye ne-eutectic?
Amanye amaqonga aguquguqukayo anokuxhasa zombini ezi zinto, kodwa kuphela xa kufakwa isixhobo sokuhambisa esifunekayo, inkqubo yokufudumeza, ulawulo lomoya, izixhobo kunye nesoftware. Igama lemodeli lodwa aliqinisekisi ubuchule beenkqubo ezininzi.
Ngaba isilivere sintering igqityiwe ngokupheleleyo ngaphakathi kwi-die bond?
Akunjalo rhoqo. I-die bonder ingafaka izinto, ibeke i-die ize yenze i-tacking, ngelixa i-final sintering isenzeka kwinkqubo eyahlukileyo yoxinzelelo okanye engenaxinzelelo. Umgca opheleleyo kufuneka uhlolwe.
Ngaba i-eutectic bonding iyafana ne-soft solder die attach?
Hayi. Zombini zisebenzisa izinto zokubopha zesinyithi kunye nobushushu, kodwa indlela esebenza ngayo i-alloy, indlela eziboniswa ngayo izinto, umoya, izixhobo kunye nezixhobo zemveliso zinokwahluka. Inkqubo efunekayo kufuneka ichazwe yiphakheji kunye nenkqubo yezinto.
Ngaba ukuchaneka okuphezulu kokubekwa kuthetha ukuba kukho umatshini wokubopha iidayi ongcono?
Hayi yodwa. Ukuchaneka kufuneka kuqwalaselwe kunye nokuphathwa kwedayi, ulawulo lwentambo yebhondi, ukusetyenziswa kwezinto, amandla, ukufudumeza, ukuzenzekela kunye neemeko zokulinganisa zokwenyani.
Loluphi ulwazi olufanele lulungiswe ngaphambi kokuba ucele i-die
Ukukhetha umatshini wokubopha idayi kuqala ngenkqubo yokuncamathisela efunekayo kwimveliso. I-Epoxy, i-eutectic solder, i-soft solder kunye ne-silver sintering zonke zinokuchazwa njenge-die bonding, kodwa azifuni inkqubo efanayo yokuhambisa izinto, intloko yedayi, indlela yokufudumeza, umoya, ulawulo lwamandla okanye izixhobo ezisezantsi.
Ngoko ke, umatshini onokukhetha nokubeka idayisi ngokuchanekileyo awunakukwazi ngokuzenzekelayo ukugqiba inkqubo yokudibanisa idayisi efunekayo. Umva wedayi, ukugqitywa kwe-substrate, indlela yobushushu, uqhagamshelo lombane, imfuneko yomgca webhondi kunye nomthamo wemveliso kufuneka kuqwalaselwe ngaphambi kokuba kuthelekiswe iimodeli zomatshini ngamnye.
Umsebenzi wokukhetha ngokusebenzayo kukunxibelelanisa imfuneko yemveliso nezinto zokubopha, ulandelelwano lwenkqubo kunye noqwalaselo lomatshini olufakiweyo.
Qala ngesiphumo esifunekayo sokuncamathisela ukufa
Indlela yokubopha kufuneka ilandele umsebenzi wokuhlanganiswa kokugqibela. Iphakheji yesensa ebiza kancinci, imodyuli yeSiC enamandla aphezulu kunye nendibano yelaser echanekileyo zonke zinokufuna indawo yokubeka idayi, kodwa iimfuno zazo zobushushu, zombane kunye nezoomatshini zinokukhokelela kwiindlela ezahlukeneyo zezixhobo.
| Imfuneko yeMveliso | Imibuzo Ekufuneka Ichazwe | Kutheni Itshintsha Ukukhetha Umatshini |
|---|---|---|
| Indlela yobushushu | Ubushushu obungakanani obumele bufuduke ukusuka kwidayi buye kwi-substrate okanye kwi-heat spreader? | Ukusebenza kobushushu obufunekayo kuchaphazela ukuba i-epoxy, i-solder, i-eutectic okanye izinto ezisinki zifanelekile na. |
| Uqhagamshelo lombane | Ngaba umaleko webhondi kufuneka uqhube umsinga, uhlale wahlulwe ngombane okanye unike inkxaso yoomatshini kuphela? | Izixhobo eziqhuba umbane kunye nezingezizo eziqhuba umbane zifuna izicwangciso ezahlukeneyo zokuhambisa, ukulungisa kunye nezicwangciso zokufaneleka. |
| Izinto zokufa kunye ne-substrate | Zithini i-die backside metallization, i-substrate finish kunye neemeko zomphezulu? | Ujongano lwezinto luchaphazela ukumanzisa, ukunamathela, ukusasazwa, ulawulo lwe-oxidation kunye nobushushu benkqubo. |
| Ulawulo lwe-bond-line | Bubuphi ubukhulu, ukufana kunye nokuthambekela okuqhelekileyo okwamkelekileyo? | Ukukhupha, ukunyathela, ukuseta kwangaphambili, ukulawula amandla kunye nezixhobo kufuneka kuvelise umaleko webhondi ofunekayo. |
| Imfuneko engasebenziyo | Uyilo lobushushu nolokuthembeka lunokunyamezela kangakanani ukuvaleka kwento? | Ukulungiswa kwezinto, ukukhuhla, umoya ojikeleze umhlaba, ukuhla kwamanzi kwakhona kunye nokulungiswa kwe-vacuum ezantsi komjelo kunokuba yinto ebalulekileyo. |
| Uvakalelo lwephakheji | Zingakanani amandla, ubushushu kunye nentshukumo yoomatshini ezinokumelana ne-die kunye ne-substrate? | Izinto ezibhityileyo, ezibuthathaka kunye nezakhiwo ezibuthathaka zinokufuna ukulandwa okukhethekileyo, inkxaso kunye nolawulo lwamandla. |
| Imodeli yemveliso | Ingaba le projekthi yi-R&D, yimveliso exutywe kakhulu okanye yimveliso enomthamo omkhulu? | Ukwenziwa kwezinto ngokuzenzekelayo okufunekayo, ukutshintsha izixhobo, ukuphathwa kwezinto kunye nemveliso kunokubaluleka njengenkqubo yokubopha. |
Ezi mfuno kufuneka zichazwe ngaphambi kokuba umthengi abuze ukuba ingaba i-die bonder ethile “iyakwazi na uku-epoxy” okanye “iyakwazi uku-sintering.” Igama lenkqubo elifanayo lisenokufuna iimodyuli ezahlukeneyo zomatshini kwiipakeji ezahlukeneyo.
Indlela Iinkqubo Eziphambili Zokubopha I-Die
| Inkqubo yokubopha | Indlela Eyenziwa Ngayo Ibhondi | Iimfuno eziqhelekileyo zoomatshini | Inkxalabo yoKhetho oluPhambili |
|---|---|---|---|
| Ukubopha nge-epoxy die | Kufakwa iglu ehambisa umbane okanye engahambisani nombane, idayi ibekwe ize loo nto inyangwe. | Ukukhupha, ukuphosa, ukunyathela okanye ukudipha; ulawulo lwamandla okubeka; ulawulo lwentambo yokubopha; isicwangciso sokuphilisa | Umthamo wezinto ezibonakalayo, ukopha kwegazi, ukuthambekela kokufa, imeko yokuphiliswa kunye nokuqina komgca webhondi |
| I-Eutectic die bonding | I-alloy echaziweyo okanye i-preform iyafudunyezwa ngokusebenzisa uluhlu lwayo lokubopha ukuze kwenziwe i-metallic joint. | Ubushushu nokupholisa okulawulwayo, ulawulo lomoya, ukuphathwa kwangaphambili kunye nokukhuhla okukhethwayo | Iprofayili yobushushu, i-oxidation, ukumanzisa, ukuvaleka kunye nokuhamba komoya ngexesha lokubopha |
| Ukubopha okuthambileyo kwe-solder die | I-solder isetyenziswa kwaye iphinda ijikelezwe ukuze kudalwe uqhagamshelo oluqhuba ubushushu kunye nombane. | Ukulungiswa okanye ukusasazwa kwe-solder, iindawo zenkqubo ezishushu, ulawulo lwe-atmosphere kunye nokuphathwa kwe-leadframe ephezulu | Ubukhulu be-solder, ukumanzisa, ukuvalela, ukuxinana kunye nokuphindaphinda kwemveliso |
| Ukusila isilivere | Amasuntswana esilivere enza unxibelelwano oluxineneyo ngenkqubo yokusila esekwe kwi-diffusion endaweni yokulungisa okanye ukujika kwe-solder. | Ukuphathwa kwe-Cola okanye ifilimu, ulawulo oluchanekileyo lwe-bond-line, inqanaba lobushushu, amandla alawulwayo apho kufanelekileyo kunye nokusila okusezantsi | Ukulungiswa kwezinto, ubukhulu be-bond-line, uzinzo lwe-tacking, indlela yoxinzelelo kunye neemeko zokugqibela ze-sintering |
Le theyibhile ichonga indlela ephambili yesixhobo. Ayichazi indlela yokupheka inkqubo eqhelekileyo. Uqwalaselo oluchanekileyo luxhomekeke kwizixhobo ezikhethiweyo, idayisi, isiseko, indlela yokuvelisa kunye neemfuno zokufaneleka.
I-Epoxy Die Bonding Ibeka Ulawulo Lwezinto Ezisetyenziswayo Nokuphilisa
I-Epoxy isetyenziswa kakhulu kuba inokuxhasa iifomathi ezininzi zeepakeji kwaye inokufakwa ngeendlela ezahlukeneyo. I-epoxy eqhubayo inokubonelela ngonxibelelwano lombane kunye nobushushu, ngelixa izinto ezingezizo eziqhubayo zinokubonelela ngokudibanisa oomatshini okanye ukwahlulwa kombane.
I-die bonder ingasebenzisa i-epoxy ngokusebenzisa:
Ukusasazwa koxinzelelo lwexesha
Ukukhupha i-Auger
Ukukhupha iiJet
Ukudluliselwa kwephini okanye isitampu
Ukuntywila
Izinto zokuncamathelisa ezifakwe kwangaphambili
Indlela echanekileyo ixhomekeke kwi-viscosity yezinto, umxholo we-filler, ubungakanani bediphozithi, ipateni, i-geometry yepakeji kunye nesantya sokuvelisa. I-dispenser esebenza nge-epoxy enye akufuneki ithathwe njengelawula yonke ifomyula egcwalisiweyo okanye engazaliswanga.
Imisebenzi ebalulekileyo yoMshini we-Epoxy
Umthamo wokusasaza okanye wokunyathela ozinzileyo
Ulawulo lobushushu bezinto kunye nobomi bembiza apho kuyimfuneko
Ukubekwa ngokuchanekileyo kwedayi ngaphambi kokuba izinto zihambe okanye zinyangwe
Amandla okubekwa acwangcisiweyo kunye nokuphakama kwebhondi
Ubukhulu bomgca webhondi kunye nolawulo lokuthambekela kwedayi
Ukuhlolwa kombono we-pre-bond kunye ne-post-bond
Ukudluliselwa okuthembekileyo kwinkqubo yokunyanga efunekayo
Ukubekwa kwe-epoxy kudla ngokusebenzisa amaqondo obushushu aphantsi kuneendlela zokunyibilikisa zesinyithi, kodwa ukuhlanganiswa okupheleleyo kusaxhomekeke kwiprofayili yokulungiswa echaziweyo. Ukubekwa ngempumelelo akubonisi ukuba ilungu lokugqibela elilungisiweyo liya kuhlangabezana neemfuno zobushushu, zombane okanye zokuthembeka.
Umzekelo wangoku weqonga le-epoxy elikhawulezayo, iI-BESI ESEC 2100 hS die bonderingajongwa njengesixhobo esinye. Ukufaneleka kwayo kwenyani kusaxhomekeke kulungiselelo lomatshini olunikezelwayo kunye nephakheji ekujoliswe kuyo.
Ukubopha i-Eutectic Die kufuna ubushushu obulawulwayo kunye neemeko zomphezulu
I-Eutectic die bonding idala i-metallic attachment ngokufudumeza i-alloy okanye i-preform ngemeko ye-bonding echaziweyo. Le nkqubo idla ngokuqwalaselwa apho imveliso ifuna ukudluliselwa kobushushu obuqinileyo, ukuhanjiswa kombane, ukuchaneka okuphezulu kokubekwa okanye i-metallic joint elawulwayo.
Umatshini kunye nezixhobo kungafuneka zixhase:
I-solder ebekwe kwangaphambili okanye ukuphathwa okwahlukileyo kwangaphambili
Ukufudumeza nokupholisa okukhawulezayo nokuphindaphindwayo
Umoya ongasebenziyo okanye onciphayo olawulwayo apho kuyimfuneko
Intshukumo yokukhuhla okanye yokufa ecwangcisiweyo
Amandla ebhondi achanekileyo kunye nokuphakama kwebhondi
Izixhobo ezihlala zizinzile kubushushu benkqubo
Ukulungelelaniswa kombono ngaphambi kokuba umphezulu ufiphale
Ukukhuhla kunokunceda ukuphazamisa iifilimu zomphezulu, ukuphucula ukumanzisa nokunciphisa igesi evalelekileyo kwiinkqubo ezifanelekileyo. Akufanele kuthathwe njengemfuneko eqhelekileyo okanye indawo yokulungiswa komphezulu ngokuchanekileyo kunye nolawulo lobushushu.
Inkqubo ye-eutectic kufuneka iqwalasele nendlela idayi eziphatha ngayo ngelixa i-alloy inyibilikisiwe. Inkxaso engalunganga, ukuhamba kakhulu okanye iprofayili yobushushu engafanelekanga inokuchaphazela ukulungelelaniswa, ubukhulu be-bond-line kunye nokwakheka kwe-void.
I-Soft Solder Die Bonding inxulumene kakhulu neMveliso yamandla
I-Soft solder die bonding idla ngokuvavanywa kwi-power semiconductor kunye ne-high-volume leadframe applications ezifuna indlela yobushushu eqhubayo phakathi kwe-die kunye ne-carrier yayo.
Nangona zombini iinkqubo ze-eutectic kunye ne-soft solder zisebenzisa izinto zesinyithi kunye nobushushu, akufuneki ziphathwe njengezifanayo. Uhlobo lwe-solder, indlela yokunyibilika, indlela yokukhupha, umoya, uthutho lwe-leadframe kunye nolandelelwano lwemveliso zinokwahluka kakhulu.
Iindawo zezixhobo zeSoft Solder ekufuneka ziqinisekiswe
Indlela yokuhambisa izinto nge-solder-wire, paste, preform okanye enye indlela yokuhambisa izinto
Ukulungelelaniswa kokulungiselela ukusasazwa okanye ukunyibilikiswa kwe-solder
Intloko yebhondi efudumeleyo, inqanaba okanye indawo yenkqubo
Ilungiselelo lolawulo lwegesi kunye ne-oxidation
Ukuthathwa kunye nokubekwa kwedayi ngelixa i-solder isaqhubeka
Ukuphathwa kwefreyimu yentsimbi, umcu okanye imodyuli yamandla
Ukubona ngeliso lenkqubo kunye nokubeka esweni iziphene
Ukupholisa nokudlulisa emva kokubopha
Izixhobo ze-solder ezithambileyo ezinomthamo ophezulu zihlala zisetyenziselwa ngakumbi kune-bonder ye-R&D eguquguqukayo. Umthengi otshintsha umatshini wemveliso okhoyo kufuneka athelekise indlela epheleleyo yezinto kunye nendlela yefreyimu ye-leadframe, kungekuphela nje ukuchaneka kokubekwa kunye nemveliso ephezulu.
Ukucocwa kwesilivere kufuna indlela epheleleyo yokucocwa nokucocwa
Ukusila isilivere kusetyenziswa kakhulu apho izixhobo zamandla zifuna ukusebenza okuphezulu kobushushu kunye nokusebenza ixesha elide phantsi kweemeko zobushushu ezifuna amandla. Le nto ayibangeli ijoyinti yayo yokugqibela ngokusebenzisa ukunyibilika kwe-epoxy eqhelekileyo okanye ukunyibilika kwe-solder.
Ngokuxhomekeke kwizixhobo ezikhethiweyo kunye nenkqubo yemveliso, indlela ingabandakanya:
Ukusebenzisa intlama yesilivere, ifilimu okanye enye into yokusila kwisiseko okanye kwidayi
Ukukhetha nokubeka idayisi ngokuchanekileyo
Ukulawula ubukhulu bokuqala bomgca webhondi
Ukubeka idayisi ukuze ihlale izinzile ngexesha lokuthuthwa
Ukudlulisela indibano kwinkqubo yokucutha uxinzelelo okanye inkqubo yokucutha engenaxinzelelo
Ukusebenzisa indibaniselwano efunekayo yobushushu, amandla, umoya kunye nexesha
Ezinye iinkqubo zisebenzisa i-tacking enamandla aphezulu okanye i-sintering encediswa luxinzelelo, ngelixa ezinye zisebenzisa izixhobo ezingenaxinzelelo. I-die bonder ekhethiweyo kufuneka ihambelane nendlela yokwenyani yezinto kunokuba ihambelane negama eliqhelekileyo elithi "silver sintering."
Izinto ezibalulekileyo ekufuneka uziqwalasele xa usebenzisa izixhobo ziquka:
Ukuhambisa iipayiti, ukunyathela ifilimu okanye ukuphatha ifilimu yokudlulisa
Ukuthathwa kunye nenkxaso encinci
Intloko yebhondi efudumeleyo kunye nokukwazi kweqonga
Amandla ebhondi anokucwangciswa
Ubukhulu bomgca webhondi kunye nolawulo lokuthambekela kwedayi
Ukutshintsha kwesixhobo ngokuzenzekelayo kwiidayi ezahlukeneyo kunye neemveliso
Ukudluliselwa okuzinzileyo kwi-press yokugqibela yokutshiza okanye kwi-oven
I-die bonder ingenza izigaba zokubeka kunye nokubopha ngaphandle kokugqiba i-sintered joint yokugqibela. Umgca wemveliso opheleleyo kufuneka uhlolwe, kungekuphela nje umatshini wokukhetha nokubeka.
Ukuhamba kwezinto ezibonakalayo kunokubaluleka njengendlela yokubopha
Emva kokuba kuchaziwe indlela yenkqubo, qinisekisa indlela idayisi, izinto zokubopha kunye ne-substrate ezingena ngayo kumatshini.
| Indawo yezixhobo | Iifomathi zokufaka ezinokwenzeka | Isiphumo soMatshini |
|---|---|---|
| Igalelo ledayi | Isakhelo sewafer, ipakethi yewaffle, iGel-Pak, itreyi, iteyiphu kunye nereyile okanye idayisi ekhululekileyo | Utshintsho lweemfuno ze-ejector, isixhobo sokuthatha, umbono, i-feeder kunye notshintsho oluzenzekelayo. |
| Izinto zokubopha | I-Epoxy, intlama yokudibanisa, ucingo, i-preform, intlama yesilivere, ifilimu okanye umaleko osetyenzisiweyo kwangaphambili | Isixhobo sokutshintsha isixhobo sokuhambisa, isixhobo sokunyathela, iyunithi yokudipha, iheater kunye nenkqubo yokulawula izinto. |
| I-substrate | Ifreyimu yentsimbi, i-DBC, i-AMB, iseramikhi, i-PCB, umthwali, iphakheji okanye i-submount nganye nganye | Utshintsha umsebenzi, ukukhomba, ukubopha, ukufudumeza kunye nokuzisebenzela kwemveliso. |
| Utshintsho lwemveliso | Imveliso enye, umxube ophezulu, iidayi ezininzi okanye izixhobo zenkqubo ezininzi | Isenokufuna isixhobo esizenzekelayo, i-ejector, i-wafer kunye nokutshintshwa kweresiphi. |
Iqonga elineenkqubo ezininzi linokuxhasa iindlela ezahlukeneyo zokubopha, kodwa kuphela xa kufakelwa izixhobo zokuhambisa, izifudumezi, iintloko, izixhobo, ulawulo lwemozulu kunye neendlela zesoftware.
IBESI Datacon 2200 EVO kufa umatshini bondingibonisa indlela ukuphathwa kwe-wafer, ukutshintsha izixhobo, ukusasaza kunye neenkqubo ezishushu okanye ezibandayo ezinokudibaniswa ngayo kwiqonga eliguquguqukayo. Uqwalaselo lomatshini onikezelwayo lusafuna ukuqinisekiswa ngokwahlukeneyo.
Ulandelelwano loKhetho loMatshini oQokelelweyo wokuDie Bonding
Chaza ijoyinti yokugqibela.Misela iimfuno zobushushu, zombane, zoomatshini kunye nezokuthembeka.
Qinisekisa i-interfaces yezinto ezibonakalayo.Chonga i-die lateral metallization, ukugqitywa kwe-substrate kunye nemeko yomphezulu.
Khetha inkqubo yokubopha.Thelekisa i-epoxy, i-eutectic, i-solder ethambileyo kunye ne-sintering ngokuchasene nejoyinti efunekayo.
Chaza indlela izinto eziboniswa ngayo.Bhala phantsi indlela idayisi, izinto zokubopha kunye ne-substrate ezingena ngayo kumatshini.
Chonga iimodyuli zenkqubo.Qinisekisa iimfuno zokuhambisa, ukustampa, ukuphathwa kwangaphambili, ukufudumeza, umoya ongqongileyo, ukukhuhla, amandla kunye neemfuno zokupholisa.
Misela imfuneko yokubeka.Chaza ukuchaneka, i-theta, ukuphakama kwebhondi, i-die tilt kunye nokuhlolwa kwe-post-bond.
Hlola ukwenziwa kwezinto ngokuzenzekelayo.Misela iimfuno zemveliso, utshintsho, ukulandeleka kunye neemfuno zomphathi.
Jonga umatshini ochanekileyo.Thelekisa uqwalaselo olufakiweyo, isoftware, izixhobo kunye nezixhobo kunye nesicwangciso senkqubo.
Sebenzisa izinto ezimeleyo.Qinisekisa ukuba izinto ezisetyenzisiweyo kunye nolandelelwano lokubopha luphelele phantsi kweemeko zovavanyo ezivunyiweyo.
Qinisekisa i-joint yokugqibela.Qinisekisa iziphumo zobushushu, zombane, zoomatshini kunye nezokuthembeka ngenkqubo yemveliso efanelekileyo.
Olu landelelwano lulona sigqibo siphambili sokukhetha umatshini. Indlela yokubopha imisela ukuba zeziphi izixhobo ezifunekayo, ngelixa imveliso echanekileyo imisela ukuba ezo zixhobo zanele na.
Xa i-Multi-Process Die Bonder inentsingiselo
Umatshini wokubopha iidayi oguquguqukayo unokuba luncedo xa umzi-mveliso usebenzisa iimveliso ezixutywe kakhulu, uphuhlisa inkqubo okanye ufuna iindlela ezininzi zokubopha ngaphakathi kweqonga elinye.
Ubuchule beenkqubo ezininzi buluncedo kakhulu xa:
Iintloko nezixhobo ezifakiweyo zigubungela uluhlu olufunekayo lwe-die.
Umatshini unokutshintsha phakathi kweefomathi zokufaka izinto ezifunekayo.
Iimodyuli zokukhupha, zokunyathela, zokufudumeza kunye nomoya ziyafumaneka.
Isoftware kunye neeresiphi zixhasa utshintsho olulawulwayo lwenkqubo.
Isiphumo esilindelekileyo sihlala sisebenza emva kotshintsho.
Ukulungiswa nokugcinwa kwezinto kungalawulwa kwiinkqubo ezahlukeneyo.
Umatshini ozinikeleyo ovelisa umthamo omkhulu unokufaneleka ngakumbi xa usapho olunye lwemveliso lulawula imveliso kwaye lufuna ukuphathwa okukhethekileyo kwefreyimu yentsimbi, ulawulo oluthambileyo lwe-solder okanye ukulungiswa kokusila ngamandla amakhulu.
Imibuzo ebuzwa rhoqo malunga nokukhethwa komatshini wokubopha iidayi
Ngaba umatshini omnye wokubopha iidayi ungenza iinkqubo ze-epoxy kunye ne-eutectic?
Amanye amaqonga aguquguqukayo anokuxhasa zombini ezi zinto, kodwa kuphela xa kufakwa isixhobo sokuhambisa esifunekayo, inkqubo yokufudumeza, ulawulo lomoya, izixhobo kunye nesoftware. Igama lemodeli lodwa aliqinisekisi ubuchule beenkqubo ezininzi.
Ngaba isilivere sintering igqityiwe ngokupheleleyo ngaphakathi kwi-die bond?
Akunjalo rhoqo. I-die bonder ingafaka izinto, ibeke i-die ize yenze i-tacking, ngelixa i-final sintering isenzeka kwinkqubo eyahlukileyo yoxinzelelo okanye engenaxinzelelo. Umgca opheleleyo kufuneka uhlolwe.
Ngaba i-eutectic bonding iyafana ne-soft solder die attach?
Hayi. Zombini zisebenzisa izinto zokubopha zesinyithi kunye nobushushu, kodwa indlela esebenza ngayo i-alloy, indlela eziboniswa ngayo izinto, umoya, izixhobo kunye nezixhobo zemveliso zinokwahluka. Inkqubo efunekayo kufuneka ichazwe yiphakheji kunye nenkqubo yezinto.
Ngaba ukuchaneka okuphezulu kokubekwa kuthetha ukuba kukho umatshini wokubopha iidayi ongcono?
Hayi yodwa. Ukuchaneka kufuneka kuqwalaselwe kunye nokuphathwa kwedayi, ulawulo lwentambo yebhondi, ukusetyenziswa kwezinto, amandla, ukufudumeza, ukuzenzekela kunye neemeko zokulinganisa zokwenyani.
Loluphi ulwazi olufanele lulungiswe ngaphambi kokuba ucele ingcebiso ye-die bonder?
Lungisa ubungakanani kunye nobukhulu bedayi, ifomathi yokufaka, isiseko, izinto zokubopha, imfuneko yokubeka, amandla okubopha, ubushushu, umoya, injongo yemveliso kunye nemisebenzi yokuhlolwa okanye yokulandelela efunekayo.
Ingcebiso Yokugqibela
Umatshini wokubopha ngedayi kufuneka ukhethwe yijoyinti ekufuneka iyenze, kungekuphela nje ngesantya sayo, ukuchaneka okanye igama lomzekelo. Iinkqubo ze-epoxy zixhomekeke kakhulu ekubekweni kwezinto kunye nokuphiliswa kwazo. Iinkqubo ze-solder ezithambileyo nezingenamagingxigingxi zifuna iimeko zokubopha zesinyithi ezilawulwayo. Ukusila ngesilivere kufuna ukulungiswa kwezinto ngokuchanekileyo, ukubethelwa kunye nendlela epheleleyo yokusila.
Uhlolo luyafumanekaoomatshini bokubopha nge-diekuphela emva kwenkqubo, ukuhamba kwezinto kunye neemodyuli ezifunekayo ziyachazwa. Ukuxoxa ngeprojekthi, thumela idayisi, isiseko, izinto zokubopha, injongo yemveliso kunye nenkqubo ekujoliswe kuyo ngeprojekthiIphepha lophando ngezixhobo ze-All-SMT.
isincomo se-bonder?
Lungisa ubungakanani kunye nobukhulu bedayi, ifomathi yokufaka, isiseko, izinto zokubopha, imfuneko yokubeka, amandla okubopha, ubushushu, umoya, injongo yemveliso kunye nemisebenzi yokuhlolwa okanye yokulandelela efunekayo.
Ingcebiso Yokugqibela
Umatshini wokubopha ngedayi kufuneka ukhethwe yijoyinti ekufuneka iyenze, kungekuphela nje ngesantya sayo, ukuchaneka okanye igama lomzekelo. Iinkqubo ze-epoxy zixhomekeke kakhulu ekubekweni kwezinto kunye nokuphiliswa kwazo. Iinkqubo ze-solder ezithambileyo nezingenamagingxigingxi zifuna iimeko zokubopha zesinyithi ezilawulwayo. Ukusila ngesilivere kufuna ukulungiswa kwezinto ngokuchanekileyo, ukubethelwa kunye nendlela epheleleyo yokusila.
Uhlolo luyafumanekaoomatshini bokubopha nge-diekuphela emva kwenkqubo, ukuhamba kwezinto kunye neemodyuli ezifunekayo ziyachazwa. Ukuxoxa ngeprojekthi, thumela idayisi, isiseko, izinto zokubopha, injongo yemveliso kunye nenkqubo ekujoliswe kuyo ngeprojekthiIphepha lophando ngezixhobo ze-All-SMT.
