i-ave ukuya kuthi ga kwi-70% kuMacandelo e-SMT - KwiSitokhwe & Ukulungele ukuThunyelwa
Fumana iQuote →Oomatshini bokufaka ii-wafer abachanekileyo kakhulu bokupakisha ii-semiconductor, ukugawula ii-wafer, ukucutshungulwa kwee-wafer ezincinci, kunye nokusetyenziswa kokupakisha okuphambili.
Isixhobo sokufaka i-wafer, esaziwa ngokuba ngumatshini wokufaka i-wafer, sisetyenziselwa ukufaka ii-wafer ze-semiconductor kwiteyiphu yokuncamathelisa kunye nesakhelo sokusika ngaphambi kokuba i-wafer ikhuphe, igrumbe, ihlolwe, okanye ithathwe ngomatshini. Le nkqubo inceda ukugcina i-wafer izinzile, ithe tyaba, kwaye ixhaswe ngokufanelekileyo ngexesha lokwenziwa kwe-semiconductor ngokuchanekileyo.
Kwiifektri ze-semiconductor, kwiinkampani ze-OSAT, kubavelisi beetshiphusi ze-LED, kubavelisi be-MEMS, nakubavelisi bezixhobo zamandla, ukufakwa kwe-wafer ezinzileyo kuchaphazela ngqo umgangatho wokusika, izinga lokuphuka kwe-wafer, i-die yield, kunye nokusebenza kakuhle kwemveliso.
Umatshini wokufaka i-wafer othembekileyo unceda ekunciphiseni umonakalo we-wafer, ukuphucula ukuchaneka kokusika, kunye nokugcina umgangatho wemveliso uzinzile.
Inkxaso yeteyiphu ezinzileyo inceda ekunciphiseni ukuqhekeka kwe-wafer ngexesha lokusika, ukuphatha, kunye nokudlulisa.
Ukubekwa kwe-wafer ngokuchanekileyo kunceda ukuphucula ukuhambelana kokusika kunye nomgangatho wokwahlulwa kwedayi.
Ukugquma kakuhle kunceda ukunciphisa amaqamza, imibimbi, kunye nokunamathelana kwetape okungalinganiyo.
Ukufakelwa okufanelekileyo kunceda ukukhusela ii-wafers ezincinci kakhulu ngexesha leenkqubo ezinobungozi obukhulu.
Umgangatho ongcono wokufakela unceda ukunciphisa iziphene kwaye uphucule iziphumo zenkqubo esezantsi.
Ukusebenza kwezixhobo ezizinzileyo kunceda ukugcina ukuhamba kwemveliso kunye nokunciphisa ukuphinda kusebenze.
Sinikezela ngezisombululo ze-wafer mounter kwiisayizi ezahlukeneyo ze-wafer, ubungakanani bemveliso, iintlobo zeteyiphu, kunye neemfuno zenkqubo ye-semiconductor.
Izikhonkwane ze-wafer zisetyenziswa kwiinkqubo ezahlukeneyo ze-semiconductor apho uzinzo lwe-wafer, ukunamathela kwi-tape, ukubeka ifreyimu, kunye nokulungiswa kwe-dicing kuchaphazela ngokuthe ngqo umgangatho wemveliso kunye nemveliso.
Faka ii-wafers kwi-dicing tape nakwiifreyimu zesinyithi ngaphambi kokuba u-saw dicing, nto leyo enceda ukugcina i-wafer ithe tyaba kwaye izinzile ngexesha lokusika ngesantya esiphezulu.
Isetyenziswa ngaphambi kokuba kubekho iinkqubo zokwahlulwa kweedayi kunye nokubopha iidayi ukukhusela iitships kunye nokuphucula ukusebenza kakuhle kokuphatha kwimigca yokupakisha ye-IC.
Ixhasa ii-wafers ezibhityileyo nezibuthathaka emva kokusila okanye ukuncitshiswa, inciphisa umngcipheko wokuqhekeka, ukugoba, kunye nomonakalo wokuphatha.
Ibonelela ngeteyiphu ezinzileyo kwii-wafers ze-MEMS ezifuna ukuphathwa ngononophelo, ukulungelelaniswa ngokuchanekileyo, kunye neemeko zokusika ezilawulwayo.
Inceda ekulungiseleleni ii-wafers ze-LED zokwahlulahlula, ukwahlulahlula, kunye nokucubungula iitships ezisezantsi ngelixa inciphisa umonakalo we-edge kunye nokulahleka kwe-die.
Ifanelekile kwi-IGBT, MOSFET, diode, SiC, kunye ne-GaN wafer processing apho ukufakwa okuzinzileyo kubalulekile ekulawuleni isivuno.
Isetyenziswa kwiinkqubo zokupakisha ezisebenzisa i-flip chip, i-fan-out, i-wafer-level, kunye neenkqubo zokupakisha ezinoxinano olukhulu ezifuna inkxaso echanekileyo ye-wafer.
Emva kokusila i-wafer ngasemva, ukuyibeka kunceda ukuxhasa i-wafer ngaphambi kokuyisika okanye ukuyijonga, ingakumbi kwi-substrates ezincinci.
Abathengi abafuna isixhobo sokumisa i-wafer abadli ngokufuna umatshini kuphela. Bafuna isisombululo esithembekileyo sokunciphisa umngcipheko wenkqubo, ukuphucula umgangatho wokumisa, kunye nokugcina imveliso ye-semiconductor izinzile.
Ubonelelo oluguquguqukayo loomatshini bokufaka ii-wafer ezintsha, ezihlaziyiweyo, nezisetyenzisiweyo.
Oomatshini banokujongwa ngaphambi kokuba bathunyelwe ukunceda ukunciphisa umngcipheko wokuthenga.
Unxibelelwano olukhawulezayo lokukhetha imodeli, isicatshulwa, kunye nokufumaneka koomatshini.
Inkxaso yokuthunyelwa kwezixhobo zamazwe ngamazwe kunye namaxwebhu okuthumela ngaphandle.
Inkxaso yokukhetha umatshini osisiseko, ukufanisa usetyenziso, kunye neemfuno zenkqubo.
Izixhobo zokusika iiwafer, ukubopha, ukupakisha kunye nemigca yokuhlola.
I-wafer mounter ngumatshini we-semiconductor osetyenziselwa ukufaka ii-wafers kwiteyiphu yokuncamathelisa kunye neefreyimu ngaphambi kokuzisika, ukuzigaya, ukuzihlola, okanye ukuzicoca ngomatshini.
Umatshini wokufaka i-wafer uxhasa ii-wafer ngexesha leenkqubo ezisezantsi. Unceda ukugcina i-wafer izinzile, inciphise ukwaphuka, kwaye iphucule umgangatho wokusikwa.
Iinketho eziqhelekileyo ziquka ii-wafer mounters ezizenzekelayo, ii-wafer mounters ezizenzekelayo, ii-UV tape wafer mounters, kunye noomatshini bokufaka ii-wafer ezincinci.
Ewe. Iinkqubo ezininzi zokufaka ii-wafer zenzelwe ukuxhasa ii-wafers ezibhityileyo, kodwa ukhetho lokugqibela luxhomekeke kubungakanani be-wafer, ubukhulu, uhlobo lweteyipu, kunye neemfuno zenkqubo.
Oomatshini bokufaka iiwafer basetyenziswa kakhulu ekupakisheni ii-semiconductor, ekudibaniseni iiwafer, kwi-MEMS, ekuveliseni iitshiphusi ze-LED, kwizixhobo zamandla, kwi-SiC, kwi-GaN, nakwiphakheji ephucukileyo.
Kuya kufuneka uqwalasele ubungakanani be-wafer, ubukhulu be-wafer, uhlobo lweteyiphu, ubungakanani befreyimu, inqanaba lokuzenzekela, umbane ophumayo, ukuchaneka kokulungelelaniswa, kunye nokusetyenziswa kwemveliso.
Sixelele ubungakanani be-wafer yakho, uhlobo lweteyipu, indlela oyisebenzisa ngayo, kunye nemeko yomatshini owuthandayo. Siza kukunceda ujonge ukhetho olufanelekileyo lomatshini wokufaka i-wafer.
Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?
Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukusungulwa kweTshayina ngetekhnoloji ye-cutting-edge. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".
IinkcukachaQhagamshelana nengcali yokuthengisa
Finyelela kwiqela lethu lezentengiso ukuze ujonge izisombululo ezilungiselelweyo ezihlangabezana ngokugqibeleleyo neemfuno zeshishini lakho kwaye ulungise nayiphi na imibuzo onokuba unayo.