I-SINTAIKE semiconductor wafer mounter STK-6020

I-SINTAIKE STK-6020 ngumatshini wokuthepha i-wafer omfutshane, ozenzekelayo owenzelwe ngokukodwa inkqubo yokuncitshiswa kwe-wafer yee-wafers eziziisentimitha ezi-4 ukuya kwezi-8. Inika isisombululo esingabizi kakhulu nesithembekileyo sokuncamathisela ifilimu enamathelayo.

**Umgaqo Wokusebenza**

I-STK-6020 isekelwe kwitekhnoloji ye-anti-static roller lamination. Inkqubo yayo ephambili inamanyathelo alandelayo:

**Ukulayisha kunye nokubeka indawo:** Umsebenzisi ubeka i-wafer ngesandla etafileni yokusebenza, apho iqiniswe khona kusetyenziswa iimpawu zokulungelelanisa jikelele okanye iiphini zomoya.

**I-Lamination Ezenzekelayo:** Umatshini ukhupha ngokuzenzekelayo ifilimu enamathelayo, kwaye i-roller engashukumiyo ifaka ifilimu kumphezulu we-wafer ngoxinzelelo oluhlengahlengiswayo, ukuqinisekisa ukugqitywa okuthe tyaba, okungenamaqamza.

**Ukusika ngokuchanekileyo:** Le nkqubo isebenzisa izicucu ezithe tye nezijikelezayo ukuze inqumle ngokuchanekileyo ifilimu, ithintele ii-burrs kwaye inciphise inkunkuma yezinto.

**Ukukhupha imithwalo:** Umsebenzisi uthatha i-wafer—ngoku egqunywe ngefilimu yokukhusela—ukuze aqhubekele kwinqanaba elilandelayo lokucubungula.

**Iimpawu eziphambili kunye neenzuzo**

Lo matshini unesiyilo esigxileyo esibonelela ngesisombululo esisebenzayo esilungiselelwe iimfuno ezithile zomsebenzisi.

**Udidi lweeMpawu** | **Iimpawu kunye neeNzuzo**

**Ukusebenza Okumangalisayo Kwenkqubo** | Ifumana isivuno se-wafer se-≥99.9%; iqinisekisa ukugquma kwefilimu engenamaqamza (ngaphandle kwamaqamza abangelwa ziinxalenye zothuli ezibanjiweyo).

**Uqwalaselo Oluguquguqukayo kunye Nomthamo Ophezulu** | Iyahambelana nee-wafers ezine eziphambili: 4", 5", 6", kunye ne-8". Ifikelela kwi-wafers eziyi-≥80 ngeyure, kunye nexesha eliqhelekileyo lokutshintsha imveliso elingadluli kwimizuzu emi-5.

**Ubuchule Obuphambili Bobuchwephesha** | **Unyango Oluchasene Nokunganyakazi:** Isebenzisa iirola ezichasene nokuqina kunye netafile yokusebenza—edityaniswe ne-ionizer—ukunciphisa umonakalo wokukhupha umbane. **Inkqubo Yokufudumeza:** Zombini itafile yokusebenza (ukuya kuthi ga kwi-100°C) kunye neeblade zokusika (ukuya kuthi ga kwi-150°C) ziyafudumala, ziphucula amandla okunamathela kwefilimu. **Ukusika Umphetho:** Ngokukodwa kwiiwafers eziyi-8-intshi, umsiki ojikelezayo unomsebenzi "we-V-groove no-cut" ukuqinisekisa ukuthembeka okufanelekileyo kokutywina. **Ukubeka ngokuchanekileyo:** Isebenzisa iiphini zepneumatic ukulungelelanisa iwafer, iqinisekisa ukuchaneka okuphezulu kokumisa. Iinkcukacha ezineenkcukacha

Ezi nkcukacha zilandelayo ziqokelelwe ngokusekelwe kwimithombo eyahlukeneyo:

Udidi lweParamitha | Iinkcukacha ezineenkcukacha

Uhlobo lweZixhobo | Umatshini wokuLamination ozenzekelayo, iBenchtop Wafer Pre-thinning

Ubungakanani beWafer obuSebenzayo | 4-intshi (100mm), 5-intshi (125mm), 6-intshi (150mm), 8-intshi (200mm)

Uluhlu Lobukhulu Bewafer | 300 ~ 750 microns (µm)

Iintlobo zeWafer ezihambelanayo | ISilicon, iGallium Arsenide (GaAs), okanye ezinye izinto; ixhasa iiwafers ezine-flat enye, ezine-double-flat, kunye ne-V-notch

Iintlobo zeFilimu ezihambelanayo | Ifilimu eluhlaza okwesibhakabhaka okanye ifilimu ye-UV (Ukuncamathisela ≤ 8N/20mm); Ububanzi befilimu: 120–240mm (khetha iimodeli ezixhasa ukuya kuthi ga kwi-340mm)

Umgaqo weLamination | I-lamination ye-roller echasene ne-static; uxinzelelo lwe-roller oluhlengahlengiswayo

Uqwalaselo lweChuck | I-chuck yoqhagamshelwano edibeneyo yeTeflon echasene ne-static ehlanganisiweyo (iinketho zeSilicone okanye zeCeramic ziyafumaneka); Ubushushu: Ubushushu begumbi ~ 100°C

Inkqubo yokusika | Isixhobo sokusika iringi esilungisekayo ngesandla + isixhobo sokusika esithe nkqo ngesandla; Ubushushu bentloko yokusika: Ubushushu begumbi ~ 150°C

Ulawulo oluchasene nokunganyakazi | I-wafer chuck egqunywe yiTeflon engashukumiyo, iirola ezichasene nokunganyakazi, i-ionizer ephelisa ukunganyakaziyo

Inkqubo yoLawulo | Inkqubo yolawulo esekwe kwi-PLC, exhotyiswe ngesikrini sokuchukumisa esiyi-5.7-intshi okanye esiyi-7-intshi

Ukhuseleko loKhuseleko | Ixhotyiswe ngeqhosha lokumisa ngexesha likaxakeka

Iimfuno zeZiko | Ubonelelo ngoMbane: I-AC yesigaba esinye 220V, 10A; Umoya ocinezelweyo: 5 kg/cm² umoya ococekileyo nowomileyo; Isantya sokuhamba: 100 L/min

Ubukhulu | 670mm (W) × 1180mm (D) × 1000mm (H)

Ubunzima beZixhobo | Malunga ne-140 kg

Isiphumo | ≥ iiwafer ezingama-80/ngeyure

Ixesha lokutshintsha imveliso | ≤ imizuzu emi-5

Iindawo eziphambili zokusetyenziswa

Njengekhonkco elibalulekileyo kumgca wokuvelisa ukupakisha we-semiconductor, i-STK-6020 isetyenziselwa ikakhulu:

Ukukhusela Umphezulu Ngaphambi Kokuncitshiswa Kwangasemva: Umsebenzi wayo oyintloko kukufaka ifilimu ekhuselayo kumphezulu we-wafer ngaphambi kokusila ngasemva (ukusila ngasemva) ukuthintela imikrwelo kunye nongcoliseko lweekhemikhali. I-Dicing Tape Lamination: Le nkqubo ingasetyenziselwa ukufaka i-dicing tape ngaphambi kokusikwa kwe-wafer, ngaloo ndlela ikhusele i-wafer kwaye iququzelele imisebenzi elandelayo yokusila.

Ukusetyenziswa Okuguquguqukayo: Ifanelekile kwiindidi ezahlukeneyo zezixhobo ze-semiconductor, ezigubungela amasimi abanzi afana neetships ze-logic, iitships zememori, ii-sensors ze-MEMS, nokunye.

**Izixhobo Zokubambisana**

Ngaphakathi komgca wokupakisha we-semiconductor, i-STK-6020 isebenza ngokudibeneyo nezinye izixhobo ezizenzekelayo ukwenza isisombululo esipheleleyo nesidibeneyo:

**Ukuhlanganiswa Okuphezulu (ngeZixhobo Zokususa Iiteyiphu):** Ngaphambi kokuba iinkqubo zokunciphisa okanye zokusika, kudla ngokuba yimfuneko ukususa ifilimu yokukhusela esetyenzisiweyo ngexesha lenyathelo lenkqubo elandulelayo. I-SINTAIKE inikezela ngothotho lweematshini zokususa iteyiphu ye-wafer ezizenzekelayo—ezifana ne-STK-520 kunye ne-STK-5020—ezinokuhlanganiswa ngokulula ne-tape laminator.

Iinkqubo Ezisezantsi Nezixhobo ZokuGcanga/Zokusika: Nje ukuba inkqubo yokugalela i-lamination igqityiwe, ii-wafers zidluliselwa kwi-grinder okanye kwi-dicing saw ukuze ziqhubeke nokusebenza.

Isishwankathelo

Ngokubanzi, i-SINTAIKE STK-6020 yinkqubo yokulamina i-wafer evuthiweyo, ethembekileyo, nengabizi kakhulu. Ngokusebenzisa indlela yayo yokusebenza elungelelanisiweyo, inika umgangatho ozinzileyo wokulamina kunye nokuguquguquka okuphezulu kwenkqubo, okwenza ukuba ifaneleke kakhulu kwimigca yovavanyo kunye neemeko ezibandakanya imveliso exutywe kakhulu, enomthamo omncinci. Kubathengi ababeka phambili iMbuyekezo yoTyalo-mali (ROI) kwaye befuna ukusebenzisa inkqubo yokulamina i-wafer ezinzileyo ngexabiso eliphantsi, i-STK-6020 imele ukhetho olufanelekileyo kakhulu ekufuneka luqwalaselwe.