SINTAIKE semiconductor wafer mounter STK-6020

The SINTAIKE STK-6020 is a compact, semi-automatic wafer pre-taping machine designed specifically for the wafer thinning process of 4- to 8-inch wafers. It offers an economical and reliable solution for adhesive film lamination.

**Working Principle**

The STK-6020 is based on anti-static roller lamination technology. Its core process consists of the following steps:

**Loading and Positioning:** The operator manually places the wafer onto the work table, where it is secured using universal alignment marks or pneumatic pins.

**Automatic Lamination:** The machine automatically dispenses the adhesive film, and an anti-static roller applies the film to the wafer surface with adjustable pressure, ensuring a flat, bubble-free finish.

**Precision Cutting:** The system utilizes both straight and circular cutters to precisely trim the film, preventing burrs and minimizing material waste.

**Unloading:** The operator retrieves the wafer—now covered with the protective film—to proceed to the next processing stage.

**Core Features and Advantages**

This machine features a focused design that provides a practical solution tailored to the specific needs of the user.

**Feature Category** | **Characteristics and Advantages**

**Exceptional Process Performance** | Achieves a wafer yield of ≥99.9%; guarantees bubble-free film lamination (excluding bubbles caused by trapped dust particles).

**Flexible Configuration & High Throughput** | Compatible with four mainstream wafer sizes: 4", 5", 6", and 8". Achieves a throughput of ≥80 wafers per hour, with an average product changeover time of no more than 5 minutes.

**Key Technical Expertise** | **Anti-static Treatment:** Employs anti-static rollers and a work table—integrated with an ionizer—to minimize electrostatic discharge damage. **Heating System:** Both the work table (up to 100°C) and the cutting blades (up to 150°C) are heatable, optimizing film adhesion strength. **Edge Cutting:** Specifically for 8-inch wafers, the circular cutter features a "V-groove no-cut" function to ensure proper sealing integrity. **Precision Positioning:** Utilizes pneumatic pins for wafer alignment, ensuring high positioning accuracy. Detailed Specifications

The following detailed specifications have been compiled based on various sources:

Parameter Category | Detailed Specifications

Equipment Type | Semi-automatic, Benchtop Wafer Pre-thinning Lamination Machine

Applicable Wafer Sizes | 4-inch (100mm), 5-inch (125mm), 6-inch (150mm), 8-inch (200mm)

Wafer Thickness Range | 300 ~ 750 microns (µm)

Compatible Wafer Types | Silicon, Gallium Arsenide (GaAs), or other materials; supports single-flat, double-flat, and V-notch wafers

Compatible Film Types | Blue film or UV film (Adhesion ≤ 8N/20mm); Film width: 120–240mm (select models support up to 340mm)

Lamination Principle | Anti-static roller lamination; adjustable roller pressure

Chuck Configuration | Universal integrated Teflon anti-static coated contact chuck (Silicone or Ceramic options available); Temperature: Room Temp ~ 100°C

Cutting System | Manually adjustable ring cutter + Manual straight cutter; Cutter head temperature: Room Temp ~ 150°C

Anti-static Control | Anti-static Teflon-coated wafer chuck, anti-static rollers, static-eliminating ionizer

Control System | PLC-based control system, equipped with a 5.7-inch or 7-inch touchscreen

Safety Protection | Equipped with an emergency stop button

Facility Requirements | Power Supply: Single-phase AC 220V, 10A; Compressed Air: 5 kg/cm² clean, dry air; Flow rate: 100 L/min

Dimensions | 670mm (W) × 1180mm (D) × 1000mm (H)

Equipment Net Weight | Approx. 140 kg

Throughput | ≥ 80 wafers/hour

Product Changeover Time | ≤ 5 minutes

Key Application Areas

As a critical link in the semiconductor packaging production line, the STK-6020 is primarily used for:

Surface Protection Prior to Backside Thinning: Its primary function is to apply a protective film to the wafer surface before backside grinding (back-grinding) to prevent scratches and chemical contamination. Dicing Tape Lamination: The system can also be used to apply dicing tape prior to wafer cutting, thereby securing the wafer and facilitating subsequent dicing operations.

Versatile Application: Suitable for a wide range of semiconductor devices, covering broad fields such as logic chips, memory chips, MEMS sensors, and more.

**Collaborative Equipment**

Within a semiconductor packaging line, the STK-6020 typically operates in conjunction with other automated equipment to form a complete, integrated solution:

**Upstream Integration (with Tape Removal Equipment):** Prior to thinning or dicing processes, it is often necessary to first remove the protective film applied during the preceding process step. SINTAIKE offers a series of semi-automatic wafer tape removal machines—such as the STK-520 and STK-5020—which can be seamlessly paired with the tape laminator.

Downstream Processes and Grinding/Cutting Equipment: Once the lamination process is complete, the wafers are transferred to a grinder or dicing saw for subsequent processing.

Summary

Overall, the SINTAIKE STK-6020 is a mature, reliable, and cost-effective semi-automatic wafer lamination system. Through its streamlined semi-automatic operation mode, it delivers stable lamination quality and high process flexibility, making it particularly well-suited for pilot lines and scenarios involving high-mix, low-volume production. For customers prioritizing Return on Investment (ROI) and seeking to implement a stable wafer lamination process at a lower cost, the STK-6020 represents a highly worthy option to consider.